Patents by Inventor Chang-Feng YOU

Chang-Feng YOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optoelectronic package and method for manufacturing the same
    Patent number: 11835757
    Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component. The photonic component has a bottom surface and a lateral surface. The lateral surface of the photonic component includes a light coupling region and a non-light coupling plane. The non-light coupling plane contacts the bottom surface. The light coupling region and the non-light coupling plane are not aligned.
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: December 5, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Mei-Ju Lu, Jr-Wei Lin, Chang-Feng You
  • OPTOELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230105803
    Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component. The photonic component has a bottom surface and a lateral surface. The lateral surface of the photonic component includes a light coupling region and a non-light coupling plane. The non-light coupling plane contacts the bottom surface. The light coupling region and the non-light coupling plane are not aligned.
    Type: Application
    Filed: October 1, 2021
    Publication date: April 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Ju LU, Jr-Wei LIN, Chang-Feng YOU
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230003956
    Abstract: A semiconductor package structure and a method of manufacturing the same are provided. A semiconductor package structure includes a first electronic component and a light emitter. The photonic component includes a substrate and a first port. The light emitter is disposed over the substrate of the photonic component. The light emitter is configured to emit light through the first port. A coupling loss between the first port of the photonic component and the light emitter is less than 3 dB.
    Type: Application
    Filed: June 30, 2021
    Publication date: January 5, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang-Feng YOU, Yu-Yuan YEH, Jun-Wei CHEN
  • Device for communication
    Patent number: 11474301
    Abstract: A device is provided. The device may be an optical device, a light coupling device, or a tunable light coupling device. The device includes a first portion, a lens, a light emitting element, and a waveguide. The first portion is disposed adjacent to a surface of a substrate and has a first side and a second side opposite to the first side. The light emitting element is disposed adjacent to the second side of the first portion. The lens is disposed adjacent to the first side of the first portion and between the light emitting element and the waveguide.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: October 18, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chang-Feng You, Jr-Wei Lin, Chieh-Chen Fu, Kao-Ming Su, Chen Yuan Weng
  • DEVICE FOR COMMUNICATION
    Publication number: 20220214488
    Abstract: A device is provided. The device may be an optical device, a light coupling device, or a tunable light coupling device. The device includes a first portion, a lens, a light emitting element, and a waveguide. The first portion is disposed adjacent to a surface of a substrate and has a first side and a second side opposite to the first side. The light emitting element is disposed adjacent to the second side of the first portion. The lens is disposed adjacent to the first side of the first portion and between the light emitting element and the waveguide.
    Type: Application
    Filed: January 7, 2021
    Publication date: July 7, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang-Feng YOU, Jr-Wei LIN, Chieh-Chen FU, Kao-Ming SU, Chen Yuan Weng