Patents by Inventor Chang-Fu Lin
Chang-Fu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11984379Abstract: Provided is an electronic package, in which a heat dissipating body is formed on an electronic device and is combined with a heat sink so that the electronic device, the heat dissipating body and the heat sink form a receiving space, and a heat dissipating material is formed in the receiving space and in contact with the heat sink and the electronic device, where a fluid regulating space is formed between the heat dissipating material and the heat dissipating body and is used as a volume regulating space for the heat dissipating material during thermal expansion and contraction.Type: GrantFiled: July 8, 2021Date of Patent: May 14, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
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Patent number: 11973014Abstract: Provided is a substrate structure including a substrate body, electrical contact pads and an insulating protection layer disposed on the substrate body, wherein the insulating protection layer has openings exposing the electrical contact pads, and at least one of the electrical contact pads has at least a concave portion filled with a filling material to prevent solder material from permeating along surfaces of the insulating protection layer and the electric contact pads, thereby eliminating the phenomenon of solder extrusion. Thus, bridging in the substrate structure can be eliminated even when the bump pitch between two adjacent electrical contact pads is small. As a result, short circuits can be prevented, and production yield can be increased.Type: GrantFiled: November 21, 2019Date of Patent: April 30, 2024Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chang-Fu Lin, Chin-Tsai Yao, Chun-Tang Lin, Fu-Tang Huang
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Publication number: 20240112869Abstract: A keyboard device includes a key module and a backlight module. The key module includes a supporting plate and plural key structures. The key structures are installed on the supporting plate. The backlight module includes a light guide plate, a light-sheltering layer, a reflecting layer, a light-emitting unit, a base plate and an opaque structure. The light guide plate includes a second opening. The second opening includes a lateral wall. The light-sheltering layer is located over the light guide plate. The light-sheltering layer includes a third opening. The reflecting layer is located under the light guide plate. The reflecting layer includes a fourth opening. The light-emitting unit emits a light beam into the light guide plate. The opaque structure is arranged between the light-sheltering layer and the reflecting layer. The opaque structure is located beside the lateral wall of the light guide plate.Type: ApplicationFiled: December 13, 2022Publication date: April 4, 2024Inventors: Xiang-Ge He, Chang-Fu Shen, Hui-Ling Lin
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Publication number: 20240038670Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.Type: ApplicationFiled: October 4, 2023Publication date: February 1, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
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Publication number: 20230395571Abstract: An electronic package is provided, in which a first electronic element and a second electronic element are disposed on a first side of a circuit structure and a second side of the circuit structure, respectively, where a first metal layer is formed between the first side of the circuit structure and the first electronic element, a second metal layer is formed on a surface of the second electronic element, and at least one thermally conductive pillar is disposed on the second side of the circuit structure and extends into the circuit structure to thermally conduct the first metal layer and the second metal layer. Therefore, through the thermally conductive pillar, heat generated during operations of the first electronic element and the second electronic element can be quickly dissipated to an external environment and would not accumulate.Type: ApplicationFiled: August 17, 2023Publication date: December 7, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Meng-Huan Chia, Yih-Jenn Jiang, Chang-Fu Lin, Don-Son Jiang
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Publication number: 20230361091Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.Type: ApplicationFiled: July 11, 2023Publication date: November 9, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
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Patent number: 11810862Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.Type: GrantFiled: November 1, 2022Date of Patent: November 7, 2023Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
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Patent number: 11792938Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.Type: GrantFiled: November 2, 2020Date of Patent: October 17, 2023Assignee: Silicon Precision Industries Co., Ltd.Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
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Patent number: 11764188Abstract: An electronic package is provided, in which a first electronic element and a second electronic element are disposed on a first side of a circuit structure and a second side of the circuit structure, respectively, where a first metal layer is formed between the first side of the circuit structure and the first electronic element, a second metal layer is formed on a surface of the second electronic element, and at least one thermally conductive pillar is disposed on the second side of the circuit structure and extends into the circuit structure to thermally conduct the first metal layer and the second metal layer. Therefore, through the thermally conductive pillar, heat generated during operations of the first electronic element and the second electronic element can be quickly dissipated to an external environment and would not accumulate.Type: GrantFiled: August 25, 2021Date of Patent: September 19, 2023Inventors: Meng-Huan Chia, Yih-Jenn Jiang, Chang-Fu Lin, Don-Son Jiang
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Patent number: 11742296Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.Type: GrantFiled: December 28, 2020Date of Patent: August 29, 2023Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
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Publication number: 20230268328Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.Type: ApplicationFiled: April 28, 2023Publication date: August 24, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chang-Fu LIN, Chi-Hsin Chiu
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Patent number: 11676948Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.Type: GrantFiled: June 3, 2021Date of Patent: June 13, 2023Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin, Chi-Hsin Chiu
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Patent number: 11605554Abstract: A flip-chip process is to provide a pressing jig with a channel, so that the pressing jig grips a chip module by vacuum suction through the channel, and the chip module can be bonded onto a circuit board via a plurality of solder bumps through the pressing jig, and then a heating device is provided to heat the plurality of solder bumps and reflow the plurality of solder bumps. Therefore, the chip module can be vacuum-gripped by the pressing jig to suppress deformation of the chip module, so that the solder bumps can effectively connect to corresponding contacts of the circuit board.Type: GrantFiled: August 3, 2021Date of Patent: March 14, 2023Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
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Publication number: 20230053125Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.Type: ApplicationFiled: November 1, 2022Publication date: February 16, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
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Publication number: 20230015721Abstract: An electronic package is provided, in which a first electronic element and a second electronic element are disposed on a first side of a circuit structure and a second side of the circuit structure, respectively, where a first metal layer is formed between the first side of the circuit structure and the first electronic element, a second metal layer is formed on a surface of the second electronic element, and at least one thermally conductive pillar is disposed on the second side of the circuit structure and extends into the circuit structure to thermally conduct the first metal layer and the second metal layer. Therefore, through the thermally conductive pillar, heat generated during operations of the first electronic element and the second electronic element can be quickly dissipated to an external environment and would not accumulate.Type: ApplicationFiled: August 25, 2021Publication date: January 19, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Meng-Huan Chia, Yih-Jenn Jiang, Chang-Fu Lin, Don-Son Jiang
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Publication number: 20230014476Abstract: An electronic package, in which a heat dissipation structure is disposed on a carrier structure to form a packaging space for electronic components to be accommodated in the packaging space, and the electronic components are completely encapsulated by a heat dissipation material to prevent the electronic components exposing from the heat dissipation material so as to improve the heat dissipation effect.Type: ApplicationFiled: June 27, 2022Publication date: January 19, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
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Publication number: 20220406642Abstract: A flip-chip process is to provide a pressing jig with a channel, so that the pressing jig grips a chip module by vacuum suction through the channel, and the chip module can be bonded onto a circuit board via a plurality of solder bumps through the pressing jig, and then a heating device is provided to heat the plurality of solder bumps and reflow the plurality of solder bumps. Therefore, the chip module can be vacuum-gripped by the pressing jig to suppress deformation of the chip module, so that the solder bumps can effectively connect to corresponding contacts of the circuit board.Type: ApplicationFiled: August 3, 2021Publication date: December 22, 2022Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
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Patent number: 11532528Abstract: An electronic package and a method for manufacturing the electronic package are provided. The method includes forming a slope surface on at least one side surface of at least one of a plurality of electronic components, and then disposing the plurality of electronic components on a carrier structure, such that the two adjacent electronic components form a space by the slope surface. Afterwards, an encapsulation layer is formed on the carrier structure and filled into the space to cover the two adjacent electronic components so as to disperse stress on the electronic components through the design of the space to prevent cracking due to stress concentration.Type: GrantFiled: January 28, 2021Date of Patent: December 20, 2022Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Chang-Fu Lin, Don-Son Jiang
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Publication number: 20220399245Abstract: Provided is an electronic package, in which a heat dissipating body is formed on an electronic device and is combined with a heat sink so that the electronic device, the heat dissipating body and the heat sink form a receiving space, and a heat dissipating material is formed in the receiving space and in contact with the heat sink and the electronic device, where a fluid regulating space is formed between the heat dissipating material and the heat dissipating body and is used as a volume regulating space for the heat dissipating material during thermal expansion and contraction.Type: ApplicationFiled: July 8, 2021Publication date: December 15, 2022Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
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Publication number: 20220392861Abstract: An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.Type: ApplicationFiled: July 7, 2021Publication date: December 8, 2022Applicant: SILICONWARE PRECISION INDUST RIES CO., LT D.Inventors: Chi-Ren Chen, Po-Yung Chang, Pei-Geng Weng, Yuan-Hung Hsu, Chang-Fu Lin, Don-Son Jiang