Abstract: A high power, high current Unidirectional Transient Voltage Suppressor, formed on SiC starting material is disclosed. The device is structured to avalanche uniformly across the entire central part (active area) such that very high currents can flow while the device is reversely biased. Forcing the device to avalanche uniformly across designated areas is achieved in different ways but consistently in concept, by creating high electric fields where the device is supposed to avalanche (namely the active area) and by relaxing the electric field across the edge of the structure (namely in the termination), which in all embodiments meets the conditions for an increased reliability under harsh environments.

Abstract: A high power, high current Unidirectional Transient Voltage Suppressor, formed on SiC starting material is disclosed. The device is structured to avalanche uniformly across the entire central part (active area) such that very high currents can flow while the device is reversely biased. Forcing the device to avalanche uniformly across designated areas is achieved in different ways but consistently in concept, by creating high electric fields where the device is supposed to avalanche (namely the to active area) and by relaxing the electric field across the edge of the structure (namely in the termination), which in all embodiments meets the conditions for an increased reliability under harsh environments.

Abstract: A system can include a semiconductor die having a first side and a second side opposite the first side. The system can also include a first slug coupled to a portion of the first side of the die. The system can further include a second slug coupled to a portion of the second side of the die. The system can additionally include an insulating material voidlessly encapsulating the die. The first slug can include a first portion having a first width in proximity to the die and a second portion having a second width. The first portion can be closer than the second portion to the die and the first width can be smaller than the second width.

Abstract: A system can include a semiconductor die having a first side and a second side opposite the first side. The system can also include a first slug coupled to a portion of the first side of the die. The system can further include a second slug coupled to a portion of the second side of the die. The system can additionally include an insulating material voidlessly encapsulating the die. The first slug can include a first portion having a first width in proximity to the die and a second portion having a second width. The first portion can be closer than the second portion to the die and the first width can be smaller than the second width.

Abstract: A device for protecting I/O lines using low capacitance steering diodes (1200) and PIN or NIP diodes (1202), (1203) is disclosed. A low capacitance diode arrangement configured as steering diodes protect a signal line or input/output (I/O) port (1201) from high voltage transients by diverting or directing the transient to either the positive side of the power supply line (1204) or to ground (1205).

Abstract: A bi-directional low capacitance TVS using a PIN or NIP diode is disclosed. Bi-directional low capacitance TVS protection circuit (1000) consists of two pairs of TVS diodes (1001), (1003) and LC PIN or NIP diodes (1002), (1004). Diodes (1003) and (1004) are in parallel and in opposite direction from a first series of TVS and LC diode pair. This circuit provides transient protection in both directions for a bi-directional low capacitance TVS.

Abstract: A device for protecting I/O lines using PIN or NIP low capacitance transient voltage suppressors and steering diodes are disclosed. In an exemplary embodiment, a two (2) terminal device with a unidirectional low capacitance TVS diode (1101) and an anti-parallel LC PIN or NIP diode (1102) is disclosed. To provide for a low capacitance TVS with a forward conducting low-voltage characteristic, the LC PIN or NIP diode is placed anti-parallel to the unidirectional low capacitance TVS. This LC PIN or NIP diode must also have a reverse blocking voltage greater than the avalanche breakdown p-n junction voltage (V(BR)) of the unidirectional TVS.

Abstract: Unidirectional and bi-directional low capacitance transient voltage suppressors (“TVS”) and steering diodes are disclosed. In one embodiment, the TVS comprise TVS p-n junction diode element(s), (101) low-capacitance (“LC”) PIN or NIP diode element(s) (102), the TVS p-n junction diode element(s) (101) being placed in series with and in opposite polarity to the LC PIN or NIP diodes (102). In another embodiment, the steering diode comprise only LC PIN or NIP diode(s) (402, 403) arranged as steering diodes.