Patents by Inventor Cary Chia-Chung Lo

Cary Chia-Chung Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer supporting structure and method for forming the same
    Patent number: 10190235
    Abstract: A method for forming a wafer supporting structure comprises growing a single crystal using a floating zone crystal growth process, forming a silicon ingot having an oxygen concentration equal to or less than 1 parts-per-million-atomic (ppma), slicing a wafer from the silicon ingot, cutting portions of the wafer to form a supporting structure through a mechanical lathe and applying a high temperature anneal process to the supporting structure.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: January 29, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: An-Li Ho, Chi-En Huang, Yi Jia Chen, Pu-Fang Chen, Cary Chia-Chung Lo
  • Wafer Supporting Structure and Method for Forming the Same
    Publication number: 20140349466
    Abstract: A method for forming a wafer supporting structure comprises growing a single crystal using a floating zone crystal growth process, forming a silicon ingot having an oxygen concentration equal to or less than 1 parts-per-million-atomic (ppma), slicing a wafer from the silicon ingot, cutting portions of the wafer to form a supporting structure through a mechanical lathe and applying a high temperature anneal process to the supporting structure.
    Type: Application
    Filed: May 24, 2013
    Publication date: November 27, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: An-Li Ho, Chi-En Huang, Yi Jia Chen, Pu-Fang Chen, Cary Chia-Chung Lo