Patents by Inventor Chang-Chia Chang

Chang-Chia Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS device structure and methods of forming same
    Patent number: 9802816
    Abstract: A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: October 31, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chang-Chia Chang, Chen-Chih Fan, Bruce C. S. Chou
  • MEMS Device Structure and Methods of Forming Same
    Publication number: 20160009551
    Abstract: A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.
    Type: Application
    Filed: September 21, 2015
    Publication date: January 14, 2016
    Inventors: Chang-Chia Chang, Chen-Chih Fan, Bruce C.S. Chou
  • MEMS device structure and methods of forming same
    Patent number: 9139420
    Abstract: A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: September 22, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chang-Chia Chang, Chen-Chih Fan, Bruce C. S. Chou
  • MEMS Device Structure and Methods of Forming Same
    Publication number: 20130277777
    Abstract: A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.
    Type: Application
    Filed: April 18, 2012
    Publication date: October 24, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chang-Chia Chang, Chen-Chih Fan, Bruce C.S. Chou