Patents by Inventor Chang Seok KWAK

Chang Seok KWAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE
    Publication number: 20240120276
    Abstract: A three-dimensional semiconductor integrated circuit device including an inter-die interface is provided. The device includes a top die including a plurality of micro cells provided on a top surface of the top die, a plurality of micro bumps provided on a bottom surface of the top die, and wiring patterns connecting the plurality of micro cells to the plurality of micro bumps; and a bottom die including a plurality of macro cells provided on a top surface thereof, wherein the plurality of macro cells are electrically connected to the plurality of micro bumps, respectively, wherein a size of a region in which the plurality of micro cells are provided is smaller than a size of a region in which the plurality of micro bumps are provided.
    Type: Application
    Filed: July 27, 2023
    Publication date: April 11, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Seung CHOI, Byung-Su KIM, Bong Il PARK, Chang Seok KWAK, Sun Hee PARK, Sang Joon CHEON