Abstract: An electronic module housing having a rounded stylized dog-bone-type shape and an equatorial partial light bar. The shape provides a view of parts of the light bar from many locations. The controller circuitry can detect a malfunction among one or more of a plurality of current-drawing components by detecting that the total cumulative current drawing by all the components falls outside a predetermined nominal range.

Abstract: An electronic module housing having a rounded stylized dog-bone-type shape and an equatorial partial light bar. The shape provides a view of parts of the light bar from many locations. The controller circuitry can detect a malfunction among one or more of a plurality of current-drawing components by detecting that the total cumulative current drawing by all the components falls outside a predetermined nominal range.

Abstract: An electronic module housing having a rounded stylized dog-bone-type shape and an equatorial partial light bar. The shape provides a view of parts of the light bar from many locations. The controller circuitry can detect a malfunction among one or more of a plurality of current-drawing components by detecting that the total cumulative current drawing by all the components falls outside a predetermined nominal range.

Abstract: A semi-flexible laminar silicone foam rubber-base heater for high temperature gas supply and exhaust lines used in microelectronic semiconductor fabrication uses superimposed adhesively bonded layers of an etched foil heater element containing layer, a high-to-low heat thermal transition layer, a thermal fuse laden silicone foam rubber insulation layer and a durable wrapping layer. The system can provide for the combined use of highly controllable etched foil heater elements, clean silicone foam rubber insulation, and inexpensive mechanical thermal fuses safely in a high heat gas supply and exhaust line environment.

Abstract: A multi-layer aluminum nitride ceramic, multi-heating element substrate (11) is provided for forming electrical bonds between integrated circuits (13) and an interposer structure (14) using a thermocompression bonding process. The individually energizable heater element traces (9) can be run through common regions of the heater surface platform (5). A network of cooling vias can be run through other parts of the substrate. The traces are then separately controlled and energized during a predetermined routine resulting in a temperature profile that maintains a substantially constant temperature plateau phase near a reflow temperature, and a more uniform temperature across the spaced apart surface regions of the heater substrate, thus imparting a more precisely uniform heating to the parts being bonded.

Abstract: A monolithic, substantially hermetic joining or bonding of two or more aluminum nitride (“AlN”) ceramic components is made by promoting transient liquid phase sintering near the contact areas between the components. In a first approach, AlN particles are combined with a rare earth oxide sintering additive such as yttrium oxide (Y2O3) in a joining paste can be applied between the joining surfaces of fired ceramic preformed components prior to final firing to weld the components together. In a second approach, the additive is added to green mixture, and the components having different shrinkage aspect ratios are mated and cofired in an atmosphere containing a partial pressure of the additive. The additive encourages wetting and diffusion of the liquid phases present on the surfaces of ceramic interface particles in the contact areas during final firing.

Abstract: A multi-layer aluminum nitride ceramic, multi-heating element substrate is provided for forming electrical bonds between integrated circuits and an interposer structure using a thermocompression bonding process. The individually energizable heater element traces can be run through common regions of the heater surface platform. A network of cooling vias can be run through other parts of the substrate. The traces are then separately controlled and energized during a predetermined routine resulting in a temperature profile that maintains a substantially constant temperature plateau phase near a reflow temperature, and a more uniform temperature across the spaced apart surface regions of the heater substrate, thus imparting a more precisely uniform heating to the parts being bonded.

Abstract: A semi-flexible laminar silicone foam rubber-base heater for high temperature gas supply and exhaust lines used in microelectronic semiconductor fabrication uses superimposed adhesively bonded layers of an etched foil heater element containing layer, a high-to-low heat thermal transition layer, a thermal fuse laden silicone foam rubber insulation layer and a durable wrapping layer. The system can provide for the combined use of highly controllable etched foil heater elements, clean silicone foam rubber insulation, and inexpensive mechanical thermal fuses safely in a high heat gas supply and exhaust line environment.