Patents by Inventor Chadwick Harber

Chadwick Harber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230315164
    Abstract: Embodiments of an apparatus and system are described for a hybrid computing device. Some embodiments may comprise a computing device having an enclosure arranged to support a display on a front of the enclosure and a cover mechanically coupled to a side of the enclosure, the cover comprising a first portion having at least one integrated input device and a second portion having at least one flexible seam arranged to allow the second portion to adjustably pivot around the seam. Other embodiments are described and claimed.
    Type: Application
    Filed: May 12, 2023
    Publication date: October 5, 2023
    Applicant: Intel Corporation
    Inventors: SAMEER SHARMA, GADI AMIT, YOSHIKUZU HOSHINO, CHADWICK HARBER, DANIEL CLIFTON, KENNETH JASINSKI
  • Patent number: 11693453
    Abstract: Embodiments of an apparatus and system are described for a hybrid computing device. Some embodiments may comprise a computing device having an enclosure arranged to support a display on a front of the enclosure and a cover mechanically coupled to a side of the enclosure, the cover comprising a first portion having at least one integrated input device and a second portion having at least one flexible seam arranged to allow the second portion to adjustably pivot around the seam. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: July 4, 2023
    Assignee: Intel Corporation
    Inventors: Sameer Sharma, Gadi Amit, Yoshikuzu Hoshino, Chadwick Harber, Daniel Clifton, Kenneth Jasinski
  • Patent number: 11537172
    Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware elements, circuitry etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: December 27, 2022
    Assignee: Intel Corporation
    Inventors: Sameer Sharma, Douglas Satzger, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Philip J. Houdek, II, Stanislav Moiseyenko, Nathan Jauvtis
  • Publication number: 20200401194
    Abstract: Embodiments of an apparatus and system are described for a hybrid computing device. Some embodiments may comprise a computing device having an enclosure arranged to support a display on a front of the enclosure and a cover mechanically coupled to a side of the enclosure, the cover comprising a first portion having at least one integrated input device and a second portion having at least one flexible seam arranged to allow the second portion to adjustably pivot around the seam. Other embodiments are described and claimed.
    Type: Application
    Filed: September 4, 2020
    Publication date: December 24, 2020
    Applicant: Intel Corporation
    Inventors: SAMEER SHARMA, GADI AMIT, YOSHIKUZU HOSHINO, CHADWICK HARBER, DANIEL CLIFTON, KENNETH JASINSKI
  • Patent number: 10860067
    Abstract: Embodiments of an apparatus, system and method are described for a mobile computing device. A mobile computing device may comprise, for example, an enclosure arranged to support a display and one or more processor circuits, the enclosure having an enlarged portion at one side of the enclosure arranged to allow a user to clutch the enclosure with one hand at the one side, the enlarged portion having a thickness that is larger than a thickness of another portion of the enclosure, and the enlarged portion defining a cavity arranged to support one or more energy storage modules. Other embodiments are described and claimed.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: December 8, 2020
    Assignee: Intel Corporation
    Inventors: Sameer Sharma, Gad Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Kenneth Jasinski
  • Publication number: 20200285286
    Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware elements, circuitry etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
    Type: Application
    Filed: February 12, 2020
    Publication date: September 10, 2020
    Applicant: Intel Corporation
    Inventors: Sameer Sharma, Douglas Satzger, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Philip J. Houdek, II, Stanislav Moiseyenko, Nathan Jauvtis
  • Patent number: 10571976
    Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: February 25, 2020
    Assignee: Intel Corporation
    Inventors: Sameer Sharma, Douglas Satzger, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Philip J. Houdek, II, Stanislav Moiseyenko, Nathan Isaiah Jauvtis
  • Patent number: 10345865
    Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: July 9, 2019
    Assignee: INTEL CORPORATION
    Inventors: Sameer Sharma, Douglas Satzger, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Philip J. Houdek, II, Stanislav Moiseyenko, Nathan Isaiah Jauvtis
  • Patent number: 10152093
    Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: December 11, 2018
    Assignee: Intel Corporation
    Inventors: Sameer Sharma, Douglas Satzger, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Philip J. Houdek, II, Stanislav Moiseyenko, Nathan Isaiah Jauvtis
  • Patent number: 10114423
    Abstract: Embodiments of an apparatus and system are described for a hybrid computing device. Some embodiments may comprise a computing device having an enclosure arranged to support a display on a front of the enclosure and a cover mechanically coupled to a side of the enclosure, the cover comprising a first portion having at least one integrated input device and a second portion having at least one flexible seam arranged to allow the second portion to adjustably pivot around the seam. Other embodiments are described and claimed.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: October 30, 2018
    Assignee: INTEL CORPORATION
    Inventors: Sameer Sharma, Gadi Amit, Yoshikuzu Hoshino, Chadwick Harber, Daniel Clifton, Kenneth Jasinski
  • Patent number: 10073495
    Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: September 11, 2018
    Assignee: Intel Corporation
    Inventors: Sameer Sharma, Douglas Satzger, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Philip J. Houdek, II, Stanislav Moiseyenko, Nathan Isaiah Jauvtis
  • Patent number: 10067538
    Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: September 4, 2018
    Assignee: Intel Corporation
    Inventors: Sameer Sharma, Douglas Satzger, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Philip J. Houdek, II, Stanislav Moiseyenko, Nathan Isaiah Jauvtis
  • Publication number: 20170139448
    Abstract: Embodiments of an apparatus, system and method are described for a mobile computing device. A mobile computing device may comprise, for example, an enclosure arranged to support a display and one or more processor circuits, the enclosure having an enlarged portion at one side of the enclosure arranged to allow a user to clutch the enclosure with one hand at the one side, the enlarged portion having a thickness that is larger than a thickness of another portion of the enclosure, and the enlarged portion defining a cavity arranged to support one or more energy storage modules. Other embodiments are described and claimed.
    Type: Application
    Filed: January 30, 2017
    Publication date: May 18, 2017
    Applicant: Intel Corporation
    Inventors: Sameer Sharma, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Kenneth Jasinski
  • Publication number: 20170131746
    Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
    Type: Application
    Filed: January 25, 2017
    Publication date: May 11, 2017
    Applicant: Intel Corporation
    Inventors: Sameer Sharma, Douglas Satzger, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Philip J. Houdek, II, Stanislav Moiseyenko, Nathan Isaiah Jauvtis
  • Publication number: 20170131745
    Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
    Type: Application
    Filed: January 25, 2017
    Publication date: May 11, 2017
    Applicant: Intel Corporation
    Inventors: Sameer Sharma, Douglas Satzger, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Philip J. Houdek, II, Stanislav Moiseyenko, Nathan Isaiah Jauvtis
  • Publication number: 20170131744
    Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
    Type: Application
    Filed: January 25, 2017
    Publication date: May 11, 2017
    Applicant: Intel Corporation
    Inventors: Sameer Sharma, Douglas Satzger, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Philip J. Houdek, II, Stanislav Moiseyenko, Nathan Isaiah Jauvtis
  • Publication number: 20170131740
    Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
    Type: Application
    Filed: January 25, 2017
    Publication date: May 11, 2017
    Applicant: Intel Corporation
    Inventors: Sameer Sharma, Douglas Satzger, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Philip J. Houdek, II, Stanislav Moiseyenko, Nathan Isaiah Jauvtis
  • Patent number: D792392
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: July 18, 2017
    Assignee: Intel Corporation
    Inventors: Sameer Sharma, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Kenneth Jasinski
  • Patent number: D806087
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: December 26, 2017
    Assignee: Intel Corporation
    Inventors: Sameer Sharma, Douglas Satzger, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Philip J. Houdek, II, Stanislav Moiseyenko, Nathan Isaiah Jauvtis
  • Patent number: D874456
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: February 4, 2020
    Assignee: Intel Corporation
    Inventors: Sameer Sharma, Douglas Satzger, Gadi Amit, Yoshikazu Hoshino, Chadwick Harber, Daniel Clifton, Philip J. Houdek, II, Stanislav Moiseyenko, Nathan Isaiah Jauvtis