Patents by Inventor Chai Wei Heng

Chai Wei Heng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a semiconductor device having a resin with warpage compensated structures
    Patent number: 8377753
    Abstract: A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: February 19, 2013
    Assignee: Infineon Technologies AG
    Inventors: Chai Wei Heng, Wae Chet Yong, Stanley Job Doraisamy, Khai Huat Jeffrey Low, Gerhard Deml
  • Electronic component and a method of fabricating an electronic component
    Patent number: 8207601
    Abstract: An electronic component includes a lead frame assembly, an insert, a semiconductor chip and an encapsulation compound. The lead frame assembly includes a mounting hole, a die pad, a plurality of bonding fingers and a plurality of lead fingers. The insert includes a hollow center and is provided at the mounting hole of the lead frame assembly. The semiconductor chip is arranged on the die pad and includes contact areas on its surface. A plurality of electrical contacts respectively links the contact areas of the semiconductor chip to the bonding fingers of the lead frame assembly. An encapsulating compound encloses the insert, the semiconductor chip, and the electrical contacts, however, leaves the hollow center of the insert uncovered.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: June 26, 2012
    Assignee: Infinen Technologies AG
    Inventors: Khai Huat Jeffrey Low, Chai Wei Heng, Wae Chet Yong
  • Method of Fabricating A Semiconductor Device Having A Resin With Warpage Compensated Structures
    Publication number: 20120058606
    Abstract: A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
    Type: Application
    Filed: November 10, 2011
    Publication date: March 8, 2012
    Applicant: Infineon Technologies AG
    Inventors: Chai Wei Heng, Wae Chet Yong, Stanley Job Doraisamy, Khai Huat Jeffrey Low, Gerhard Deml
  • Semiconductor devices having a resin with warpage compensated surfaces
    Patent number: 8067841
    Abstract: A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: November 29, 2011
    Assignee: Infineon Technologies AG
    Inventors: Chai Wei Heng, Wae Chet Yong, Stanley Job Doraisamy, Khai Huat Jeffrey Low, Gerhard Deml
  • Method of manufacture of encapsulated package
    Patent number: 7674657
    Abstract: There is provided a method of making an encapsulated component package, including providing a support for supporting the components of the package during encapsulation, the support including legs extending beyond the perimeter of the final package, rupturing the support legs, and covering the exposed ends of the legs with an insulating material. There is also provided a package formed in accordance with the method.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: March 9, 2010
    Assignee: Infineon Technologies AG
    Inventors: Chai Wei Heng, Yang Hong Heng, Yong Chern Poh
  • Semiconductor Device
    Publication number: 20090212446
    Abstract: A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
    Type: Application
    Filed: February 25, 2008
    Publication date: August 27, 2009
    Inventors: Chai Wei Heng, Wae Chet Yong, Stanley Job Doraisamy, Khai Huat Jeffrey Low, Gerhard Deml
  • Electronic Component and a Method of Fabricating an Electronic Component
    Publication number: 20090001536
    Abstract: An electronic component includes a lead frame assembly, an insert, a semiconductor chip and an encapsulation compound. The lead frame assembly includes a mounting hole, a die pad, a plurality of bonding fingers and a plurality of lead fingers. The insert includes a hollow center and is provided at the mounting hole of the lead frame assembly. The semiconductor chip is arranged on the die pad and includes contact areas on its surface. A plurality of electrical contacts respectively links the contact areas of the semiconductor chip to the bonding fingers of the lead frame assembly. An encapsulating compound encloses the insert, the semiconductor chip, and the electrical contacts, however, leaves the hollow center of the insert uncovered.
    Type: Application
    Filed: June 25, 2008
    Publication date: January 1, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Khai Huat Jeffrey Low, Chai Wei Heng, Wae Chet Yong
  • Method of Manufacture of Encapsulated Package
    Publication number: 20080157433
    Abstract: There is provided a method of making an encapsulated component package, including providing a support for supporting the components of the package during encapsulation, the support including legs extending beyond the perimeter of the final package, rupturing the support legs, and covering the exposed ends of the legs with an insulating material. There is also provided a package formed in accordance with the method.
    Type: Application
    Filed: March 12, 2008
    Publication date: July 3, 2008
    Inventors: Chai Wei Heng, Yang Hong Heng, Yong Chern Poh