Patents by Inventor Chandrasekhar Balasubramanyam
Chandrasekhar Balasubramanyam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11210629Abstract: A system and method for optimizing management of inventory data is provided. A set of variables required for operating an inventory is determined. The set of variables represents one or more parameters associated with stock maintenance data of items present in the inventory. Further, a set of actionable variables from the set of variables is determined based on ranking two or more pre-determined variables from a set of pre-determined variables with respect to one or more target variables. The set of actionable variables represents one or more variables from the ranked variables. Lastly, a correlation is computed between the inventory stock maintenance data and the set of actionable variables based on an optimization model. The optimization model is trained and generated based on the set of actionable variables.Type: GrantFiled: February 20, 2020Date of Patent: December 28, 2021Assignee: COGNIZANT TECHNOLOGY SOLUTIONS INDIA PVT. LTD.Inventors: Hari Saravanabhavan, Chandrasekhar Balasubramanyam, Ritu Julka, Punit Kumar Mishra
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Publication number: 20210192431Abstract: A system and method for optimizing management of inventory data is provided. A set of variables required for operating an inventory is determined. The set of variables represents one or more parameters associated with stock maintenance data of items present in the inventory. Further, a set of actionable variables from the set of variables is determined based on ranking two or more pre-determined variables from a set of pre-determined variables with respect to one or more target variables. The set of actionable variables represents one or more variables from the ranked variables. Lastly, a correlation is computed between the inventory stock maintenance data and the set of actionable variables based on an optimization model. The optimization model is trained and generated based on the set of actionable variables.Type: ApplicationFiled: February 20, 2020Publication date: June 24, 2021Inventors: Hari Saravanabhavan, Chandrasekhar Balasubramanyam, Ritu Julka, Punit Kumar Mishra
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Publication number: 20210103869Abstract: A system and method for optimizing solution identification for a data analytics problem is provided. The present invention provides for rendering multiple standard use cases associated with one or more data analytics problems. Standard use case is flagged from amongst the multiple standard use cases for analysis. Further, analyzing the flagged standard use case based on corresponding set of algorithms from pre-defined set of algorithms for determining sub-category of standard use case. Further, performing check to determine availability of in-built solution for solving one or more data analytics problems of the determined sub-category of standard use case based on corresponding set of algorithms from pre-defined set of algorithms. Finally, generating alert for development of one or more solutions to the problems related to determined sub-category of standard use case if built-in solution is not found. A solution is received from external developed solutions in response to alert.Type: ApplicationFiled: November 26, 2019Publication date: April 8, 2021Inventors: Hari Saravanabhavan, Chandrasekhar Balasubramanyam
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Patent number: 10455365Abstract: A system and method for tracking and identifying user equipment(s) is provided. The present invention provides for determining if a user store location is included within a list of stores associated with the business entity. Further, the present invention provides for determining the user equipment location within a predefined range of one or more stores associated with the business entity. The invention further provides for identifying a target user equipment based on one or more parameters if the user equipment location is same as one of the store locations associated with the business entity. The target user equipment is representative of a user equipment associated with a valued user. The identification of the target user equipment triggers, at least one of a Wi-Fi based technique and an image recognition technique to determine precise location of the target user equipment within the store.Type: GrantFiled: October 31, 2018Date of Patent: October 22, 2019Assignee: COGNIZANT TECHNOLOGY SOLUTIONS INDIA PVT. LTD.Inventors: Hari Saravanabhavan, Chandrasekhar Balasubramanyam
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Patent number: 9863038Abstract: Disclosed are method and apparatus for treating a substrate. The apparatus is a dual-function process chamber that may perform both a material process and a thermal process on a substrate. The chamber has an annular radiant source disposed between a processing location and a transportation location of the chamber. Lift pins have length sufficient to maintain the substrate at the processing location while the substrate support is lowered below the radiant source plane to afford radiant heating of the substrate. A method of processing a substrate having apertures formed in a first surface thereof includes depositing material on the first surface in the apertures and reflowing the material by heating a second surface of the substrate opposite the first surface. A second material can then be deposited, filling the apertures partly or completely. Alternately, a cyclical deposition/reflow process may be performed.Type: GrantFiled: March 14, 2013Date of Patent: January 9, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Maurice E. Ewert, Anantha Subramani, Umesh M. Kelkar, Chandrasekhar Balasubramanyam, Joseph M. Ranish
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Patent number: 9818587Abstract: Disclosed are method and apparatus for treating a substrate. The apparatus is a dual-function process chamber that may perform both a material process and a thermal process on a substrate. The chamber has an annular radiant source disposed between a processing location and a transportation location of the chamber. Lift pins have length sufficient to maintain the substrate at the processing location while the substrate support is lowered below the radiant source plane to afford radiant heating of the substrate. A method of processing a substrate having apertures formed in a first surface thereof includes depositing material on the first surface in the apertures and reflowing the material by heating a second surface of the substrate opposite the first surface. A second material can then be deposited, filling the apertures partly or completely. Alternately, a cyclical deposition/reflow process may be performed.Type: GrantFiled: March 14, 2013Date of Patent: November 14, 2017Assignee: Applied Materials, Inc.Inventors: Maurice E. Ewert, Anantha K. Subramani, Umesh M. Kelkar, Chandrasekhar Balasubramanyam, Joseph M. Ranish
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Patent number: 9423042Abstract: Methods and apparatus for increasing flow uniformity are provided herein. In some embodiments, a slit valve having increased flow uniformity may be provided, the slit valve may include a housing having an opening disposed therethrough, the opening configured to allow a substrate to pass therethrough; a gas inlet formed in the housing; an outer plenum disposed in the housing and coupled to the gas inlet; an inner plenum disposed in the housing and coupled to the outer plenum via a plurality of holes; and a plurality of gas outlets disposed in the housing and fluidly coupling the opening to the inner plenum.Type: GrantFiled: February 11, 2013Date of Patent: August 23, 2016Assignee: APPLIED MATERIALS, INC.Inventors: Chandrasekhar Balasubramanyam, Helder Lee, Miriam Schwartz, Elizabeth Wu, Kedarnath Sangam
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Publication number: 20130270107Abstract: Disclosed are method and apparatus for treating a substrate. The apparatus is a dual-function process chamber that may perform both a material process and a thermal process on a substrate. The chamber has an annular radiant source disposed between a processing location and a transportation location of the chamber. Lift pins have length sufficient to maintain the substrate at the processing location while the substrate support is lowered below the radiant source plane to afford radiant heating of the substrate. A method of processing a substrate having apertures formed in a first surface thereof includes depositing material on the first surface in the apertures and reflowing the material by heating a second surface of the substrate opposite the first surface. A second material can then be deposited, filling the apertures partly or completely. Alternately, a cyclical deposition/reflow process may be performed.Type: ApplicationFiled: March 14, 2013Publication date: October 17, 2013Inventors: MAURICE E. EWERT, Anantha K. SUBRAMANI, Umesh M. KELKAR, Chandrasekhar BALASUBRAMANYAM, Joseph M. RANISH
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Publication number: 20130196514Abstract: Disclosed are method and apparatus for treating a substrate. The apparatus is a dual-function process chamber that may perform both a material process and a thermal process on a substrate. The chamber has an annular radiant source disposed between a processing location and a transportation location of the chamber. Lift pins have length sufficient to maintain the substrate at the processing location while the substrate support is lowered below the radiant source plane to afford radiant heating of the substrate. A method of processing a substrate having apertures formed in a first surface thereof includes depositing material on the first surface in the apertures and reflowing the material by heating a second surface of the substrate opposite the first surface. A second material can then be deposited, filling the apertures partly or completely. Alternately, a cyclical deposition/reflow process may be performed.Type: ApplicationFiled: March 14, 2013Publication date: August 1, 2013Applicant: Applied Materials, Inc.Inventors: Maurice E. EWERT, Anantha SUBRAMANI, Umesh M. KELKAR, Chandrasekhar BALASUBRAMANYAM, Joseph M. RANISH
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Patent number: 8404048Abstract: Disclosed are method and apparatus for treating a substrate. The apparatus is a dual-function process chamber that may perform both a material process and a thermal process on a substrate. The chamber has an annular radiant source disposed between a processing location and a transportation location of the chamber. Lift pins have length sufficient to maintain the substrate at the processing location while the substrate support is lowered below the radiant source plane to afford radiant heating of the substrate. A method of processing a substrate having apertures formed in a first surface thereof includes depositing material on the first surface in the apertures and reflowing the material by heating a second surface of the substrate opposite the first surface. A second material can then be deposited, filling the apertures partly or completely. Alternately, a cyclical deposition/reflow process may be performed.Type: GrantFiled: March 11, 2011Date of Patent: March 26, 2013Assignee: Applied Materials, Inc.Inventors: Maurice E. Ewert, Anantha K. Subramani, Umesh M. Kelkar, Chandrasekhar Balasubramanyam, Joseph M. Ranish
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Patent number: 8382180Abstract: An apparatus for transferring substrates in a processing system where the substrate is exposed to high temperatures is provided. In one embodiment a blade for transporting a substrate is provided. The blade comprises a base having an arcuate lateral shoulder, a first finger extending outward from and perpendicular to the base, a second finger extending outward from the base and parallel to and spaced-apart from the first finger, a first support tab configured to support the substrate and positioned along the arcuate lateral shoulder, a second support tab configured to support the substrate and coupled with the first finger, and a third support tab configured to support the substrate coupled with the second finger, wherein the arcuate lateral shoulder extends from an outer edge of the first finger to an outer edge of the second finger.Type: GrantFiled: October 30, 2008Date of Patent: February 26, 2013Assignee: Applied Material, Inc.Inventors: Dinesh Kanawade, Craig R. Metzner, Chandrasekhar Balasubramanyam
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Patent number: 8377213Abstract: Methods and apparatus for increasing flow uniformity are provided herein. In some embodiments, a slit valve having increased flow uniformity may be provided, the slit valve may include a housing having an opening disposed therethrough, the opening configured to allow a substrate to pass therethrough; a gas inlet formed in the housing; an outer plenum disposed in the housing and coupled to the gas inlet; an inner plenum disposed in the housing and coupled to the outer plenum via a plurality of holes; and a plurality of gas outlets disposed in the housing and fluidly coupling the opening to the inner plenum.Type: GrantFiled: May 5, 2008Date of Patent: February 19, 2013Assignee: Applied Materials, Inc.Inventors: Chandrasekhar Balasubramanyam, Helder Lee, Miriam Schwartz, Elizabeth Wu, Kedarnath Sangam
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Publication number: 20120231633Abstract: Disclosed are method and apparatus for treating a substrate. The apparatus is a dual-function process chamber that may perform both a material process and a thermal process on a substrate. The chamber has an annular radiant source disposed between a processing location and a transportation location of the chamber. Lift pins have length sufficient to maintain the substrate at the processing location while the substrate support is lowered below the radiant source plane to afford radiant heating of the substrate. A method of processing a substrate having apertures formed in a first surface thereof includes depositing material on the first surface in the apertures and reflowing the material by heating a second surface of the substrate opposite the first surface. A second material can then be deposited, filling the apertures partly or completely. Alternately, a cyclical deposition/reflow process may be performed.Type: ApplicationFiled: March 11, 2011Publication date: September 13, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Maurice E. Ewert, Anantha K. Subramani, Umesh M. Kelkar, Chandrasekhar Balasubramanyam, Joseph M. Ranish
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Publication number: 20090272324Abstract: Methods and apparatus for increasing flow uniformity are provided herein. In some embodiments, a slit valve having increased flow uniformity may be provided, the slit valve may include a housing having an opening disposed therethrough, the opening configured to allow a substrate to pass therethrough; a gas inlet formed in the housing; an outer plenum disposed in the housing and coupled to the gas inlet; an inner plenum disposed in the housing and coupled to the outer plenum via a plurality of holes; and a plurality of gas outlets disposed in the housing and fluidly coupling the opening to the inner plenum.Type: ApplicationFiled: May 5, 2008Publication date: November 5, 2009Applicant: APPLIED MATERIALS, INC.Inventors: CHANDRASEKHAR BALASUBRAMANYAM, Helder Lee, Miriam Schwartz, Elizabeth Wu, Kedarnath Sangam
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Publication number: 20090110520Abstract: Embodiments of the present invention as recited in the claims generally provide an apparatus for transferring substrates in a processing system where the substrate is exposed to high temperatures. In one embodiment a blade for transporting a substrate is provided. The blade comprises a base having an arcuate lateral shoulder, a first finger extending outward from and perpendicular to the base, a second finger extending outward from the base and parallel to and spaced-apart from the first finger, a first support tab configured to support the substrate and positioned along the arcuate lateral shoulder, a second support tab configured to support the substrate and coupled with the first finger, and a third support tab configured to support the substrate coupled with the second finger, wherein the arcuate lateral shoulder extends from an outer edge of the first finger to an outer edge of the second finger.Type: ApplicationFiled: October 30, 2008Publication date: April 30, 2009Inventors: Dinesh Kanawade, Craig R. Metzner, Chandrasekhar Balasubramanyam