Abstract: A fan-out semiconductor package includes: a semiconductor chip; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection member disposed on the semiconductor chip and including a first redistribution layer electrically connected to the connection pads and a second redistribution layer electrically connected to the connection pads and disposed on the first redistribution layer. The first redistribution layer includes a first pattern having a plurality of degassing holes, the second redistribution layer includes a second pattern having a first line portion having a first line width and a second line portion connected to the first line portion and having a second line width greater than the first line width, and the second line portion overlaps at least one of the plurality of degassing holes when being projected in a direction perpendicular to the active surface.

Abstract: A method for providing an aviation weather chart and an apparatus using the same. An aviation weather chart apparatus according to an aspect of the present invention may compromise: a communication unit which is connected to a weather server and an flight path server so as to acquire aviation weather information from the weather server, acquire flight path information from the flight path server, and acquire flight identification information from a network; and a control unit which acquires the flight path information corresponding to the flight identification information, acquires the aviation weather information corresponding to the flight path information, and acquires an aviation weather chart such that the flight path information and the weather information are displayed at one time on the basis of a flight information region through which a flight corresponding to the flight information passes and the weather information corresponding to the flight information region.

Abstract: A fan-out semiconductor package includes a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposite the active surface; an encapsulant encapsulating at least some portions of the first interconnection member and the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the semiconductor chip. The first interconnection member and the second interconnection member respectively include a plurality of redistribution layers electrically connected to the connection pads of the semiconductor chip, and the semiconductor chip has a groove defined in the active surface and between a peripheral edge of the semiconductor chip and the connection pads of the semiconductor chip.

Abstract: Disclosed are sensors for detecting a fingerprint and methods of manufacturing the sensor. The sensor for detecting a fingerprint includes a substrate, first conductor lines formed on a surface of the substrate, an insulating layer formed on the first conductor lines, and second conductor lines formed on the insulating layer. A width of the first conductor lines or a width of the second conductor lines is 1-10 ?m.

Abstract: Disclosed is a method for manufacturing gas cylinders. The disclosed method for manufacturing gas cylinders comprises: a) a step of producing a liner using a liner blower machine; b) a step of applying an adhesive to the threads of the produced liner; c) a step of coupling a bushing to the threads of the liner; d) a step of leaving the liner having undergone step c) for 30 minutes to 2 hours at room temperature so as to naturally harden the adhesive; e) a liner-flaming step of heat-treating the outer surface of the liner with plasma; f) a step of coupling a shaft to the liner; g) a winding step of mixing multiple fiberglass strands with a resin and a hardening agent, and wrapping the mixture around the outer surface of the liner; h) a dry-hardening step of drying the cylinder made of the composite material and having undergone the winding step for 70 to 90 minutes at a temperature of 70° C. to 90° C.

Abstract: There is provided a shield part including: a magnetic laminate formed by laminating a plurality of magnetic layers and having a first surface and a second surface; a coil pattern formed on the first surface; and a first lead part formed at an end portion of a central portion of the coil pattern and a second lead part formed outside of the coil pattern, wherein a portion of the second surface is removed to form a recess, the first lead part is electrically connected to the second lead part by a conductive material disposed in the recess and a first via formed in the magnetic laminate in a lamination direction, and the second lead part is electrically connected to the first lead part by the conductive material disposed in the recess and a second via formed in the magnetic laminate in the lamination direction.

Abstract: A lens barrel may be detachably coupled to a capturing device may comprise a first lens assembly having first lenses mounted therein. A second lens assembly may be coupled to the first lens assembly and may have second lenses mounted therein. The second lenses may be aligned with the first lenses along an optic axis, and an adjusting portion may be provided in the first lens assembly and may be configured to adjust a position of the first lenses relative to the second lenses along a direction the optic axis by an electromagnetic force.

Abstract: The present invention relates to a coil type unit for wireless power transmission, a wireless power transmission device, an electronic device, and a manufacturing method of a coil type unit for wireless power transmission. A coil type unit for wireless power transmission of the present invention includes a coil portion having a coil pattern on a substrate; a magnetic portion having the coil portion attached to one surface thereof and a conductive pattern formed thereon; an adhesive portion interposed between the magnetic portion and the coil portion to mutually bond the magnetic portion and the coil portion; and a conductive hole for electrically connecting the coil pattern and the conductive pattern, wherein the adhesive portion is formed on one surface of the magnetic portion having the conductive pattern thereon while being formed in an area other than the area in which the conductive pattern is formed.

Abstract: Disclosed are a high strength fiber composite material, which satisfies bulletproof performance to the level as required in the industry and has greatly improved lightweight properties, a manufacturing method thereof, and a helmet manufactured by using the same. The high strength fiber composite material includes: a high strength fiber material; and a resin film laminated on one surface of the high strength fiber material, wherein an amount of the resin film is 10 to 18 wt. % to a total weight of the high strength fiber material and the resin film, the resin film includes 20 to 70 wt. % of phenolic resin, 20 to 70 wt. % of polyvinyl butyral (PVB) resin, and the polyvinyl butyral (PVB) resin has a molecular weight of 30,000 to 120,000.

Abstract: There are provided a printed circuit board, a method of manufacturing the same, and an electronic component module. The printed circuit board comprises a first circuit layer; a first insulating layer formed to cover a portion or all of the first circuit layer; a second circuit layer formed on the first insulating layer; a second insulating layer formed on an overall surface of the board so as to cover the first circuit layer and the second circuit layer; and a third circuit layer formed in the second insulating layer. The second circuit layer has a circuit pattern of a fine pitch as compared to the first circuit layer and the third circuit layer.

Abstract: Disclosed is a bulletproof material having superior bulletproof performance and enhanced back-side deformation characteristics along with superior wearing sensation due to relatively light weight and soft texture. The bulletproof material according to the present invention includes a fibrous layer including a carbon fiber network at a back side or near a back side.

Abstract: The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a core layer having a first circuit wiring layer formed on one surface or both surfaces thereof; an insulating layer laminated, as at least one layer, on one surface or both surfaces of the core layer; and a second circuit wiring layer formed on one surface of the insulating layer, wherein a conductive core is included in upper and lower insulating layers contacting the second circuit wiring layer requiring an electromagnetic wave shielding, or the conductive core is included in the insulating layer or the core layer contacting the first circuit wiring layer requiring the electromagnetic wave shielding.

Abstract: A common mode filter is disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a coil pattern formed on the magnetic substrate; a dielectric layer formed on the magnetic substrate so as to cover an upper part, a lower part and a side surface of the coil pattern; and a first coupling agent interposed between the magnetic substrate and the dielectric layer so as to prevent the magnetic substrate and the dielectric layer from being separated.

Abstract: Disclosed herein is an optical module including: an optical element mounted on a substrate; and an optical connector mounted corresponding to the optical element so as to change a path of an optical signal of the optical element and transfer the optical signal having the changed path. The optical module may provide various communication performances using an optical connector in which first and second connector parts are optically coupled stably to each other. Particularly, the optical module does not have a silicon optical bench (SiOB) as a medium, thereby making it possible to reduce a thickness of a product.

Abstract: Disclosed herein is a plug via stacked structure including: a through hole plating layer plated on a through hole inner wall and around top and bottom of a through hole at thickness t; a via plug filled in an inner space of the through hole plating layer; a circuit pattern formed over the top and bottom of the through hole plating layer and the via plug and making a thickness t? formed on the through hole plating layer thicker than a thickness t; and a stacked conductive via filled in a via hole formed on the top of the through hole and formed at thickness ? from a top of the circuit pattern, wherein T?t?+? is satisfied, T represents a sum of the thicknesses t and t? and t? is a thickness of a portion of the circuit pattern formed on the via plug.

Abstract: A semiconductor package and a method of manufacturing the semiconductor package are disclosed. A semiconductor package in accordance with an embodiment of the present invention includes a substrate, which is formed with a ground circuit and mounted with a semiconductor chip on one surface, a conductive ground layer, which is formed on the other surface of the substrate and connected with the ground circuit, a molding, which seals up the ground layer and the substrate having the semiconductor chip mounted thereon, and a conductive shield, which covers the molding and is connected with the ground layer. With a semiconductor package in accordance with an embodiment of the present invention, grounding for shielding is possible even in an entirely molded structure, and a double shielding structure to improve the shielding property.

Abstract: The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.

Abstract: Disclosed is a method for manufacturing gas cylinders. The disclosed method for manufacturing gas cylinders comprises: a) a step of producing a liner using a liner blower machine; b) a step of applying an adhesive to the threads of the produced liner; c) a step of coupling a bushing to the threads of the liner; d) a step of leaving the liner having undergone step c) for 30 minutes to 2 hours at room temperature so as to naturally harden the adhesive; e) a liner-flaming step of heat-treating the outer surface of the liner with plasma; f) a step of coupling a shaft to the liner; g) a winding step of mixing multiple fiberglass strands with a resin and a hardening agent, and wrapping the mixture around the outer surface of the liner; h) a dry-hardening step of drying the cylinder made of the composite material and having undergone the winding step for 70 to 90 minutes at a temperature of 70° C. to 90° C.

Abstract: Disclosed herein is a circuit board including: a base substrate including a via for power and a via pad for power connected to the via for power; and an insulating layer formed on the base substrate and including a dummy pattern formed in a region facing the via pad for power.