Patents by Inventor Chandan Kumar Saha

Chandan Kumar Saha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing thick crack-free coating from hydrogen silsequioxane resin
    Patent number: 5866197
    Abstract: This invention pertains to a method for producing crack-free, insoluble, greater than 1.25 .mu.m thick coatings from hydrogen silsesquioxane resin compositions. The method for producing the coating comprises applying a fillerless hydrogen silsesquioxane resin composition onto a substrate and thereafter heating the hydrogen silsesquioxane resin at a temperature of less than 500.degree. C. for a controlled period of time to produce the crack-free coating having a thickness of greater than 1.25 .mu.m. The resins may be cured in an inert or oxygen containing environment.
    Type: Grant
    Filed: June 6, 1997
    Date of Patent: February 2, 1999
    Assignee: Dow Corning Corporation
    Inventors: Jeffrey Nicholas Bremmer, Kyuha Chung, Chandan Kumar Saha, Michael John Spaulding