Abstract: Provided is an image processing device configured to compress first image data. The image processing device includes an encoding circuit configured to compress the first image data into second image data including prediction data and residual data, compress the second image data into third image data by performing entropy encoding on the second image data, generate a header representing a compression ratio of the third image data, and store the third image data along with the header in a memory device as compressed first image data.

Abstract: A method for controlling an electric heater of a vehicular heating, ventilation, and air conditioning (HVAC) system includes turning on the electric heater; determining whether an ambient air temperature of a vehicle is higher than or equal to a threshold ambient air temperature, and a battery temperature is lower than or equal to a threshold battery temperature; determining whether battery efficiency is lower than or equal to threshold efficiency when the ambient air temperature of the vehicle is higher than or equal to the threshold ambient air temperature, and the battery temperature is lower than or equal to the threshold battery temperature; and turning off the electric heater when the battery efficiency is lower than or equal to the threshold efficiency, wherein the electric heater is configured to receive electric energy from the battery.

Abstract: Disclosed is a solid oxide fuel cell power generation system including: a fuel cell module; a blower for supplying a gaseous fuel to the fuel cell module; an air supplier for supplying air to the fuel cell module; and a fuel supplier for supplying the gaseous fuel to the blower. The blower recycles at least a portion of an unreacted gaseous fuel to the fuel cell module.

Abstract: Discloses is a hermetic blower for high-temperature gas, including: a blower unit in which the inside is hermetic so as to prevent an internal working fluid from being leaked to the outside; a motor unit supplying power to the blower unit; and a magnetic coupling unit connecting the blower unit and the motor unit by using a magnetic force.

Abstract: Disclosed is a solid oxide fuel cell power generation system including: a fuel cell module; a blower for supplying a gaseous fuel to the fuel cell module; an air supplier for supplying air to the fuel cell module; and a fuel supplier for supplying the gaseous fuel to the blower. The blower recycles at least a portion of an unreacted gaseous fuel to the fuel cell module.

Abstract: Discloses is a hermetic blower for high-temperature gas, including: a blower unit in which the inside is hermetic so as to prevent an internal working fluid from being leaked to the outside; a motor unit supplying power to the blower unit; and a magnetic coupling unit connecting the blower unit and the motor unit by using a magnetic force.

Abstract: An Augmented Reality (AR) providing method using an instant marker or a substitution marker is provided. According to an example, the instant marker or the substitution marker is created based on a 3-dimensional object. A meaning unit of an original 2-dimensional marker is analyzed and a marker factor corresponding to the meaning unit is extracted from the image of an object that is to be used to the instant marker or substitution marker. The meaning unit is mapped to the marker factor to create the instant marker or the substitution marker based on the object, so that a user may use AR using the instant marker or substitution marker.

Abstract: Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without application of additional plating and conductive paste-filling steps are connected to via holes of the insulating layers filled with a conductive paste.

Abstract: Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.

Abstract: Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.

Abstract: Disclosed is a method of fabricating a multilayer PCB (MLB). More particularly, the present invention relates to a method of fabricating a multilayer PCB, in which plural circuit layers having insulating layers attached thereto and another circuit layer having no insulating layer are formed in a parallel manner according to separate processes, and laminated at one time, unlike fabrication of the multilayer PCB adopting a conventional build-up manner.

Abstract: Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without application of additional plating and conductive paste-filling steps are connected to via holes of the insulating layers filled with a conductive paste.

Abstract: Disclosed is a method of fabricating a multi-layered PCB, wherein a plurality of circuit layers on which circuit patterns are constructed and insulating layers which are alternately positioned between the circuit layers to insulate the circuit layers from each other are severally fabricated according to different processes, and then layered with each other at once.