Abstract: A magnetic alignment apparatus (20) is provided for aligning a semiconductor die (11) and a packaging substrate (12) to enable aligned mounting therebetween. The alignment apparatus (20) includes a first magnetic device (23) coupled to the die (11) and adapted to generate a first magnetic field (25) oriented relative to a first reference point (26) of the die (11). A second magnetic device (27) is coupled to the substrate (12) and adapted to generate a second magnetic field (28) oriented relative to a second reference point (30) of the substrate (12). The first magnetic field (25) and the second magnetic field (28) cooperate to directionally align the first reference point (26) of the die substantially with the second reference point (30) of the substrate (12).

Abstract: A method of fusing and programming a fuse frame for use in a semiconductor package is disclosed. A fuse frame includes an external lead arranged for electrically connecting to a first internal element of the semiconductor package and to extend externally from the semiconductor package and an internal lead arranged to be positioned entirely within the semiconductor package is also provided for electrically connecting a second internal element of the semiconductor package to a third internal element of the semiconductor package. A fuse bar supportably connects the internal lead to the external lead. The fuse bar includes a conductive material which fuses when excess current runs through it. A semiconductor package is made of a fuse frame and a die is mounted on the fuse frame such that the die supports the internal lead of the fuse frame. A programmable fuse frame is disclosed. A programmable fuse frame includes a matrix of fuse bars and lead bars.

Abstract: A lead frame clamping arrangement for lead frame/interposer bonding is disclosed that clamps the leads to be bonded at two spaced apart locations with the bonding area being positioned between the clamped portions of the particular leads being bonded. During bonding of a selected lead to its associated trace, a bonding tool tip is positioned in the gap between the clamps. In a preferred embodiment of the invention, the clamping arrangement includes a lead tip clamp and a lead arm clamp. In some embodiments, the lead arm clamp takes the form of a window clamp and the lead tip clamp includes a spring plate positioned within the window such that a channel shaped gap is formed between the spring plate and the window clamp. The gap exposes the bonding regions of all of the leads to be attached to the interposer. With this arrangement, all of the leads of a radially based lead frame can be secured to the interposer without requiring the resetting of the clamp.

Abstract: An ultrasonic bonder for coupling lead frame leads to associated traces on a substrate is disclosed. In one aspect of the invention, the bonder includes an ultrasonic transducer. A base supports the transducer at one end, while a bonding tool is attached to the other end. The bonding tool is suitably sized for engaging a lead frame lead to facilitate connecting the lead frame lead to an associated trace on a substrate. A pair of force sensors are positioned on opposite sides of the transducer's longitudinal axis. Each force sensor has a sensor axis that is arranged at an acute angle relative to the longitudinal axis of the transducer for detecting the forces applied to the bonding tool and for outputting a force signal indicative of the detected forces. A controller receives the force signals and outputs a drive signal to the transducer to facilitate mechanically bonding the selected lead frame lead to its associated trace.

Abstract: A method is disclosed for packaging for an integrated circuit having lead frames with closely spaced leads that are configured in such a way that the bonding wires must cross over other leads prior to bonding to the appropriate lead. The method includes the formation of a modified lead frame such that the likelihood of electrical contact between the bonding wires and leads crossed over by bonding wires is reduced. In one embodiment, insulating film is placed on an adjacent lead, or additionally on a number of crossed over leads, directly under the path of the bonding wire such that the potential for electrical contact is reduced. In a second embodiment, a depression is formed on an adjacent lead, or additionally on a number of crossed over leads, causing additional clearance is created between the bonding wire and the lead such that the likelihood of contact is reduced.

Abstract: A fuse frame for use in a semiconductor package is disclosed. A fuse frame includes an external lead arranged for electrically connecting to a first internal element of the semiconductor package and to extend externally from the semiconductor package and an internal lead arranged to be positioned entirely within the semiconductor package is also provided for electrically connecting a second internal element of the semiconductor package to a third internal element of the semiconductor package. A fuse bar supportably connects the internal lead to the external lead. The fuse bar includes a conductive material which fuses when excess current runs through it. A semiconductor package is made of a fuse frame and a die is mounted on the fuse frame such that the die supports the internal lead of the fuse frame. A programmable fuse frame is also disclosed. A programmable fuse frame includes a matrix of fuse bars and lead bars.

Abstract: A wire bonder for electrically coupling an integrated circuit die to associated wiring traces is disclosed. In one aspect of the invention, the wire bonder includes a pair of ultrasonic transducers. A capillary holder is connected between the transducers to support a capillary having a bonding wire suitable for electrically connecting an integrated circuit die pad to a lead on an associate wiring trace. A signal generator applies drive signals to the transducers to mechanically bond a bonding wire to at least one of an integrated circuit die pad and a wiring trace. The signal generator is arranged to permit independent actuation of the transducers at frequencies suitable for ultrasonic welding. The signal generator means includes a controller for controlling the timing of the drive signals. With this arrangement, the direction of ultrasonic energy applied during welding may be varied by adjusting the relative timing of actuation of the transducers.

Abstract: A method is presented for stitch bonding wires to bonding pads on integrated circuit dies by using a tilted bonding capillary tip to prevent damaging the dies. The capillary tip has a face surface about the opening of the capillary. The face surface makes a face angle with respect to a capillary axis. The capillary tip is positioned in proximity to a bonding pad, and the tip is tilted by an angle less than the face angle. An end of a bonding wire is then stitch bonding to the bonding pad without damaging passivation layers on the integrated circuit die which surround the bonding pad. An apparatus permitting ball bonding and stitch bonding at a plurality of angular orientations is also disclosed. The invention should be particularly useful for electrically connecting integrated circuit dies to each other in multi-chip packages (MCP's).

Abstract: The present invention provides real time feedback interconnect system which allows real-time detection and control of bond force exerted on the bond site. A force sensor is provided in the bond system, which detects the bond force exerted by the bond tool. The force sensor provides a force signal to a real-time feedback circuit. The feedback circuit transmits a force adjustment signal to a z-motion actuator to adjust the force applied to the bond site.