Patents by Inventor Casey J. Feinstein

Casey J. Feinstein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120009703
    Abstract: A method of fabricating a display panel from a thin substrate using a carrier substrate is disclosed. The method includes depositing a bonding agent on a first surface of the thin substrate; depositing a bonding agent on a second surface of the carrier substrate; bonding the thin substrate and the carrier substrate with the bonding agent deposited on the first surface and the second surface; performing thin film processing on a third surface of the thin substrate opposite the first surface; and separating the processed thin substrate from the carrier substrate. The thin substrate has a thickness less than a required thickness for sustaining thin film processing while a thickness of the bonded thin substrate and the carrier substrates is greater than or equal to that the required thickness.
    Type: Application
    Filed: September 15, 2011
    Publication date: January 12, 2012
    Inventors: Casey J. FEINSTEIN, John Z. Zhong, Lynn R. Youngs, Stephen S. Poon
  • Publication number: 20110151202
    Abstract: Controllable placement of a liquid adhesive on a substrate to confine the adhesive to a desired area of the substrate is disclosed. A controllable placement method can include dispensing a liquid adhesive into a designated area on a surface of a substrate, controllably confining the dispensed liquid adhesive to the designated area, and curing the confined liquid adhesive. The dispensed liquid adhesive can be controllably confined using various techniques, such as electrical repulsion, electrical attraction, capacitance, electrowetting, light curing, adhesive attracting-repulsing coatings, and substrate topography. A substrate having a controllably placed liquid adhesive thereon can be incorporated into electronic devices, such as a mobile telephone, a digital media player, or a personal computer.
    Type: Application
    Filed: December 18, 2009
    Publication date: June 23, 2011
    Inventors: Casey J. FEINSTEIN, Kuo-Hua Sung, John Z. Zhong
  • Publication number: 20110005820
    Abstract: Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.
    Type: Application
    Filed: September 17, 2010
    Publication date: January 13, 2011
    Inventors: Casey J. Feinstein, John Z. Zhong
  • Patent number: 7810355
    Abstract: Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: October 12, 2010
    Assignee: Apple Inc.
    Inventors: Casey J. Feinstein, John Z. Zhong
  • Publication number: 20100154992
    Abstract: Delamination of a laminated multilayer stack is provided by generating a layer-specific energy distribution in the stack during delamination. A localized energy transferrer can generate localized heating, cooling heating, cooling, or other form of energy absorption or transmission, in a bonding layer of a multilayer stack. Localized energy transfer can include thermal energy transfer, such as heating and/or cooling, acoustic energy transfer, such as applying ultrasonic energy, electromagnetic energy transfer, such as applying laser light, directed microwaves, etc. Localized energy transfer can generate a layer-specific energy distribution that can weaken the bonding layer while reducing damage to other layers of the stack.
    Type: Application
    Filed: March 20, 2009
    Publication date: June 24, 2010
    Inventors: Casey J. Feinstein, Silvio Grespan, Kuo-Hua Sung, John Z. Zhong, Lynn Youngs
  • Publication number: 20090324899
    Abstract: Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.
    Type: Application
    Filed: June 30, 2008
    Publication date: December 31, 2009
    Inventors: Casey J. Feinstein, John Z. Zhong
  • Publication number: 20090324939
    Abstract: Fabrication of thin sheets of glass or other substrate material for use in devices such as touch sensor panels is disclosed. A pair of thick glass sheets, typically with thicknesses of 0.5 mm or greater each, may each be patterned with thin film on a surface, sealed together to form a sandwich with the patterned surfaces facing each other and spaced apart by removable spacers, either or both thinned on their outside surfaces to thicknesses of less than 0.5 mm each, and separated into two thin glass sheets. A single thick glass sheet, typically with a thickness of 0.5 mm or greater, may be patterned, covered with a protective layer over the pattern, thinned on its outside surface to a thickness of less than 0.5 mm, and the protective layer removed. This thinness of less than 0.5 mm may be accomplished using standard LCD equipment, despite the equipment having a sheet minimum thickness requirement of 0.5 mm.
    Type: Application
    Filed: June 27, 2008
    Publication date: December 31, 2009
    Inventors: Casey J. Feinstein, John Z. Zhong, Steve Porter Hotelling, Shih Chang Chang