Patents by Inventor Chang-Hsu Yen

Chang-Hsu Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipating system
    Patent number: 9723752
    Abstract: A heat dissipating system including a casing body, a heat source and a piezoelectric fan is provided. The casing body includes an upper casing and a bottom case, wherein at least one of the upper casing and the bottom casing includes at least one air inlet. The heat source and the piezoelectric fan are both disposed in the casing body. The piezoelectric fan has an opening facing the heat source while the air inlet is adjacent to the opening. Air is adsorbed into the opening through the air inlet and is exhausted out towards a direction of the heat source by the piezoelectric fan.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: August 1, 2017
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Chang-Hsu Yen, Chien-Yu Lin
  • HEAT DISSIPATING SYSTEM
    Publication number: 20140338868
    Abstract: A heat dissipating system including a casing body, a heat source and a piezoelectric fan is provided. The casing body includes an upper casing and a bottom case, wherein at least one of the upper casing and the bottom casing includes at least one air inlet. The heat source and the piezoelectric fan are both disposed in the casing body. The piezoelectric fan has an opening facing the heat source while the air inlet is adjacent to the opening. Air is adsorbed into the opening through the air inlet and is exhausted out towards a direction of the heat source by the piezoelectric fan.
    Type: Application
    Filed: May 15, 2014
    Publication date: November 20, 2014
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chang-Hsu Yen, Chien-Yu Lin
  • Circuit board with via hole and electronic device equipped with the same
    Patent number: 8570765
    Abstract: A circuit board includes a main body, an electronic component, a fixing portion and at least one via hole. The electronic component and the fixing portion are disposed on the main body. The at least one via hole is formed on the main body and adjacent to the fixing portion.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: October 29, 2013
    Assignee: ASUSTeK Computer Inc.
    Inventors: Cheng-Yu Wang, Chang-Hsu Yen
  • CIRCUIT BOARD WITH VIA HOLE AND ELECTRONIC DEVICE EQUIPPED WITH THE SAME
    Publication number: 20120051008
    Abstract: A circuit board includes a main body, an electronic component, a fixing portion and at least one via hole. The electronic component and the fixing portion are disposed on the main body. The at least one via hole is formed on the main body and adjacent to the fixing portion.
    Type: Application
    Filed: August 31, 2010
    Publication date: March 1, 2012
    Inventors: Cheng-Yu Wang, Chang-Hsu Yen
  • Cooling fan assembly for electric apparatus
    Patent number: 7458767
    Abstract: A cooling fan assembly for an electronic apparatus includes a casing and first and second centrifugal fans for creating airflow through the casing to dissipate heat associated generated by the electronic apparatus. The casing has at least first and second air inlets and an air outlet. The first centrifugal fan is received in the casing and positioned proximate the air outlet, and the second centrifugal fan juxtaposed with the first centrifugal fan is also received in the casing and positioned proximate the air outlet and indirect fluid communication therewith. The first and second centrifugal fans and the casing further are configured such that the airflow is effectively induced to form a high-pressure volute tongue in a region bounded by the first and second centrifugal fans and the air outlet.
    Type: Grant
    Filed: December 16, 2005
    Date of Patent: December 2, 2008
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Kuo-Hsien Wu, Chang-Hsu Yen
  • Cooling fan assembly for electronic apparatus
    Publication number: 20060280601
    Abstract: A cooling fan assembly for an electronic apparatus includes a casing and first and second centrifugal fans for creating airflow through the casing to dissipate heat associated generated by the electronic apparatus. The casing has at least first and second air inlets and an air outlet. The first centrifugal fan is received in the casing and positioned proximate the air outlet, and the second centrifugal fan juxtaposed with the first centrifugal fan is also received in the casing and positioned proximate the air outlet and indirect fluid communication therewith. The first and second centrifugal fans and the casing further are configured such that the airflow is effectively induced to form a high-pressure volute tongue in a region bounded by the first and second centrifugal fans and the air outlet.
    Type: Application
    Filed: December 16, 2005
    Publication date: December 14, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Kuo-Hsien Wu, Chang-Hsu Yen