Patents by Inventor Chang Kyung WOO

Chang Kyung WOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for surface-treating printed circuit board and printed circuit board
    Patent number: 8915419
    Abstract: Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate. According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: December 23, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Su Jin Lee, Hye In Kim, Young Kwan Lee, Chang Kyung Woo, Je Kyoung Kim
  • METHOD FOR SURFACE-TREATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
    Publication number: 20130025913
    Abstract: Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate. According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.
    Type: Application
    Filed: June 15, 2012
    Publication date: January 31, 2013
    Inventors: Su Jin LEE, Hye In KIM, Young Kwan LEE, Chang Kyung WOO, Je Kyoung KIM