Patents by Inventor Chan U. Ko

Chan U. Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer PSA construction exhibiting reduced tackifier migration
    Patent number: 6183862
    Abstract: A multilayer PSA construction includes a facestock, a hazy, first adhesive layer adjacent the facestock, and a PSA layer adjacent the first adhesive layer, and is protected until use by a release liner. The first adhesive layer includes an immiscible blend of a first elastomer having a first glass transition temperature and forming a continuous phase, and a second elastomer forming a discontinuous phase. The second elastomer has a glass transition temperature greater than the first glass transition temperature. The first adhesive layer also contains a tackifying component, which is preferentially soluble in the discontinuous phase. The PSA layer has a composition different from the first adhesive layer and is formed of at least one tackified elastomer that provides a measurable third maximum glass transition temperature, which is less than the second glass transition temperature. The multilayer PSA construction exhibits reduced migration of tackifiers and plasticizers over time.
    Type: Grant
    Filed: September 23, 1998
    Date of Patent: February 6, 2001
    Assignee: Avery Dennison Corporation
    Inventors: Chan U. Ko, Hsiao K. Chuang, Ronald Ugolick
  • Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms
    Patent number: 5432010
    Abstract: The invention relates to a resin transfer molding preform binder resin that comprises at least one aromatic polyepoxide, a fluorene epoxide that is different than the aromatic polyepoxide and having a defined structure, and a 9,9-bis(aminophenyl)fluorene curing agent. The binder resin is a solid, room temperature stable, essentially nonsintering powder that displays a glass transition temperature greater than about 40.degree. C. Also disclosed are preforms made with the binder resin and a method for preparing the preforms.
    Type: Grant
    Filed: September 23, 1994
    Date of Patent: July 11, 1995
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Chan U. Ko, Steven C. Hackett
  • Binder resin for resin transfer molding preforms
    Patent number: 5369192
    Abstract: The invention relates to a resin transfer molding preform binder resin that comprises at least one aromatic polyepoxide, a fluorene epoxide that is different than the aromatic polyepoxide and having a defined structure, and a 9,9-bis(aminophenyl)fluorene curing agent. The binder resin is a solid, room temperature stable, essentially nonsintering powder that displays a glass transition temperature greater than about 40.degree. C. Also disclosed are preforms made with the binder resin and a method for preparing the preforms.
    Type: Grant
    Filed: June 28, 1993
    Date of Patent: November 29, 1994
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Chan U. Ko, Steven C. Hackett
  • Pressure-sensitive adhesives
    Patent number: 5308887
    Abstract: The present invention provides a silicone/acrylic based pressure-sensitive adhesive composition, adhesive, and adhesive tapes prepared therefrom.
    Type: Grant
    Filed: May 23, 1991
    Date of Patent: May 3, 1994
    Assignee: Minnesota Mining & Manufacturing Company
    Inventors: Chan U. Ko, Mark D. Purgett, Kurt C. Melancon, Donald H. Lucast, Daniel K. McIntyre