Abstract: A photonic integrated circuit (PIC)-based imager blade includes a number of PIC imager units stacked on top of one another. Each PIC imager unit includes a PIC coupled, at a first end and a second end, to a first set of lenslets and a second set of lenslets, respectively. An electronic integrated circuit (EIC) is coupled to the PIC. Pairs of lenslets of the first and second set of lenslets are optically coupled to respective waveguides embedded in the PIC. The PIC imager units have different lengths, and longer PIC imager units include larger lenslets.

Abstract: A dual-lenslet array photonic integrated circuit (PIC) imager includes a PIC and top and bottom substrate spacers. A first optical prism couples a first lenslet array to a first-side edge of the PIC. A second optical prism couples a second lenslet array to a second-side edge of the PIC. Lenslets of the first lenslet array and respective lenslets of the second lenslet array are coupled to respective waveguides embedded in the in the PIC.

Abstract: A photonic integrated circuit (PIC) imager includes a substrate, and a number of PIC imager units disposed in an arbitrary configuration on the substrate. Each PIC imager unit includes a PIC coupled to an optical connector, and a number of lenslets configured as a linear lenslet array and optically coupled to an edge of the PIC. Pairs of lenslets of the linear lenslet array are optically coupled to respective waveguides embedded in the PIC.

Abstract: A modular assembly for an imaging system can allow precision alignment to occur in isolated manufacturing stages, with the separate components being assembled together in later stages. An exemplary system includes a support structure, multiple imaging modules exchangeably coupled to the support structure and each including lenslets and a photonic integrated circuit (PIC) device arranged to receive light from the lenslets, multiple fiber arrays each connected to corresponding one of the multiple imaging modules, and a camera system connected to the fiber arrays. The lenslets the PIC device can be integrally coupled prior to assembly with the support structure, so that precise alignment of the lenslets with respect to the PIC device is performed in isolation.

Abstract: A method of manufacturing a monolithic array of lenslets that inject light into waveguides without the need for alignment of a separate lenslet array and waveguide array is provided. The waveguide array may be incorporated as a monolithic or fused piece with the substrate on which the lenslet array is to be written. A method of producing a flat, thin monolithic collimator array having a form corresponding to that of a PIC, with the input/output lenslet array located on the top surface of the collimator array is provided. A method for bonding a two-dimensional (2-D) array of lenslets on top of a photonic integrated circuit (PIC) substrate with a small gap for thermal expansion between lenslet blocks is provided.