Patents by Inventor Changyang WANG
Changyang WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11985752Abstract: An inductor assembly includes a fixture element having a central core and support structures coupled to and projecting outwardly from the central core, each of the support structures having an outer edge with a notched profile of indentations extending toward the central core, and a helical inductor having multiple turns, the turns being seated in the indentations of the at least two support structures. The support structures may be equidistantly spaced apart from one another about the central core by air gaps. The inductor assembly may be incorporated in an impedance matching network, and one or more impedance matching networks may be incorporated in a defrosting system. The impedance matching network may be a single-ended network or a double-ended network.Type: GrantFiled: August 31, 2020Date of Patent: May 14, 2024Assignee: NXP USA, Inc.Inventors: Qi Hua, Tonghe Liu, Changyang Wang
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Patent number: 11956880Abstract: A system includes an RF signal source configured to output an RF signal at a first frequency, and a first controller configured to generate a first data signal encoding instructions at a second frequency. A first filter is coupled to the RF signal source. The first filter is a low pass filter having a cutoff frequency between the first frequency and the second frequency. The first filter is configured to couple to a first end of a cable. A second filter is coupled to the first controller. The second filter is a high pass filter having a cutoff frequency between the first frequency and the second frequency. The second filter is configured to couple to the first end of the cable. The system includes an impedance matching network configured to couple to a second end of the cable. A first electrode is coupled to the impedance matching network.Type: GrantFiled: December 3, 2020Date of Patent: April 9, 2024Assignee: NXP USA, INC.Inventors: Qi Hua, Changyang Wang, Tonghe Liu
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Publication number: 20240063756Abstract: A Doherty amplifier includes first and second input terminals, first and second amplifiers, and an output combiner circuit. The first amplifier includes a first amplifier input coupled to the first input terminal, and a first amplifier output. The second amplifier includes a second amplifier input coupled to the second input terminal, and a second amplifier output. The output combiner circuit is coupled between the first amplifier output, the second amplifier output, and a final summing node. The output combiner circuit includes a first inductive element, a first capacitor integrated within an integrated passive device (IPD), and a second inductive element. The first inductive element is coupled between the first amplifier output and a first terminal of the first capacitor, and the second inductive element is coupled between a combining node and the first terminal of the first capacitor. A second terminal of the first capacitor is coupled to ground.Type: ApplicationFiled: November 4, 2022Publication date: February 22, 2024Inventors: Qi Hua, Yunfei Wang, Qi Wu, Changyang Wang
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Patent number: 11622424Abstract: A device includes an antenna configured to be disposed within a cavity of an appliance. The appliance includes an electrode and the antenna includes a sheet of conductive material having a surface area that is equal to or greater than a surface area of the electrode. The device includes a voltage sensor coupled to the antenna, an output device, and a controller coupled to the voltage sensor and the output device. The controller is configured to generate an output at the output device. The output is determined by a voltage of the antenna.Type: GrantFiled: October 29, 2019Date of Patent: April 4, 2023Assignee: NXP USA, Inc.Inventors: Qi Hua, Tonghe Liu, Changyang Wang, Dong Wu, David Paul Lester, Lionel Mongin
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Publication number: 20230050988Abstract: A radio frequency amplifier includes a first input terminal, a second input terminal, an output terminal, and first and second amplifiers. The first amplifier includes a first amplifier input coupled to the first input terminal, and a first amplifier output. The second amplifier includes a second amplifier input coupled to the second input terminal, and a second amplifier output coupled to the output terminal by an output inductive element. An output combiner circuit is coupled between the first amplifier output and the second amplifier output. The output combiner circuit includes a first inductive element, a capacitor, and a second inductive element. The first inductive element is coupled between the first amplifier output and a first terminal of the capacitor, and the second inductive element is coupled between the second amplifier output and the first terminal of the capacitor. A second terminal of the capacitor is coupled to ground.Type: ApplicationFiled: September 2, 2022Publication date: February 16, 2023Inventors: Qi Hua, Qi Wu, Tonghe Liu, Wenming Li, Changyang Wang
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Publication number: 20220086965Abstract: A system includes an RF signal source configured to output an RF signal at a first frequency, and a first controller configured to generate a first data signal encoding instructions at a second frequency. A first filter is coupled to the RF signal source. The first filter is a low pass filter having a cutoff frequency between the first frequency and the second frequency. The first filter is configured to couple to a first end of a cable. A second filter is coupled to the first controller. The second filter is a high pass filter having a cutoff frequency between the first frequency and the second frequency. The second filter is configured to couple to the first end of the cable. The system includes an impedance matching network configured to couple to a second end of the cable. A first electrode is coupled to the impedance matching network.Type: ApplicationFiled: December 3, 2020Publication date: March 17, 2022Inventors: Qi HUA, Changyang WANG, Tonghe LIU
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Publication number: 20210368591Abstract: An inductor assembly includes a fixture element having a central core and support structures coupled to and projecting outwardly from the central core, each of the support structures having an outer edge with a notched profile of indentations extending toward the central core, and a helical inductor having multiple turns, the turns being seated in the indentations of the at least two support structures. The support structures may be equidistantly spaced apart from one another about the central core by air gaps. The inductor assembly may be incorporated in an impedance matching network, and one or more impedance matching networks may be incorporated in a defrosting system. The impedance matching network may be a single-ended network or a double-ended network.Type: ApplicationFiled: August 31, 2020Publication date: November 25, 2021Inventors: Qi Hua, Tonghe Liu, Changyang Wang
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Publication number: 20210360753Abstract: A thermal increase system may include first and second cavities disposed on opposite sides of a first electrode. The first cavity may have a first height that is approximately equal to a second height of the second cavity. The first electrode may be disposed within a containment structure that is capacitively coupled to the first electrode. An upper wall of the containment structure may include a second electrode that is capacitively coupled to the first electrode. A bottom wall of the containment structure may include a third electrode that is capacitively coupled to the first electrode. The first electrode may receive the RF signal from an RF signal source, which may cause electric field magnitudes within the first and second cavities to increase, which may increase the temperature of loads disposed within the first and/or second cavities.Type: ApplicationFiled: October 8, 2020Publication date: November 18, 2021Inventors: Qi Hua, Tonghe Liu, Changyang Wang
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Patent number: 10925125Abstract: A solid-state heating apparatus may be incorporated into stand-alone appliances or other systems. The heating apparatus may include an impedance matching network coupled between an electrode and a radio-frequency (RF) source. The impedance matching network may be a variable impedance matching network that can be adjusted during the heating operation. The impedance matching network may include planar inductors formed from patterned conductive layers disposed either side of a substrate.Type: GrantFiled: August 28, 2018Date of Patent: February 16, 2021Assignee: NXP USA, Inc.Inventors: Qi Hua, Changyang Wang
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Publication number: 20200389949Abstract: A device includes an antenna configured to be disposed within a cavity of an appliance. The appliance includes an electrode and the antenna includes a sheet of conductive material having a surface area that is equal to or greater than a surface area of the electrode. The device includes a voltage sensor coupled to the antenna, an output device, and a controller coupled to the voltage sensor and the output device. The controller is configured to generate an output at the output device. The output is determined by a voltage of the antenna.Type: ApplicationFiled: October 29, 2019Publication date: December 10, 2020Inventors: Qi Hua, Tonghe Liu, Changyang Wang, Dong Wu, David Paul Lester, Lionel Mongin
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Publication number: 20190208586Abstract: A solid-state heating apparatus may be incorporated into stand-alone appliances or other systems. The heating apparatus may include an impedance matching network coupled between an electrode and a radio-frequency (RF) source. The impedance matching network may be a variable impedance matching network that can be adjusted during the heating operation. The impedance matching network may include planar inductors formed from patterned conductive layers disposed either side of a substrate.Type: ApplicationFiled: August 28, 2018Publication date: July 4, 2019Inventors: Qi HUA, Changyang WANG