Patents by Inventor Chang Hung Chen
Chang Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11997888Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.Type: GrantFiled: December 13, 2021Date of Patent: May 28, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Sheng-Yu Chen, Chang-Lin Yeh, Yung-I Yeh
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Publication number: 20240147683Abstract: The invention provides a layout pattern of static random access memory, which comprises a plurality of fin structures on a substrate, a plurality of gate structures on the substrate and spanning the fin structures to form a plurality of transistors distributed on the substrate. The transistors include a first pull-up transistor (PU1), a first pull-down transistor (PD1), a second pull-up transistor (PU2) and a second pull-down transistor (PD2), a first access transistor (PG1), a second access transistor (PG2), a first read port transistor (RPD) and a second read port transistor (RPG). The gate structure of the first read port transistor (RPD) is connected to the gate structure of the first pull-down transistor (PD1), wherein a drain of the first pull-down transistor (PD1) is connected to a first voltage source Vss1, and a drain of the first read port transistor (RPD) is connected to a second voltage source Vss2.Type: ApplicationFiled: November 27, 2022Publication date: May 2, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Shu-Wei Yeh, Chang-Hung Chen
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Publication number: 20240145482Abstract: A thin film transistor includes a bottom gate, a semiconductor layer, a top gate, a first auxiliary conductive pattern, a source, and a drain. The semiconductor layer includes a first semiconductor region, a second semiconductor region, a first heavily doped region, a second heavily doped region, a third heavily doped region, a first lightly doped region, a second lightly doped region, and a third lightly doped region. The first heavily doped region and the second heavily doped region are respectively located on two sides of the first semiconductor region. Two ends of the second semiconductor region are directly connected to the third heavily doped region and the third lightly doped region, respectively. The top gate is electrically connected to the bottom gate. The source and the drain are respectively electrically connected to the third heavily doped region and the second heavily doped region of the semiconductor layer.Type: ApplicationFiled: December 19, 2022Publication date: May 2, 2024Applicant: AUO CorporationInventors: Ssu-Hui Lu, Chang-Hung Li, Kuo-Yu Huang, Maw-Song Chen
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Publication number: 20240142092Abstract: A light emitting device and a light source module are provided. The light emitting device includes a base, a conductive unit, a light unit, and a package. The base includes a first substrate and n through holes, and the through holes pass through the first substrate. The conductive unit includes m conductors that are separate from each other, and the conductors pass through the first substrate. The light unit is electrically connected to the conductors. The package includes a first package body surrounding the light unit and a second package body covering the light unit and the first package body. The first package body and the second package body have different optical properties. Furthermore, m and n are integers greater than or equal to 2, and m is greater than or equal to n.Type: ApplicationFiled: January 11, 2024Publication date: May 2, 2024Inventors: SHAN-HUI CHEN, JIN-TSAI LIN, CHANG-HUNG HSIEH
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Publication number: 20240142301Abstract: The present disclosure provides a sensing circuit, including a photo-sensing component, a first transistor, and a temperature-sensing component. The photo-sensing component is configured to receive a light and transmit a first current according to an intensity of the light. A gate terminal of the first transistor is configured to receive a first control circuit. The photo-sensing component and the first transistor are coupled in series between first and second nodes. The temperature-sensing component is coupled between the first and second nodes and is configured to generate a second current according to a temperature. The temperature-sensing component includes a channel structure, a first gate, a second gate, and a light-shielding structure. The channel structure is configured to transmit the second current.Type: ApplicationFiled: December 14, 2022Publication date: May 2, 2024Inventors: Ming-Yao CHEN, Chang-Hung LI, Shin-Shueh CHEN, Jui-Chi LO
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Patent number: 11971298Abstract: The present disclosure provides a sensing circuit, including a photo-sensing component, a first transistor, and a temperature-sensing component. The photo-sensing component is configured to receive a light and transmit a first current according to an intensity of the light. A gate terminal of the first transistor is configured to receive a first control circuit. The photo-sensing component and the first transistor are coupled in series between first and second nodes. The temperature-sensing component is coupled between the first and second nodes and is configured to generate a second current according to a temperature. The temperature-sensing component includes a channel structure, a first gate, a second gate, and a light-shielding structure. The channel structure is configured to transmit the second current.Type: GrantFiled: December 14, 2022Date of Patent: April 30, 2024Assignee: AUO CORPORATIONInventors: Ming-Yao Chen, Chang-Hung Li, Shin-Shueh Chen, Jui-Chi Lo
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Publication number: 20240124292Abstract: An auxiliary operation device for a droplet dispenser includes a droplet sensor, an imaging device and a processor. The droplet sensor has a detected area located between a droplet dispenser and a target area, wherein the droplet sensor detects a droplet output from the droplet dispenser, and outputs a corresponding droplet detection signal. The imaging device captures an image of the target area. The processor obtains a dripping time point at which the droplet passes through the detected area according to the droplet detection signal, and determines whether the target area is shielded within a first time range according to the image, so as to evaluate whether the droplet has successfully dropped into the target area. The above-mentioned auxiliary operating device of the droplet dispenser can objectively determine whether the droplets successfully drops into the target area, and improve the accuracy of judgment.Type: ApplicationFiled: October 13, 2023Publication date: April 18, 2024Inventors: SHAO HUNG HUANG, CHAO-TING CHEN, FONG HAO KUO, CHI-YUAN KANG, Chang Mu WU
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Patent number: 11955070Abstract: A first driver circuit is configured to cooperate with a second driver circuit to control a display panel, wherein the first driver circuit is configured to output display data to a first area of the display panel and the second driver circuit is configured to output display data to a second area of the display panel. A method used for the first driver circuit includes outputting at least one emission control signal to control the second area of the display panel when the second driver circuit is disabled.Type: GrantFiled: November 22, 2021Date of Patent: April 9, 2024Assignee: NOVATEK Microelectronics Corp.Inventors: Kun-Zheng Lin, Chang-Hung Chen, Wei-Chieh Lin, Po-Sheng Liao
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Patent number: 11942385Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.Type: GrantFiled: March 29, 2022Date of Patent: March 26, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Sheng-Yu Chen, Chang-Lin Yeh, Ming-Hung Chen
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Patent number: 11943935Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region and a diffusion region on the substrate extending through the first cell region, the second cell region, the third cell region, and the fourth cell region. Preferably, the diffusion region includes a H-shape according to a top view.Type: GrantFiled: September 26, 2022Date of Patent: March 26, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chun-Yen Tseng, Shu-Ru Wang, Yu-Tse Kuo, Chang-Hung Chen, Yi-Ting Wu, Shu-Wei Yeh, Ya-Lan Chiou, Chun-Hsien Huang
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Patent number: 11868187Abstract: A circuit board includes a board body, a card slot, a release structure, and a transmission mechanism. The card slot is disposed on the board body and adapted for inserting an expansion card. The release structure is rotatably disposed beside the card slot. The transmission mechanism includes a contact part and a stressed part that are linked to each other, wherein the contact part is connected to the release structure. When the stressed part receives an external force, the contact part is moved correspondingly, so that the release structure is rotated relative to the card slot, thereby releasing the expansion card.Type: GrantFiled: March 31, 2022Date of Patent: January 9, 2024Assignee: ASUSTEK COMPUTER INC.Inventors: Po-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
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Patent number: 11853131Abstract: A circuit board is applied to be inserted an expansion card, the expansion card includes a positioning part. The circuit board includes a board body, a slot, a release structure and a transmission mechanism. The slot is disposed on the board body. The release structure is movably disposed beside the slot along a first direction, and includes a first inclined surface and a blocking portion for limiting the positioning part. The transmission mechanism includes a linkage part and a forcing part which are linked with each other. The linkage part is connected to the release structure. When the forcing part receives an external force, the linkage part moves to move the release structure to the first direction, and releases the limitation of the positioning part by the blocking portion.Type: GrantFiled: June 22, 2022Date of Patent: December 26, 2023Assignee: ASUSTeK COMPUTER INC.Inventors: Po-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
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Publication number: 20230396022Abstract: A circuit board is for inserting an expansion card with a positioning part. The circuit board includes a board body, a slot, a release assembly, and a transmission mechanism. The release assembly includes a release body, a blocking member, and an elastic member connected between the release body and the blocking member. The release body includes a blocking part for limiting the positioning part. The transmission mechanism includes a linkage part and a force applying part. When the force applying part receives an external force, the linkage part moves to move the release assembly toward a first direction, the elastic member returns to an original position to drive the blocking member to push against the positioning part to move out of the blocking part and to be located at a release position continuously, so as to release the limit of the positioning part by the blocking part.Type: ApplicationFiled: September 26, 2022Publication date: December 7, 2023Applicant: ASUSTeK COMPUTER INC.Inventors: Po-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
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Publication number: 20230251695Abstract: A circuit board is applied to be inserted an expansion card, the expansion card includes a positioning part. The circuit board includes a board body, a slot, a release structure and a transmission mechanism. The slot is disposed on the board body. The release structure is movably disposed beside the slot along a first direction, and includes a first inclined surface and a blocking portion for limiting the positioning part. The transmission mechanism includes a linkage part and a forcing part which are linked with each other. The linkage part is connected to the release structure. When the forcing part receives an external force, the linkage part moves to move the release structure to the first direction, and releases the limitation of the positioning part by the blocking portion.Type: ApplicationFiled: June 22, 2022Publication date: August 10, 2023Applicant: ASUSTeK COMPUTER INC.Inventors: Po-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
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Publication number: 20230251739Abstract: The disclosure provides a method for driving an OLED touch-and-display device, a driving circuit, and an OLED touch-and-display device.Type: ApplicationFiled: February 22, 2023Publication date: August 10, 2023Inventors: Hung-Hsiang Chen, Chang-Hung Chen, Huang-Chin Tang
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Patent number: 11696483Abstract: An OLED touch and display driver integration chip is provided, including: a group of display driving pads for providing display driving signals to the OLED touch display panel; a group of touch pads for providing touch driving signals to touch electrodes on the OLED touch display panel and/or receiving touch sensing signals from the touch electrodes, and adjacently arranged with the group of display driving pads; and at least one isolation pad arranged between the group of display driving pads and the group of touch pads.Type: GrantFiled: July 5, 2022Date of Patent: July 4, 2023Assignee: NOVATEK MICROELECTRONICS CORP.Inventors: Chang-Hung Chen, Kun-Zheng Lin, Wei-Chieh Lin, Po-Sheng Liao, Yu-Huang Chen
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Patent number: 11609657Abstract: The disclosure provides a method for driving an OLED touch-and-display device, a driving circuit, and an OLED touch-and-display device.Type: GrantFiled: May 6, 2021Date of Patent: March 21, 2023Assignee: NOVATEK MICROELECTRONICS CORP.Inventors: Hung-Hsiang Chen, Chang-Hung Chen, Huang-Chin Tang
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Publication number: 20230072319Abstract: An interface card assembly adapted for fixing an M.2 interface card to a circuit board body with an M.2 connector is provided. The M.2 interface card includes a connecting end and an end. The interface card assembly includes a heat dissipation plate and a fastener. The heat dissipation plate is disposed at a position adjacent to the M.2 connector, and the heat dissipation plate includes a hole. The fastener is detachably disposed in the hole. The fastener includes a main body and a cantilever, and a clamping part is disposed between the main body and the cantilever. When the M.2 interface card is inserted into the M.2 connector through the connecting end, the fastener moves relative to the heat dissipation plate at the end, so that the M.2 interface card extends into the clamping part and is clamped between the main body and the cantilever.Type: ApplicationFiled: June 8, 2022Publication date: March 9, 2023Applicant: ASUSTeK COMPUTER INC.Inventors: Po-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
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Patent number: 11574967Abstract: An organic light-emitting display (OLED) panel, including an OLED layer, a touch sensing layer, and a shielding layer, is provided. The OLED layer is suitable for displaying an image. The touch sensing layer is suitable for sensing a touch event of the OLED panel. The shielding layer is disposed between the OLED layer and the touch sensing layer. The shielding layer is suitable for blocking a mutual interference between the OLED layer and the touch sensing layer.Type: GrantFiled: December 14, 2020Date of Patent: February 7, 2023Assignee: Novatek Microelectronics Corp.Inventors: Po-Sheng Liao, Chang-Hung Chen
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Publication number: 20230018513Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region and a second cell region and a diffusion region on the substrate extending through the first cell region and the second cell region. Preferably, the diffusion region includes a first H-shape and a second H-shape according to a top view.Type: ApplicationFiled: September 26, 2022Publication date: January 19, 2023Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chun-Yen Tseng, Shu-Ru Wang, Yu-Tse Kuo, Chang-Hung Chen, Yi-Ting Wu, Shu-Wei Yeh, Ya-Lan Chiou, Chun-Hsien Huang