Patents by Inventor Chad Yau

Chad Yau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for stacking semiconductor package units and stacked package
    Patent number: 6773959
    Abstract: A stacked package of semiconductor packaging units includes a direct electrical connection between leads of an upper semiconductor package unit, and includes direct electrical connections between selected leads of the upper semiconductor package unit and a lower semiconductor package unit. Leads of the upper semiconductor package unit are straightened, and chip-select and clock-enable leads are shortened and electrically connected to adjacent not-connected leads. Selected leads of the upper semiconductor package unit are electrically connected directly to underlying leads of the lower semiconductor packaging unit. Electrical connections preferably are solder connections.
    Type: Grant
    Filed: March 1, 2002
    Date of Patent: August 10, 2004
    Assignee: Sampson Taiwan Ltd.
    Inventor: Chad Yau
  • Method for stacking semiconductor package units and stacked package
    Publication number: 20030164539
    Abstract: A stacked package of semiconductor packaging units includes a direct electrical connection between leads of an upper semiconductor package unit, and includes direct electrical connections between selected leads of the upper semiconductor package unit and a lower semiconductor package unit. Leads of the upper semiconductor package unit are straightened, and chip-select and clock-enable leads are shortened and electrically connected to adjacent not-connected leads. Selected leads of the upper semiconductor package unit are electrically connected directly to underlying leads of the lower semiconductor packaging unit. Electrical connections preferably are solder connections.
    Type: Application
    Filed: March 1, 2002
    Publication date: September 4, 2003
    Applicant: SAMPSON TAIWAN LTD.
    Inventor: Chad Yau