Patents by Inventor Chak P. Wong

Chak P. Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shock compression sensitivity change on command of explosives containing SMART materials
    Patent number: 7927439
    Abstract: The invention is a method and a composition where, on command, a distributed number of micron size voids are created in an energetic material. The voids are hot spots, which change the shock compression sensitivity of the explosive composition by a factor of 2 to 10. The composition contains SMART materials, which are magnetostrictive materials having a large magnetostrictive coefficient, and in a matter of microseconds following the application of an external electromagnetic field, each of the magnetostrictive nano-structures expands and contracts forming a void, where the sum of the voids increases the shock compression sensitivity of the composition.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: April 19, 2011
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Jerry W. Forbes, Chak P. Wong, G. William Lawrence