Abstract: A structure and process for packaging RF MEMS and other devices employs a substrate of silicon, for example, and a cap of glass, for example, having cavities to receive the devices. MEMS or other devices are supported on an upper surface of the substrate, into which metal-filled blind vias are formed. The cap is attached to the substrate, so as to enclose designated MEMS or other devices in the cavities. The substrate is then thinned so as to expose the metal of the vias at a lower surface of the substrate. Electrical connecting elements such as solder balls are then applied to the metal of the vias. The resultant composite substrate is then divided to provide individual packaged devices.

Abstract: A targeting and tracking apparatus and method for optical transceivers is disclosed. The tracking function is performed internally by way of translating an internal optical fiber in the focal plane of the transceiver telescope using miniature motorized translation systems and/or micro-electro-mechanical systems (MEMS). The optical design of the transceiver provides a wide field of view and a pointing and tracking field of regard that is directly proportional to the translation of the optical fiber in the focal plane of the telescope. The apparatus and method can eliminate the need for external gimballing systems and scanning mirrors, and replace the gimballed optical beam steering function with motorized translation systems and/or MEMS that consumes very little power.

Abstract: A MEMS-based optical steering apparatus for free space optical transmitters, receivers, and transceivers is disclosed. The MEMS device comprises actuators linked to an optic fiber, the actuators operable to maneuver the optical fiber in the X-Y plane at the focal point of the transmitter, receiver, or transceiver. The MEMS device may thus be used to replace gimbals for beam steering applications.

Abstract: A beam steering apparatus and method for free space optical transceivers is disclosed. The beam steering function is performed internally by way of translating an internal optical fiber in the focal plane of the transceiver telescope using miniature micro-electro-mechanical systems (MEMS). The optical design of the transceiver provides a wide field of view and a pointing and tracking field of regard that is directly proportional to the translation of the optical fiber in the focal plane of the telescope. The apparatus and method can eliminate the need for external gimballing systems, and replace the gimballed free space optical beam steering function with MEMS that consumes very little power.

Abstract: A structure and process for packaging RF MEMS and other devices employs a substrate of silicon, for example, and a cap of glass, for example, having cavities to receive the devices. MEMS or other devices are supported on an upper surface of the substrate, into which metal-filled blind vias are formed. The cap is attached to the substrate, so as to enclose designated MEMS or other devices in the cavities. The substrate is then thinned so as to expose the metal of the vias at a lower surface of the substrate. Electrical connecting elements such as solder balls are then applied to the metal of the vias. The resultant composite substrate is then divided to provide individual packaged devices.

Abstract: A microscale device provides for a nanoscale machining. A tool, similar to probes used in atomic force microscopy is attached to a micro-load gear and is powered by a micromotor. This very small tool allows a variety of nanostructures to be fabricated on a variety of substrates.

Abstract: A structure and process for packaging RF MEMS and other devices employs a substrate of silicon, for example, and a cap of glass, or example, having cavities to receive the devices. MEMS or other devices are supported on an upper surface of the substrate, into which metal-filled blind vias are formed. The cap is attached to the substrate, so as to enclose designated MEMS or other devices in the cavities. The substrate is then thinned so as to expose the metal of the vias at a lower surface of the substrate. Electrical connecting elements such as solder balls are then applied to the metal of the vias. The resultant composite substrate is then divided to provide individual packaged devices.