Abstract: Systems and methods for covering a trough member. A system can include a hinge clip coupled to a sidewall of the trough member and creating a socket. The system can include a cover including a pivot member that is received in the socket to allow the cover to pivot from open to closed positions. A capture clip including a ramp portion and a seat can be coupled to the other sidewall, and a portion of the cover can ride along the ramp and drop into the seat as the cover is pivoted from open to closed positions. The hinge clip can include structures to limit rotation of the cover and to capture portions of the cover. The cover can include a capture member having an elbow to be received in the seat of the capture clip when the cover is in the closed position.

Abstract: Systems and methods for covering a trough member. A system can include a hinge clip coupled to a sidewall of the trough member and having arms creating a socket. The system can include a cover including a pivot member and a groove at one end. The pivot member can be received in the socket to allow the cover to pivot about the pivot member from open to closed positions, and one arm of the socket can be received in the groove in the open position. A capture clip including a ramp portion and a seat can be coupled to the other sidewall, and another pivot member at the other end of the cover can ride along the ramp and drop into the seat as the cover is pivoted from open to closed positions. The cover can also be two cover portions, each extending partially over the trough member and creating a slot therebetween.

Abstract: An electronics enclosure is provided. The enclosure includes a modular card cage adapted to receive one or more electronic circuit cards and a heat sink adapted to protrude through an opening of an enclosure and couple to the modular card cage. The modular card cage and the heat sink provide an isolated heat transfer path for heat, produced by each of the one or more electronic circuit cards, to be removed from the enclosure.

Abstract: An electronics enclosure is provided. The enclosure includes a modular card cage adapted to receive one or more electronic circuit cards and a heat sink adapted to protrude through an opening of an enclosure and couple to the modular card cage. The modular card cage and the heat sink provide an isolated heat transfer path for heat, produced by each of the one or more electronic circuit cards, to be removed from the enclosure.