Abstract: A semiconductor package houses a single two terminal semiconductor component. The package is hermetically sealed and is adapted for surface mounting. The package consists of an open ceramic box that has slots for external leads. A glass seal provides the means for sealing the leads to the ceramic box. The semiconductor element is in a die form and one terminal is directly bonded to one of the external leads. The other terminal is bonded to a clip that in turn is bonded to the other lead. A lid is sealed to the top of the ceramic box to provide the hermetic seal.

Abstract: A semiconductor package houses a plurality of single two terminal semiconductor components. The package is a plastic or ceramic small outline integrated circuit package and is adapted for surface mounting. Each semiconductor element is in a die form and one terminal is directly bonded to one of the external leads. The other terminal is bonded to a jumper that in turn is bonded to the other lead. The resultant package is encapsulated and the external leads are formed for surface mounting. V-shaped grooves formed on the top and bottom of the package separate each semiconductor component and provide a means to separate each or a combination of individual semiconductor components from the package by allowing them to be snapped apart at the V-groove. The resultant package has a very low profile that allows it to be used in thin profile, high density electronic assemblies.

Abstract: In a packaged electronic circuit, the circuit or circuits is soldered to a flexible tape, then tested and, any defective elements replaced. The tape is then soldered to a package. Different tapes may be used to change the pin-out of a chip; or to accomodate two sets of chips having different contact arrays.

Abstract: An integrated circuit package in which integrated circuit (I.C.) chips having flexible beam leads, the inner lead bond sites of which are bonded to input/output (I/O) terminals on the active faces of the chips, are mounted active face down on a surface of a substrate. The surface of the substrate is provided with chip sites and outer lead (OL) pads associated with each chip site. A preform of a fiber glass web coated with a thermosetting plastic is positioned on each chip site between a chip site and the active face of the I.C. chip. The plastic material of the preforms encapsulates the active faces of the chips, including a portion of each of the leads proximate a chip, and secures each chip to its chip site. The outer lead bond sites of the leads are bonded to OL pads of the substrate with the exposed portions of the leads between the OL pads and the encapsulated portion being bent away from the substrate and under compression.

Abstract: An integrated circuit package in which an integrated circuit chip having flexible beam leads, the inner lead bonding sites of which are bonded to input and output terminals on the active face of the chip, is mounted active face down on the top surface of a substrate. The top surface of the substrate is provided with a chip pad on which the integrated circuit chip is mounted and outer lead pads. The back surface of the substrate has a heat sink pad which is positioned substantially opposite the chip pad. A plurality of thermal passages is formed through the substrate interconnecting the chip pad and the heat sink pad. A good thermally conductive material fills the passages. A preform comprising a segment of fiber glass web coated with a thermosetting and thermally conductive plastic is positioned on each chip pad between the chip pad and the active face of the integrated circuit chip.

Abstract: The method of mounting on a substrate an integrated circuit (I.C.) chip having flexible beam leads bonded to input/output (I/O) terminals on the active face of the I.C. chip. The substrate has a chip pad and outer lead (OL) pads associated with the chip pad on a surface of the substrate. Preforms of a fiber glass web coated with a thermosetting plastic are cut to a size that substantially conforms to that of the chip pad. The substrate and the chip pad are heated to a first temperature which the preform will adhere to the chip site, the preform is placed on the chip pad, and the active face of the I.C. chip is pressed into the preform. The temperature of the substrate, preform and chip, are then raised to a second temperature higher than the first to partially cure the thermoplastic material and to encapsulate the active face of the I.C. chip and portions of the leads proximate the chip in the thermoplastic material of the preform. The I.C.

Abstract: An Integrated Circuit Package in which integrated circuit (I.C.) chips having flexible beam leads, the inner lead bond sites of which are bonded to input/output (I/O) terminals on the active faces of the chips, are mounted active face down on a surface of a substrate. The surface of the substrate is provided with chip sites and outer lead (OL) pads associated with each chip site. A preform of a fiber glass web coated with a thermosetting plastic is positioned on each chip site between a chip site and the active face of the I.C. chip. The plastic material of the preforms encapsulates the active faces of the chips, including a portion of each of the leads proximate a chip, and secures each chip to its chip site. The outer lead bond sites of the leads are bonded to OL pads of the substrate with the exposed portions of the leads between the OL pads and the encapsulated portion being bent away from the substrate and under compression.