Abstract: A method and device for issuing an identity certificate to a blockchain node in a blockchain network includes issuing a first identity certificate to a first terminal. a second identity certificate issuance request that is from the first terminal and that is made by using the first identity certificate is received and a second identity certificate is issued to the first terminal, which forwards the second identity certificate to a second terminal. A third identity certificate issuance request that is from the second terminal and that is made by using the second identity certificate is received and a third identity certificate is issued to the second terminal, which forwards the third identity certificate to a third terminal.

Abstract: An identity certificate may be issued to a blockchain node. The issuance may include issuing a first identity certificate to a first terminal and receiving a second identity certificate issuance request that is from the first terminal. A second identity certificate may be issued to the first terminal, and a third identity certificate issuance request is received from the second terminal. A third identity certificate is issued to the second terminal, so that the second terminal forwards the third identity certificate to the third terminal.

Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Abstract: Disclosed is a signal filter assembly, which includes a circuit board electrically connected between a cable and a high frequency electric connector, and a plurality of filters installed in the circuit board and respectively electrically connected to the signal wires of the transmission wires of the cable, each filter being formed of a parallel circuit of a resistor and a capacitor.

Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Abstract: A wall plate assembly includes a wall plate with an insertion slot for the installation of a HDMI (High-Definition Multimedia Interface) connector of a HDMI cable, a signal amplifier connected to the back side of the wall plate for receiving the installed HDMI connector and amplifying the signal, and a support device, which comprises a vertical support frame vertically adjustably fastened to the wall plate below the insertion slot and a horizontal support frame horizontally adjustably fastened to the vertical support frame for holding down the installed HDMI connector on the vertical support frame.

Abstract: Disclosed is a signal filter assembly, which includes a circuit board electrically connected between a cable and a high frequency electric connector, and a plurality of filters installed in the circuit board and respectively electrically connected to the signal wires of the transmission wires of the cable, each filter being formed of a parallel circuit of a resistor and a capacitor.