Abstract: Disclosed herein are examples of a photolithography machine with fast alignment. The machine may include a stage to hold and move a substrate and a projection system to project images on a plurality of exposure regions of the substrate. The machine may also include an alignment system positioned adjacent to the projection system.

Abstract: Embodiments of a photolithographic machine with two or more camera systems (i.e., projection lens systems) are described herein. The photolithographic machine may include two or more cameras independently operated and controlled for exposing integrated circuit, flat panel display, and other substrates used in manufacturing semiconductor electronics. The cameras may be independently controlled to move laterally in the x-axis (i.e., not fixed). The independent control can include movement, focusing, tilt, reticle position, among other things.

Abstract: A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.

Abstract: An improved stage for the processing of large, thin substrates, such as glass and semiconductor panels. Processing includes lithography, inspection, metrology, grinding, and the like. The stage includes a chuck that moves over a base relative to a device for processing a substrate. The chuck conforms to a geometry of the base while moving relative to the base.

Abstract: A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.

Abstract: A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.

Abstract: An improved stage for the processing of large, thin substrates, such as glass and semiconductor panels. Processing includes lithography, inspection, metrology, grinding, and the like. The stage includes a chuck that moves over a base relative to a device for processing a substrate. The chuck conforms to a geometry of the base while moving relative to the base.

Abstract: A stepper (100) for lithographic processing of semiconductor substrates includes abase (102), a chuck (104) that moves only along an X axis of a coordinate system, a bridge (114) mounted over the base and the chuck, and at least one projection camera (112) mounted on the bridge. The at least one projection camera is movable along a Y axis of the coordinate system. The combined range of travel of the chuck along the X axis and the at least one projection camera along the Y axis is sufficient to address a field of view of the at least one projection camera to substantially an entire substrate (106) mounted on the chuck.

Abstract: A mechanism for localizing a substrate relative to a projection camera or other apparatus over large travel distances is described. The mechanism includes one or more trucks that move with the stage in a primary direction and remain stationary when the stage moves in an ancillary direction. The position of the trucks, together with relative distances between the truck(s) and a stage on which the substrate is supported facilitates alignment.

Abstract: A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.

Abstract: A planar motor system comprises a platen with a first planar motor component and a stage with a second planar motor component. The stage can move along a first cardinal axis or a second cardinal axis. The planar motor system further comprises a drive system. When the drive system is energized in a first drive configuration, it applies a first force and a second force. The first force and the second force are not parallel to any cardinal axis. A vector sum of the first force and the second force is parallel to the first cardinal axis. When the drive system is energized in a second drive configuration, it applies a third force and a fourth force. The third force and the fourth force are not parallel to any cardinal axis. A vector sum of the third force and the fourth force is parallel to the second cardinal axis.

Abstract: A planar motor system comprises a platen with a first planar motor component and a stage with a second planar motor component. The stage can move along a first cardinal axis or a second cardinal axis. The planar motor system further comprises a drive system. When the drive system is energized in a first drive configuration, it applies a first force and a second force. The first force and the second force are not parallel to any cardinal axis. A vector sum of the first force and the second force is parallel to the first cardinal axis. When the drive system is energized in a second drive configuration, it applies a third force and a fourth force. The third force and the fourth force are not parallel to any cardinal axis. A vector sum of the third force and the fourth force is parallel to the second cardinal axis.

Abstract: An apparatus (1100) for protecting at least a portion of a peripheral region of a photoresist-coated surface of a substrate from light exposure. The apparatus includes two or more movable blades (1102) and a drive assembly (1112, 1114) operably coupled to the movable blades. In response to at least one first drive force generated by the drive assembly, the movable blades translate such that the movable blades are disposed above at least a portion of the peripheral region. In response to at least one second drive force generated by the drive assembly, the movable blades translate such that the movable blades are not disposed above a portion of the peripheral region.

Abstract: An apparatus protects a portion of a peripheral region (310) of a photoresist-coated surface of a substrate (308) from light exposure. The apparatus includes a blade (502, 512, 522, 532) that can move, or that can move and rotate, and a drive assembly (504, 514, 524, 534) operably coupled to the blade. In response to at least one first drive force generated by the drive assembly, the blade translates, rotates, or translates and rotates, such that the blade is disposed above a portion of the peripheral region. In response to at least one second drive force generated by the drive assembly, the blade translates, rotates, or rotates and translates, such that the blade is not disposed above a portion of the peripheral region. In a step-and-repeat lithographic system, the blade covers a portion of the peripheral region, and the adjacent portion of the substrate is exposed to light.

Abstract: Projection systems and methods with mechanically decoupled metrology plates according to embodiments of the present invention can be used to characterize and compensate for misalignment and aberration in production images due to thermal and mechanical effects. Sensors on the metrology plate measure the position of the metrology plate relative to the image and to the substrate during exposure of the substrate to the production image. Data from the sensors are used to adjust the projection optics and/or substrate dynamically to correct or compensate for alignment errors and aberration-induced errors. Compared to prior art systems and methods, the projection systems and methods described herein offer greater design flexibility and relaxed constraints on mechanical stability and thermally induced expansion. In addition, decoupled metrology plates can be used to align two or more objectives simultaneously and independently.

Abstract: Projection systems and methods with mechanically decoupled metrology plates according to embodiments of the present invention can be used to characterize and compensate for misalignment and aberration in production images due to thermal and mechanical effects. Sensors on the metrology plate measure the position of the metrology plate relative to the image and to the substrate during exposure of the substrate to the production image. Data from the sensors are used to adjust the projection optics and/or substrate dynamically to correct or compensate for alignment errors and aberration-induced errors. Compared to prior art systems and methods, the projection systems and methods described herein offer greater design flexibility and relaxed constraints on mechanical stability and thermally induced expansion. In addition, decoupled metrology plates can be used to align two or more objectives simultaneously and independently.

Abstract: Projection systems and methods with mechanically decoupled metrology plates according to embodiments of the present invention can be used to characterize and compensate for misalignment and aberration in production images due to thermal and mechanical effects. Sensors on the metrology plate measure the position of the metrology plate relative to the image and to the substrate during exposure of the substrate to the production image. Data from the sensors are used to adjust the projection optics and/or substrate dynamically to correct or compensate for alignment errors and aberration-induced errors. Compared to prior art systems and methods, the projection systems and methods described herein offer greater design flexibility and relaxed constraints on mechanical stability and thermally induced expansion. In addition, decoupled metrology plates can be used to align two or more objectives simultaneously and independently.

Abstract: Projection systems and methods with mechanically decoupled metrology plates according to embodiments of the present invention can be used to characterize and compensate for misalignment and aberration in production images due to thermal and mechanical effects. Sensors on the metrology plate measure the position of the metrology plate relative to the image and to the substrate during exposure of the substrate to the production image. Data from the sensors are used to adjust the projection optics and/or substrate dynamically to correct or compensate for alignment errors and aberration-induced errors. Compared to prior art systems and methods, the projection systems and methods described herein offer greater design flexibility and relaxed constraints on mechanical stability and thermally induced expansion. In addition, decoupled metrology plates can be used to align two or more objectives simultaneously and independently.

Abstract: Methods and apparatus for truncating an image formed with coherent radiation. The optical relay system is adapted to form a line image at the image plane. The image is truncated by a variable aperture at or near the aperture plane conjugate to the image plane, to block progressively increasing portions of an incident coherent radiation beam used to form the line image. An apodizing pupil filter having a maximum transmission or reflection in the center and a transmission or reflection profile that varies with direction corresponding to long direction of the line image is provided in the pupil plane. The apodization is designed to prevent hot-spots from forming in the truncated image and ensures a relatively smooth, flat intensity profile. Thus, one end or another of a coherent line image scanned over a substrate can be truncated during scanning without substantially changing the image intensity extending into the product area.

Abstract: Methods and apparatus for truncating an image formed with coherent radiation. The optical relay system is adapted to form a line image at the image plane. The image is truncated by a variable aperture at or near the aperture plane conjugate to the image plane, to block progressively increasing portions of an incident coherent radiation beam used to form the line image. An apodizing pupil filter having a maximum transmission or reflection in the center and a transmission or reflection profile that varies with direction corresponding to long direction of the line image is provided in the pupil plane. The apodization is designed to prevent hot-spots from forming in the truncated image and ensures a relatively smooth, flat intensity profile. Thus, one end or another of a coherent line image scanned over a substrate can be truncated during scanning without substantially changing the image intensity extending into the product area.