Patents by Inventor Chang-Min Lin
Chang-Min Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128148Abstract: A method includes attaching a package component to a package substrate, the package component includes: an interposer disposed over the package substrate; a first die disposed along the interposer; and a second die disposed along the interposer, the second die being laterally adjacent the first die; attaching a first thermal interface material to the first die, the first thermal interface material being composed of a first material; attaching a second thermal interface material to the second die, the second thermal interface material being composed of a second material different from the first material; and attaching a lid assembly to the package substrate, the lid assembly being further attached to the first thermal interface material and the second thermal interface material.Type: ApplicationFiled: January 6, 2023Publication date: April 18, 2024Inventors: Chang-Jung Hsueh, Po-Yao Lin, Hui-Min Huang, Ming-Da Cheng, Kathy Yan
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Publication number: 20240128219Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.Type: ApplicationFiled: December 6, 2023Publication date: April 18, 2024Inventors: Hui-Min Huang, Wei-Hung Lin, Kai Jun Zhan, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng
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Patent number: 11961817Abstract: An apparatus for forming a package structure is provided. The apparatus includes a processing chamber for bonding a first package component and a second package component. The apparatus also includes a bonding head disposed in the processing chamber. The bonding head includes a plurality of vacuum tubes communicating with a plurality of vacuum devices. The apparatus further includes a nozzle connected to the bonding head and configured to hold the second package component. The nozzle includes a plurality of first holes that overlap the vacuum tubes. The nozzle also includes a plurality of second holes offset from the first holes, wherein the second holes overlap at least two edges of the second package component. In addition, the apparatus includes a chuck table disposed in the processing chamber, and the chuck table is configured to hold and heat the first package component.Type: GrantFiled: July 8, 2021Date of Patent: April 16, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kai Jun Zhan, Chang-Jung Hsueh, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng
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Publication number: 20240096787Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.Type: ApplicationFiled: November 29, 2023Publication date: March 21, 2024Inventors: Ming-Da CHENG, Wei-Hung LIN, Hui-Min HUANG, Chang-Jung HSUEH, Po-Hao TSAI, Yung-Sheng LIN
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Publication number: 20240088119Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii
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Patent number: 11894674Abstract: A power detection circuit is provided. The protection circuit is coupled to a pad and includes a trigger circuit and a discharge circuit. The trigger circuit includes a first transistor of a first conductivity type and a second transistor, also of the first conductivity type, which are coupled in series between the pad and a ground terminal. The trigger circuit detects whether a transient even occurs on the pad. The discharge circuit is coupled between the bonding pad and the ground terminal and controlled by the trigger circuit. In response to the transient event occurring on the bonding pad, the trigger circuit generates a trigger voltage to trigger the discharge circuit to provide a discharge path between the pad and the ground terminal.Type: GrantFiled: May 11, 2022Date of Patent: February 6, 2024Assignee: Vanguard International Semiconductor CorporationInventors: Jian-Hsing Lee, Yeh-Ning Jou, Chih-Hsuan Lin, Chang-Min Lin, Hwa-Chyi Chiou
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Publication number: 20240028813Abstract: A semiconductor layout including a semiconductor layer and a dummy layer is provided. The semiconductor layer includes a layout pattern. The dummy layer includes a dummy pattern. A check circuit calculates the layout pattern and the dummy pattern to generate a calculated value. The check circuit compares the calculated value to the predetermined value to determine whether the layout pattern has been modified.Type: ApplicationFiled: July 25, 2022Publication date: January 25, 2024Applicant: Vanguard International Semiconductor CorporationInventors: Yeh-Ning JOU, Chih-Hsuan LIN, Shu-Pin HSU, Hwa-Chyi CHIOU, Chang-Min LIN, Tsong-Shyan CHEN
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Publication number: 20230369848Abstract: A power detection circuit is provided. The protection circuit is coupled to a pad and includes a trigger circuit and a discharge circuit. The trigger circuit includes a first transistor of a first conductivity type and a second transistor, also of the first conductivity type, which are coupled in series between the pad and a ground terminal. The trigger circuit detects whether a transient even occurs on the pad. The discharge circuit is coupled between the bonding pad and the ground terminal and controlled by the trigger circuit. In response to the transient event occurring on the bonding pad, the trigger circuit generates a trigger voltage to trigger the discharge circuit to provide a discharge path between the pad and the ground terminal.Type: ApplicationFiled: May 11, 2022Publication date: November 16, 2023Applicant: Vanguard International Semiconductor CorporationInventors: Jian-Hsing LEE, Yeh-Ning JOU, Chih-Hsuan LIN, Chang-Min LIN, Hwa-Chyi CHIOU
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Patent number: 11811222Abstract: An electrostatic discharge (ESD) protection circuit including a detection circuit, a voltage-divider element, and a discharge element is provided. The detection circuit is coupled between a first power line and a second power line. In response to an ESD event, the detection circuit enables a turn-on signal. The voltage-divider element is coupled between the first power line and a third power line and receives the turn-on signal. The discharge element is coupled between the second and third power lines. In response to the turn-on signal being enabled, the first discharge element discharges an ESD current.Type: GrantFiled: December 16, 2021Date of Patent: November 7, 2023Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATIONInventors: Yeh-Ning Jou, Chieh-Yao Chuang, Hsien-Feng Liao, Ting-Yu Chang, Chih-Hsuan Lin, Chang-Min Lin, Shao-Chang Huang, Ching-Ho Li
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Publication number: 20230343780Abstract: An electrostatic discharge (ESD) protection structure including a P-type substrate, a P-type structure, an N-type buried layer, an element active region, a P-type guard ring, and an N-type structure is provided. The P-type structure is formed in the P-type substrate and serves as an electrical contact of the P-type substrate. The N-type buried layer is formed in the P-type substrate. The element active region is formed on the N-type buried layer. The P-type guard ring is formed on the N-type buried layer and surrounds the element active region. The N-type structure is formed on the N-type buried layer and disposed between the P-type guard ring and the P-type structure.Type: ApplicationFiled: April 20, 2022Publication date: October 26, 2023Applicant: Vanguard International Semiconductor CorporationInventors: Chang-Min LIN, Chih-Hsuan LIN, Yeh-Ning JOU, Hwa-Chyi CHIOU, Jian-Hsing LEE
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Publication number: 20230198250Abstract: An electrostatic discharge (ESD) protection circuit including a detection circuit, a voltage-divider element, and a discharge element is provided. The detection circuit is coupled between a first power line and a second power line. In response to an ESD event, the detection circuit enables a turn-on signal. The voltage-divider element is coupled between the first power line and a third power line and receives the turn-on signal. The discharge element is coupled between the second and third power lines. In response to the turn-on signal being enabled, the first discharge element discharges an ESD current.Type: ApplicationFiled: December 16, 2021Publication date: June 22, 2023Applicant: Vanguard International Semiconductor CorporationInventors: Yeh-Ning JOU, Chieh-Yao CHUANG, Hsien-Feng LIAO, Ting-Yu CHANG, Chih-Hsuan LIN, Chang-Min LIN, Shao-Chang HUANG, Ching-Ho LI
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Patent number: 11296503Abstract: An electrostatic discharge protection (ESD) circuit is provided for a semiconductor element. The semiconductor element includes first and second drain/source electrodes and is surrounded by a deep well region. The ESD circuit includes a first control circuit and a first discharge circuit. The first control circuit is electrically connected between the first drain/source electrode and a power terminal and includes a first control terminal electrically connected to the deep well region and generates a first control signal. The first discharge circuit is controlled by the first control signal. When an electrostatic discharge event occurs on the first drain/source electrode, the first control circuit generates the first control signal according to potential states of the deep well region and the first drain/source electrode, and the first discharge circuit provides a first discharge path between the first drain/source electrode and the power terminal according to the first control signal.Type: GrantFiled: December 29, 2020Date of Patent: April 5, 2022Assignee: Vanguard International Semiconductor CorporationInventors: Yu-Kai Wang, Chang-Min Lin, Jian-Hsing Lee
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Patent number: 10961100Abstract: A magnetic screwdriver device includes a pad without magnetism, a driving shaft, and a driven shaft. The two shafts, magnetically attracted to each other, are disposed on opposite sides of the pad. The driving shaft is used to transmit a torque to rotate the driven shaft. When the torque exceeds a predetermined value to overcome a friction force between the driven shaft and the pad, the driven shaft would be stopped.Type: GrantFiled: March 28, 2019Date of Patent: March 30, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE HInventors: Chang-Min Lin, Wei-Chieh Chang, Hsuan-Yu Huang
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Patent number: 10780439Abstract: A magnetic screwdriver device includes one pad without magnetism, one driving shaft, and one driven shaft. The two shafts, which have magnetic attraction between each other, are disposed on opposite sides of the pad respectively and attract to each other. The driving shaft is used to transmit torque to actuate the driven shaft rotation. When the torque out of predetermined value overcomes the friction force between the driven shaft and the pad, the driven shaft will be stop.Type: GrantFiled: August 31, 2018Date of Patent: September 22, 2020Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chang-Min Lin, Wei-Chieh Chang, Hsuan-Yu Huang
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Publication number: 20200071148Abstract: A magnetic screwdriver device includes a pad without magnetism, a driving shaft, and a driven shaft. The two shafts, magnetically attracted to each other, are disposed on opposite sides of the pad. The driving shaft is used to transmit a torque to rotate the driven shaft. When the torque exceeds a predetermined value to overcome a friction force between the driven shaft and the pad, the driven shaft would be stopped.Type: ApplicationFiled: March 28, 2019Publication date: March 5, 2020Inventors: CHANG-MIN LIN, WEI-CHIEH CHANG, HSUAN-YU HUANG
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Publication number: 20200070149Abstract: A magnetic screwdriver device includes one pad without magnetism, one driving shaft, and one driven shaft. The two shafts, which have magnetic attraction between each other, are disposed on opposite sides of the pad respectively and attract to each other. The driving shaft is used to transmit torque to actuate the driven shaft rotation. When the torque out of predetermined value overcomes the friction force between the driven shaft and the pad, the driven shaft will be stop.Type: ApplicationFiled: August 31, 2018Publication date: March 5, 2020Inventors: CHANG-MIN LIN, Wei-Chieh Chang, Hsuan-Yu Huang
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Patent number: 7181515Abstract: A method of accessing data from distributed field equipments by a host through a set of intelligent network gateways is disclosed. The intelligent network gateways link the host on a local area network to the field equipments that are connected to a control network. Initially, configuration software residing in the host is employed to install the intelligent network gateways and the field equipments as a set of virtual equipment data servers, which are capable of continuously accessing, updating, and storing data from the field equipments. The virtual equipment data servers always possess the field equipments' most recent data and are able to communicate to any application program with a standard communication protocol. The method and apparatus facilitate the integration of a variety of field equipments with high-speed data links in a factory environment.Type: GrantFiled: January 24, 2003Date of Patent: February 20, 2007Assignee: Industrial Technology Research InstituteInventors: Chang-Min Lin, Jia-Cheng Ke, Chang-Hsieh Wu, Che-Lung Wang
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Publication number: 20040148371Abstract: A method of accessing data from field equipments by the host through intelligent network gateways which link field equipments over control network and the host over local area network is disclosed. A configuration software in the host is used to install intelligent network gateways and field equipments as virtual equipment data servers. After finishing installation, the virtual equipment data servers accessupdate store data of the field equipments continuously. Now, the virtual equipment data servers always possess the last field equipment data and can link any application program with a standard communication protocol. The application can integrate easily and high speed access data of a various of field equipments in the factory with only one standard communication protocol through distributed virtual equipment data servers.Type: ApplicationFiled: January 24, 2003Publication date: July 29, 2004Inventors: Chang-Min Lin, Jia-Cheng Ke, Chang-Hsieh Wu, Che-Lung Wang
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Patent number: D425388Type: GrantFiled: May 4, 1999Date of Patent: May 23, 2000Inventor: Chang-Min Lin