Patents by Inventor Chad Buss

Chad Buss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS SENSOR WITH INTEGRATED ASIC PACKAGING
    Publication number: 20110227173
    Abstract: A sensor assembly comprises an integrated circuit (IC) substrate having an upper surface and operating circuitry, and a micro-electro-mechanical systems (MEMS) sensor die attached to the upper surface of the IC substrate in a stacked configuration. The MEMS sensor die in operative communication with the operating circuitry of the IC substrate. A seal ring surrounds an outer periphery of the upper surface of the IC substrate, and a seal cap is secured to the seal ring over the MEMS sensor die.
    Type: Application
    Filed: August 2, 2010
    Publication date: September 22, 2011
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Bryan R. Seppala, Jon B. DCamp, Harlan L. Curtis, Chad Buss