Patents by Inventor Cesar Luis Coelho Morais De Serpa Rosa

Cesar Luis Coelho Morais De Serpa Rosa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230364921
    Abstract: The present disclosure refers to monitoring a printing fluid, in an example, a device is disclosed wherein the device N comprises a light emitter to illuminate a fluid line comprising a flowing printing fluid; an image sensor to capture a diagnostic image of the fluid line once it has been illuminated; and a processor connected to the detector being the processor to compare the diagnostic image to a baseline and to determine a printing fluid quality parameter based on the comparison.
    Type: Application
    Filed: September 30, 2020
    Publication date: November 16, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Cesar Luis COELHO MORAIS DE SERPA ROSA, Marc CLOTET MARTI, Alberto BORREGO LEBRATO
  • Patent number: 11815125
    Abstract: An example retaining device includes a retaining feature to retain an article, and a first arm. The first arm projects in a first direction and includes a first protrusion extending away from a first face of the first arm. The first protrusion is to engage another article to retain the retaining device relative to the other article. The first arm includes a second protrusion spaced apart from the first protrusion and extending away from the first face of the first arm. The width of the second protrusion increases in the first direction so as to provide a sloped surface.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: November 14, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alberto Borrego Lebrato, Marc Clotet Marti, Cesar Luis Coelho Morais de Serpa Rosa
  • Publication number: 20230048927
    Abstract: Certain examples described herein relate to liquid waste containers delimiting an opening for receiving liquid. The liquid waste container comprises a receptacle for liquid waste and a bistable arrangement having first and second stable states such that when the bistable arrangement is in the first stable state, liquid can be received into the receptacle through the opening, and when the bistable arrangement is in the second stable state, liquid is prevented from exiting the receptacle through the opening. The example liquid waste container further comprises an actuator arranged to engage the bistable arrangement and to cause the bistable arrangement to transition from the first stable state to the second stable state.
    Type: Application
    Filed: January 30, 2020
    Publication date: February 16, 2023
    Inventors: Cesar Luis Coelho Morais de Serpa Rosa, Marc Clotet Marti, Alberto Borrego Lebrato
  • Publication number: 20220082118
    Abstract: An example retaining device comprises a retaining feature to retain an article, and a first arm. The first arm projects in a first direction and comprises a first protrusion extending away from a first face of the first arm. The first protrusion is to engage another article to retain the retaining device relative to the other article. The first arm comprises a second protrusion spaced apart from the first protrusion and extending away from the first face of the first arm. The width of the second protrusion increases in the first direction so as to provide a sloped surface.
    Type: Application
    Filed: April 8, 2019
    Publication date: March 17, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Alberto Borrego Lebrato, Marc Clotet Marti, Cesar Luis Coelho Morais de Serpa Rosa
  • Publication number: 20210051825
    Abstract: In an example there is provided a method for electro-magnetically shielding a circuit board assembly. The method comprises depositing a solder material at multiple locations on a substrate, heating the solder material according to a predetermined thermal profile and coupling an enclosure to the substrate at the locations to provide an electromagnetic shielding for components attached to the substrate. The locations are arranged on the substrate such that a size of a largest aperture of the circuit board assembly is below a pre-determined threshold size value.
    Type: Application
    Filed: June 15, 2018
    Publication date: February 18, 2021
    Inventors: Xavier Gomez Travesset, Marc Clotet Marti, Cesar Luis Coelho Morais De Serpa Rosa