Patents by Inventor Chang-Gil Ryu
Chang-Gil Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11648644Abstract: A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit disposed at the distal end portion of the pivot arm. The head unit includes: a rotary motor provided in the internal space of the housing, the rotary motor including a rotary shaft; a foreign material blocking member connected to the rotary shaft; a disk holder connected to the rotary shaft; and a conditioning disk coupled to the disk holder. The foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member.Type: GrantFiled: July 22, 2019Date of Patent: May 16, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eun Seok Lee, Ja Eung Koo, Kuen Byul Kim, Jeong Min Na, Chang Gil Ryu, Hyeon Dong Song, Young Seok Jang, Jin Suk Hong
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Publication number: 20200206870Abstract: A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit disposed at the distal end portion of the pivot arm. The head unit includes: a rotary motor provided in the internal space of the housing, the rotary motor including a rotary shaft; a foreign material blocking member connected to the rotary shaft; a disk holder connected to the rotary shaft; and a conditioning disk coupled to the disk holder. The foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member.Type: ApplicationFiled: July 22, 2019Publication date: July 2, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eun Seok LEE, Ja Eung KOO, Kuen Byul KIM, Jeong Min NA, Chang Gil RYU, Hyeon Dong SONG, Young Seok JANG, Jin Suk HONG
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Patent number: 10576582Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.Type: GrantFiled: July 9, 2018Date of Patent: March 3, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young-Hoo Kim, Il-Sang Lee, Yong-sun Ko, Chang-Gil Ryu, Kun-Tack Lee, Hyo-San Lee
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Patent number: 10340158Abstract: Provided is a substrate cleaning apparatus including: a cleaning bath configured to accommodate a substrate having a first surface and a second surface; a substrate support configured to support the substrate; first and second nozzle bars provided in the cleaning bath to be rotatable in a plane parallel with the substrate, each of the first and the second nozzle bars including a passage; a plurality of nozzles provided along a longitudinal direction of each of the first and the second nozzle bars and configured to spray the cleaning solution from the passage of each of the first and the second nozzle bars to the substrate; and first and second brushes, the first brush provided on a first side of the substrate and configured to clean the first surface and the second brush provided on a second side of the substrate and configured to clean the second surface of the substrate.Type: GrantFiled: March 2, 2016Date of Patent: July 2, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eun-Seok Lee, Chang-Gil Ryu, Geun-Young Song, Jae-Chang Lee, Yun-Seok Choi, Jin-Suk Hong
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Publication number: 20180311764Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.Type: ApplicationFiled: July 9, 2018Publication date: November 1, 2018Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young-Hoo KIM, Il-Sang LEE, Yong-sun KO, Chang-Gil RYU, Kun-Tack LEE, Hyo-San LEE
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Patent number: 10029332Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.Type: GrantFiled: May 7, 2015Date of Patent: July 24, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young-Hoo Kim, Il-Sang Lee, Yong-sun Ko, Chang-Gil Ryu, Kun-Tack Lee, Hyo-San Lee
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Patent number: 9999957Abstract: A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.Type: GrantFiled: January 20, 2016Date of Patent: June 19, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yun-Seok Choi, Chang-Gil Ryu, Geun-Young Song, Ki-Yeon Chu, Jin-Suk Hong
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Publication number: 20160329219Abstract: Provided is a substrate cleaning apparatus including: a cleaning bath configured to accommodate a substrate having a first surface and a second surface; a substrate support configured to support the substrate; first and second nozzle bars provided in the cleaning bath to be rotatable in a plane parallel with the substrate, each of the first and the second nozzle bars including a passage; a plurality of nozzles provided along a longitudinal direction of each of the first and the second nozzle bars and configured to spray the cleaning solution from the passage of each of the first and the second nozzle bars to the substrate; and first and second brushes, the first brush provided on a first side of the substrate and configured to clean the first surface and the second brush provided on a second side of the substrate and configured to clean the second surface of the substrate.Type: ApplicationFiled: March 2, 2016Publication date: November 10, 2016Inventors: Eun-Seok LEE, Chang-Gil RYU, Geun-Young SONG, Jae-Chang LEE, Yun-Seok CHOI, Jin-Suk HONG
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Publication number: 20160236318Abstract: A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.Type: ApplicationFiled: January 20, 2016Publication date: August 18, 2016Inventors: Yun-Seok CHOI, Chang-Gil RYU, Geun-Young SONG, Ki-Yeon CHU, Jin-Suk HONG
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Publication number: 20160071745Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.Type: ApplicationFiled: May 7, 2015Publication date: March 10, 2016Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young-Hoo KIM, Il-Sang LEE, Yong-sun KO, Chang-Gil RYU, Kun-Tack LEE, Hyo-San LEE
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Patent number: 8033401Abstract: A wafer guide for preventing a wafer breakage in a semiconductor cleaning apparatus includes a lower supporter, side supporters, fixing units and stoppers. The lower supporter is provided with a plurality of slots formed with the same interval in a length direction to vertically stand a plurality of wafers thereon. The side supporters are structured and arranged in parallel at each side above the lower supporter. The side supporters support side end parts of the wafers. The fixing units are adapted to support both end parts of the lower supporter and the side supporters, and may be fixed to a bath. The stoppers are individually coupled to each of the fixing units. The stoppers are operable to generate an error in a close operation of holder units of the robot chuck when the robot chuck deviates from a normal alignment range, so as not to perform a wafer chucking, thereby preventing a wafer breakage during the wafer chucking.Type: GrantFiled: September 12, 2008Date of Patent: October 11, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Hea-Woong Lee, Chang-Gil Ryu, Byoung-Moon Yoon, Yong-Myung Jun, Kang-Hee Han
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Publication number: 20090067960Abstract: A wafer guide for preventing a wafer breakage in a semiconductor cleaning apparatus includes a lower supporter, side supporters, fixing units and stoppers. The lower supporter is provided with a plurality of slots formed with the same interval in a length direction to vertically stand a plurality of wafers thereon. The side supporters are structured and arranged in parallel at each side above the lower supporter. The side supporters support side end parts of the wafers. The fixing units are adapted to support both end parts of the lower supporter and the side supporters, and may be fixed to a bath. The stoppers are individually coupled to each of the fixing units. The stoppers are operable to generate an error in a close operation of holder units of the robot chuck when the robot chuck deviates from a normal alignment range, so as not to perform a wafer chucking, thereby preventing a wafer breakage during the wafer chucking.Type: ApplicationFiled: September 12, 2008Publication date: March 12, 2009Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hea-Woong LEE, Chang-Gil RYU, Byoung-Moon YOON, Yong-Myung JUN, Kang-Hee HAN
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Publication number: 20060292817Abstract: In a method of processing a semiconductor structure and a method of forming a capacitor for a semiconductor device using the same, a semiconductor structure may be cleaned using a cleaning solution having a surface tension lower than that of water. The semiconductor structure may be dried in an isopropyl alcohol vapor atmosphere.Type: ApplicationFiled: June 14, 2006Publication date: December 28, 2006Inventors: Cheol-Woo Park, Yong-Sun Ko, Byoung-Moon Yoon, Kyung-Hyun Kim, Kwang-Wook Lee, Chang-Gil Ryu, Sung-Ho Ha, Woo-Suck Song, Yong-Myung Jun, Seung-Yul Park