Abstract: Disclosed herein is an LED package for a backlight unit. The LED package includes a plurality of LEDs, a die bonding part, a wire bonding part and a body. The die bonding part, on which the plurality of LEDs is arranged, allows the first electrodes of the LEDs to be electrically connected to an external circuit. The wire bonding part is spaced apart from the die bonding part by a predetermined distance to be insulated from the die bonding part and allows the second electrodes of the LEDs to be electrically connected to the external circuit so that the LEDs are operated. The body has a molding cup which is used to fill a space above the LEDs with transparent resin and a base on which the die bonding part and the wire bonding part are arranged.

Abstract: A high power LED package, in which substantially planar first and second lead frames made of high reflectivity metal are spaced from each other for a predetermined gap. An LED chip is seated on at least one of the lead frames, and having terminals electrically connected to the lead frames, respectively. A package body made of resin seals the LED chip therein while fixedly securing the lead frame in the bottom thereof. The encapsulant preferably fills up the gap between the first and second lead frames. The LED package is structured to raise thermal radiation efficiency thereby reducing the size and thickness thereof.

Abstract: A method for fabricating a surface acoustic wave filter chip package includes: mounting a surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the chip; forming a metal shield layer on a whole outer wall of the chip by using a spray process; and molding resins on the metal shield layer. The metal shield layer is formed from a conductive epoxy with the use of a spray nozzle.

Abstract: Disclosed is a high power LED package. In the LED package, a lower board has a heat radiation member in an LED mounting area and at least one via hole around the heat radiation member. First and second bottom electrodes are formed in the underside of the lower board, and connected to the heat radiation member and the via hole. An insulation layer is formed on the lower board to cover the heat radiation member. First and second electrode patterns on the insulation layer are connected to the first and second bottom electrodes through the via hole.

Abstract: An active predistorting linearizer with agile bypass circuit for safe mode operation is used in conjunction with an amplifier. This linearizer comprises a controllable input variable-attenuator and drive-amplifier circuit supplied with the input signal to attenuate and amplify the input signal. A predistorter includes a controllable phase-shifting and amplitude-adjusting path supplied with the attenuated and amplified input signal to distort the latter signal and produce a predistorted output signal. A controllable output variable-attenuator and drive-amplifier circuit is supplied with the predistorted output signal to attenuate and amplify this predistorted output signal before supplying it to the power amplifier. A phase-shifting and amplitude-adjusting controller is connected to the controllable input variable-attenuator and drive-amplifier circuit, the controllable phase-shifting and amplitude-adjusting path, and the controllable output variable-attenuator and drive-amplifier circuit.

Abstract: A method of manufacturing a semiconductor device package includes forming a patterned photoresist film with windows for exposing a plurality of connection bump areas on a conductive substrate, forming metal plating layers on the connection bumps area using the photoresist film, and forming first gold plating layers on the metal plating layers. The metal plating layers prevent the diffusion of the first gold plating layers into the conductive substrate. According to the method, high-qualified conductive layers are formed on the connection bumps by a simplified manufacturing process. Further, connection bumps having an upper part in an almost hemispherical shape are formed on the first gold plating layers, thereby improving the reliability of the semiconductor device package.

Abstract: Disclosed is a method for simply fabricating plural surface acoustic wave filter chip packages in large quantities comprising the steps of providing a wafer, on the surface of which plural surface acoustic wave filter chips are formed, and a package substrate, on the surface of which mounting portions corresponding to surface acoustic wave filter chips are formed; providing underfill on the package substrate; mounting the wafer on the package substrate; removing wafer portions between surface acoustic wave filter chips; forming metal shield layers on outer walls of separated surface acoustic wave filter chips; molding a resin on outer walls of surface acoustic wave filter chips coated with metal layers; and dividing the package substrate molded with resin into individual surface acoustic wave filter chip packages.

Abstract: A chip package includes a chip having a first surface provided with a first terminal and a second surface provided with at least one second terminal, the second surface being opposite to the first surface, a first substrate arranged on the first surface of the chip and having a first conductive via hole connected to the first terminal, a second substrate arranged on the second surface of the chip and having at least one second conductive via hole connected to the second terminal, and a resin molding part formed around the chip between the first substrate and the second substrate. And the present invention provides a chip package assembly including the chip package. Further, a method of manufacturing the chip package and an assembly including the chip package are provided. The chip package does not use a bonding wire and additional conductive lands, thereby reducing the size of the package and simplifying the manufacturing process.

Abstract: An active predistorting linearizer with agile bypass circuit for safe mode operation is used in conjunction with an amplifier. This linearizer comprises a controllable input variable-attenuator and drive-amplifier circuit supplied with the input signal to attenuate and amplify the input signal. A predistorter includes a controllable phase-shifting and amplitude-adjusting path supplied with the attenuated and amplified input signal to distort the latter signal and produce a predistorted output signal. A controllable output variable-attenuator and drive-amplifier circuit is supplied with the predistorted output signal to attenuate and amplify this predistorted output signal before supplying it to the power amplifier. A phase-shifting and amplitude-adjusting controller is connected to the controllable input variable-attenuator and drive-amplifier circuit, the controllable phase-shifting and amplitude-adjusting path, and the controllable output variable-attenuator and drive-amplifier circuit.

Abstract: Disclosed is a method of manufacturing a semiconductor device package, comprising the steps of forming a patterned photoresist film with windows for exposing a plurality of connection bump areas on a conductive substrate, forming metal plating layers on the connection bumps area using the photoresist film, and forming first gold plating layers on the metal plating layers. The metal plating layers prevent the diffusion of the first gold plating layers into the conductive substrate. The method of manufacturing the semiconductor device package according to the present invention forms high-qualified conductive layers on the connection bumps by a simplified manufacturing process. Further, connection bumps having an upper part in an almost hemispherical shape are formed on the first gold plating layers, thereby improving the reliability of the semiconductor device package.

Abstract: A chip package includes a chip having a first surface provided with a first terminal and a second surface provided with at least one second terminal, the second surface being opposite to the first surface, a first substrate arranged on the first surface of the chip and having a first conductive via hole connected to the first terminal, a second substrate arranged on the second surface of the chip and having at least one second conductive via hole connected to the second terminal, and a resin molding part formed around the chip between the first substrate and the second substrate. And the present invention provides a chip package assembly including the chip package. Further, a method of manufacturing the chip package and an assembly including the chip package are provided. The chip package does not use a bonding wire and additional conductive lands, thereby reducing the size of the package and simplifying the manufacturing process.

Abstract: Disclosed is a method for simply fabricating plural surface acoustic wave filter chip packages in large quantities comprising the steps of providing a wafer, on the surface of which plural surface acoustic wave filter chips are formed, and a package substrate, on the surface of which mounting portions corresponding to surface acoustic wave filter chips are formed; providing underfill on the package substrate; mounting the wafer on the package substrate; removing wafer portions between surface acoustic wave filter chips; forming metal shield layers on outer walls of separated surface acoustic wave filter chips; molding a resin on outer walls of surface acoustic wave filter chips coated with metal layers; and dividing the package substrate molded with resin into individual surface acoustic wave filter chip packages.

Abstract: Disclosed is a method for fabricating a surface acoustic wave filter chip package comprising the steps of mounting the surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the surface acoustic wave filter chip; forming a metal shield layer on an whole outer wall of the surface acoustic wave filter chip by using a spray process; and molding resins on the metal shield layer. The method has advantages in that a fillet forming step for improving a step-coverage is removed by forming a metal shield layer from a conductive epoxy with the use of a spray nozzle, a one-ply metal shield layer is formed without an additional metal layer for preventing oxidation of the metal layer by forming an exterior of the SAW filter chip package with the use of a top molding process, and that a structurally stable SAW filter package can be fabricated.