Abstract: Cooling apparatuses and a system including the same may be provided. The cooling apparatus including a freezer, a first cooling unit configured to cool a first cooling water supplied to the freezer in open air, and a second cooling unit configured to cool a second cooling water supplied to the first cooling unit may be provided. According to a temperature difference between the open air and the first cooling water, the second cooling unit may circulate the second cooling water separately with respect to the first cooling water or mix the second cooling water into the first cooling water.

Abstract: Cooling apparatuses and a system including the same may be provided. The cooling apparatus including a freezer, a first cooling unit configured to cool a first cooling water supplied to the freezer in open air, and a second cooling unit configured to cool a second cooling water supplied to the first cooling unit may be provided. According to a temperature difference between the open air and the first cooling water, the second cooling unit may circulate the second cooling water separately with respect to the first cooling water or mix the second cooling water into the first cooling water.

Abstract: A wafer edge etching apparatus and method for etching an edge of a semiconductor wafer including a bottom electrode, arranged below the semiconductor wafer and acting as a stage to support the semiconductor wafer. A method of etching a semiconductor wafer including inserting a semiconductor wafer into a chamber, increasing a pressure in the chamber, supplying at least one etchant gas to the chamber while further increasing the pressure, supplying power to the chamber and etching the semiconductor wafer at the edge bead or the backside of the semiconductor wafer, discontinuing the power and the etchant gas, venting the chamber with a venting gas, and purging the venting gas from the chamber.