Patents by Inventor Cary B. Powell

Cary B. Powell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing electronic components
    Patent number: 6436300
    Abstract: A method of manufacturing electronic components includes disposing a top metal layer (502) comprised of solder over a bottom metal layer (201, 202) comprised of titanium or tungsten, and selectively etching the bottom metal layer (201, 202) over the top metal layer (502) with an etchant mixture (601) comprised of an etchant, an additive to control the temperature of the etchant mixture (601), and another additive to reduce the redeposition of the top layer (502).
    Type: Grant
    Filed: July 30, 1998
    Date of Patent: August 20, 2002
    Assignee: Motorola, Inc.
    Inventors: Eric J. Woolsey, Douglas G. Mitchell, George F. Carney, Francis J. Carney, Jr., Cary B. Powell
  • Method of manufacturing electronic components
    Patent number: 6413878
    Abstract: A method of manufacturing electronic components includes disposing a top metal layer (502) comprised of solder over a bottom metal layer (201, 202) comprised of titanium or tungsten, and selectively etching the bottom metal layer (201, 202) over the top metal layer (502) with an etchant mixture (601) comprised of an etchant, an additive to control the temperature of the etchant mixture (601), and another additive to reduce the redeposition of the top layer (502).
    Type: Grant
    Filed: April 10, 2000
    Date of Patent: July 2, 2002
    Assignee: Motorola, Inc.
    Inventors: Eric J. Woolsey, Douglas G. Mitchell, George F. Carney, Francis J. Carney, Jr., Cary B. Powell
  • METHOD OF MANUFACTURING ELECTRONIC COMPONENTS
    Publication number: 20010008224
    Abstract: A method of manufacturing electronic components includes disposing a top metal layer (502) comprised of solder over a bottom metal layer (201, 202) comprised of titanium or tungsten, and selectively etching the bottom metal layer (201, 202) over the top metal layer (502) with an etchant mixture (601) comprised of an etchant, an additive to control the temperature of the etchant mixture (601), and another additive to reduce the redeposition of the top layer (502).
    Type: Application
    Filed: July 30, 1998
    Publication date: July 19, 2001
    Inventors: ERIC J. WOOLSEY, DOUGLAS G. MITCHELL, GEORGE F. CARNEY, FRANCIS J. CARNEY, CARY B. POWELL
  • Method for plating tab leads in an assembled semiconductor package
    Patent number: 5075258
    Abstract: A method for improving the bonding characteristics of TAB semiconductor packages to circuit boards is achieved by plating additional amounts of tin on the TAB semiconductor package leads after final package assembly is complete. Residues from the plating step are removed from the package assembly to prevent contamination. Stresses that were developed in the plated material during the plating step are removed by heating the leads.
    Type: Grant
    Filed: July 31, 1990
    Date of Patent: December 24, 1991
    Assignee: Motorola, Inc.
    Inventors: Francis J. Carney, Cary B. Powell, George F. Carney, Marion I. Simmons