Patents by Inventor Chandradip Pravinbhai Patel

Chandradip Pravinbhai Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tin-antimony-based high temperature solder for downhole components
    Patent number: 10376995
    Abstract: A downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the downhole tool comprises a first component, a second component, and a solder electrically and mechanically coupling the first and second components, wherein the solder comprises or consists of: from 9.6 to 10.2 weight % of antimony; from 0.01 to 0.25 weight % of manganese; and tin.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: August 13, 2019
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Francis Dupouy, Mark Kostinovsky, Suriyakan Vongtragool Kleitz, Chandradip Pravinbhai Patel
  • Soldered components for downhole use
    Patent number: 10180035
    Abstract: The disclosure describes soldering a first component (200) to a second component (226) for use in a downhole circuit, device and/or tool. The first component (200) includes an electrically conductive contact region (402) finished with a metallic finish layer (404). The soldering includes disposing a layer of manganese (408) adjacent to the metallic finish layer (404), and applying solder (406) to the layer of manganese (408). The solder (406) used in the soldering of the two components is a mixture of copper, silver and tin.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: January 15, 2019
    Assignees: SCHLUMBERGER TECHNOLOGY CORPORATION, UNIVERSITY OF MARYLAND, COLLEGE PARK
    Inventors: Chandradip Pravinbhai Patel, Mark Alex Kostinovsky, Francis Dupouy, Glen Dell Schilling, Gilles Iafrate, F. Patrick McCluskey
  • Tin-Antimony-Based High Temperature Solder for Downhole Components
    Publication number: 20160311065
    Abstract: A downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the down-hole tool comprises a first component, a second component, and a solder electrically and mechanically coupling the first and second components, wherein the solder comprises or consists of: from 9.6 to 10.2 weight % of antimony; from 0.01 to 0.25 weight % of manganese; and tin.
    Type: Application
    Filed: December 12, 2014
    Publication date: October 27, 2016
    Inventors: Francis Dupouy, Mark Kostinovsky, Suriyakan Vongtragool Kleitz, Chandradip Pravinbhai Patel
  • Soldered Components for Downhole Use
    Publication number: 20150184467
    Abstract: The disclosure describes soldering a first component (200) to a second component (226) for use in a downhole circuit, device and/or tool. The first component (200) includes an electrically conductive contact region (402) finished with a metallic finish layer (404). The soldering includes disposing a layer of manganese (408) adjacent to the metallic finish layer (404), and applying solder (406) to the layer of manganese (408). The solder (406) used in the soldering of the two components is a mixture of copper, silver and tin.
    Type: Application
    Filed: March 12, 2015
    Publication date: July 2, 2015
    Inventors: Chandradip Pravinbhai Patel, Mark Alex Kostinovsky, Francis Dupouy, Glen Dell Schilling, Gilles Iafrate, F. Patrick McCluskey