Patents by Inventor Chang-Yuan Wu

Chang-Yuan Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124292
    Abstract: An auxiliary operation device for a droplet dispenser includes a droplet sensor, an imaging device and a processor. The droplet sensor has a detected area located between a droplet dispenser and a target area, wherein the droplet sensor detects a droplet output from the droplet dispenser, and outputs a corresponding droplet detection signal. The imaging device captures an image of the target area. The processor obtains a dripping time point at which the droplet passes through the detected area according to the droplet detection signal, and determines whether the target area is shielded within a first time range according to the image, so as to evaluate whether the droplet has successfully dropped into the target area. The above-mentioned auxiliary operating device of the droplet dispenser can objectively determine whether the droplets successfully drops into the target area, and improve the accuracy of judgment.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 18, 2024
    Inventors: SHAO HUNG HUANG, CHAO-TING CHEN, FONG HAO KUO, CHI-YUAN KANG, Chang Mu WU
  • Publication number: 20240079230
    Abstract: A plasma-assisted annealing system includes a high temperature furnace, a plasma-induced dissociator and a connecting duct. The plasma-induced dissociator is provided to dissociate a working gas and exhaust the dissociated working gas from its working gas outlet. Both ends of the connecting duct are connected to the working gas outlet of the plasma-induced dissociator and a gas inlet of the high temperature furnace, respectively. The working gas dissociated in the plasma-induced dissociator is introduced into the high temperature furnace via the connecting duct.
    Type: Application
    Filed: December 12, 2022
    Publication date: March 7, 2024
    Inventors: Wei-Chen Tien, Cheng-Yuan Hung, Chang-Sin Ye, Chun-Kai Huang, Yii-Der Wu
  • Patent number: 11839050
    Abstract: A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion, wherein a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is adjacent to the heat dissipation portion, wherein the heat dissipation fan or the heat dissipation structure has an air flow guiding portion with a slot connected to the heat dissipation flow channel, the heat dissipation fan provides a heat dissipation air flow, and the air flow guiding portion guides a part of the heat dissipation air flow to pass through the slot along a direction not parallel to an outflow direction of the heat dissipation fan and then pass through the heat dissipation flow channel.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: December 5, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventor: Chang-Yuan Wu
  • Patent number: 10936028
    Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: March 2, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chih-Chin Chien, I-Feng Hsu, Ching-Chung Chen, Tse-Yang Lin, Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh, Chin-Hsien Chang, Chin-Yuan Chuang, Chia-Hung Lin
  • Publication number: 20200400618
    Abstract: A paper warping detection device comprises: an input tray for loading a plurality of pieces of paper to be fed; a processor for storing a first threshold; a first emitting unit disposed at a front end of the input tray that forms a first angle with the input tray, and then emits a first ultrasonic beam toward the input tray in an obliquely and downward direction; a first receiving unit which is disposed at the front end of the input tray and formed a second angle with the input tray for receiving the ultrasonic beam reflected by the paper loaded in the input tray in a direction leaned downward; and a first analog to digital converter which is electrically connected to the first receiving unit and the processor respectively, for converting the reflected first ultrasonic beam received by the first receiving unit into a first digital signals and outputting the first digital signals to the processor.
    Type: Application
    Filed: September 4, 2019
    Publication date: December 24, 2020
    Inventors: Ming Da Wu, Shih Sen Huang, Chang Yuan Wu
  • Publication number: 20200245498
    Abstract: A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion, wherein a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is adjacent to the heat dissipation portion, wherein the heat dissipation fan or the heat dissipation structure has an air flow guiding portion with a slot connected to the heat dissipation flow channel, the heat dissipation fan provides a heat dissipation air flow, and the air flow guiding portion guides a part of the heat dissipation air flow to pass through the slot along a direction not parallel to an outflow direction of the heat dissipation fan and then pass through the heat dissipation flow channel.
    Type: Application
    Filed: April 9, 2020
    Publication date: July 30, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventor: Chang-Yuan Wu
  • Patent number: 10506739
    Abstract: A laptop computer including a main body, a fan disposed in a receiving space of the main body, a keyboard assembly movably disposed on the main body, and a heat dissipation assembly movably disposed in the main body and linked with the keyboard assembly is provided. The main body has an air outlet and at least one first air inlet. In a process of the keyboard assembly gradually moving out of the main body, the keyboard assembly drives the heat dissipation assembly to move in the main body and form a second air inlet in the main body to communicate with the receiving space.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: December 10, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Shang-Che Lee, I-Lung Chen, Yi-Hsuan Wu, Wang-Hung Yeh, Chang-Yuan Wu, Jie-Ting Hsieh, Yu-Fan Chuang
  • Patent number: 10484544
    Abstract: A method and a system for adjusting a volume of a conference call are provided. The system includes at least one sub-device and a host. The host respectively connects the at least one sub-device and detects a number of the connected sub-devices. The host adjusts a volume of an original voice signal received from an external device according to the number of the connected sub-devices to generate an adjusted voice signal adapted to each sub-device and provides the same to each sub-device to play. The host also adjusts volumes of the original voice signals received by the host and each sub-device, integrates the adjusted original voice signals into an integrated voice signal adapted to the external device, and provides the same to the external device to play.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: November 19, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Yi-Chang Wu, Po-Yueh Lan, Ming-Che Weng, Chang-Yuan Wu, Chih-Yuan Lin
  • Patent number: 10364111
    Abstract: A paper warping detection device includes an input tray, a processor, a first emitting element, a first receiving element and a first analog-to-digital converter. A first critical value is stored in the processor. The first emitting element is electrically connected with the processor. The first receiving element is disposed to the other side of the input tray. The first receiving element and the first emitting element face each other. When the first emitting element is switched on, the first emitting element emits first ultrasonic wave signals towards the first receiving element. The first analog-to-digital converter is electrically connected with the first receiving element and the processor for converting the first ultrasonic wave signals into first digital signals and outputting the first digital signals to the processor. The processor reads the first digital signals and compares the first digital signals with the first critical value.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: July 30, 2019
    Assignee: Foxlink Image Technology Co., Ltd.
    Inventors: Ming Da Wu, Shih Sen Huang, Chang Yuan Wu
  • Publication number: 20190208662
    Abstract: A laptop computer including a main body, a fan disposed in a receiving space of the main body, a keyboard assembly movably disposed on the main body, and a heat dissipation assembly movably disposed in the main body and linked with the keyboard assembly is provided. The main body has an air outlet and at least one first air inlet. In a process of the keyboard assembly gradually moving out of the main body, the keyboard assembly drives the heat dissipation assembly to move in the main body and form a second air inlet in the main body to communicate with the receiving space.
    Type: Application
    Filed: December 27, 2018
    Publication date: July 4, 2019
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Shang-Che Lee, I-Lung Chen, Yi-Hsuan Wu, Wang-Hung Yeh, Chang-Yuan Wu, Jie-Ting Hsieh, Yu-Fan Chuang
  • Patent number: 10321233
    Abstract: A method and a portable electronic apparatus for adaptively adjusting a playback effect of speakers are provided. The portable electronic apparatus includes a speaker enclosure volume adjusting device and a processor coupled to the speakers and the speaker enclosure volume adjusting device. In the method, the processor detects a usage demand for the portable electronic apparatus and accordingly determines an audio mode. Based on the determined audio mode, the processor selects and activates multiple speakers, and adjusts an enclosure volume of at least one of the activated speakers, so as to change an audio frequency range of the at least one speaker and an overall audio frequency range covered by the activated speakers. Finally, the processor plays an audio through the activated speakers.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: June 11, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Po-Yueh Lan, Chang-Yuan Wu, Yi-Chang Wu, Kun-Tien Kuo, Ya-Hui Tseng, Chen-Yi Huang, Chun-Yi Ho, Hsiao-Ching Hung
  • Publication number: 20190100395
    Abstract: A paper warping detection device includes an input tray, a processor, a first emitting element, a first receiving element and a first analog-to-digital converter. A first critical value is stored in the processor. The first emitting element is electrically connected with the processor. The first receiving element is disposed to the other side of the input tray. The first receiving element and the first emitting element face each other. When the first emitting element is switched on, the first emitting element emits first ultrasonic wave signals towards the first receiving element. The first analog-to-digital converter is electrically connected with the first receiving element and the processor for converting the first ultrasonic wave signals into first digital signals and outputting the first digital signals to the processor. The processor reads the first digital signals and compares the first digital signals with the first critical value.
    Type: Application
    Filed: September 6, 2018
    Publication date: April 4, 2019
    Inventors: Ming Da Wu, Shih Sen Huang, Chang Yuan Wu
  • Publication number: 20190059177
    Abstract: A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion and an extending portion, wherein the extending portion has a slot, and a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is detachably assembled to the extending portion to be adjacent to the heat dissipation portion, wherein the heat dissipation fan covers the slot, the slot is connected to the heat dissipation flow channel, the heat dissipation fan is adapted to provide a heat dissipation air flow, and a part of the heat dissipation air flow passes through the slot and the heat dissipation flow channel in sequence.
    Type: Application
    Filed: February 12, 2018
    Publication date: February 21, 2019
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh
  • Publication number: 20180341299
    Abstract: An electronic device, including a main body and a first auxiliary body. The main body includes a processor, a plurality of fans electrically connected to the processor, and a connector electrically connected to the processor. The first auxiliary body is detachably connected to the connector, the processor correspondingly adjusts the heat dissipation capability of at least some of these fans according to the connected first auxiliary body. Further provided is a fan activation method of an electronic device.
    Type: Application
    Filed: May 23, 2018
    Publication date: November 29, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Wei-Ning Chai, Li-Fang Chen, Jiun-Yau Wang, Chien-Ming Su, Chang-Yuan Wu
  • Patent number: 10091907
    Abstract: An electronic assembly including a machine body and a docking station is provided. The machine body includes a casing, a heat transfer plate, and a heat dissipation fin set. The casing has a first hole and a second hole. The heat transfer plate and the heat dissipation fin set are disposed in the casing. The heat dissipation fin set includes heat dissipation fins, and a diversion portion of at least one of the heat dissipation fins is aligned to the first hole and the second hole. The docking station includes a body and a fan. The body has a third hole. The fan is disposed in the body. When the machine body is assembled to the docking station, an air flow generated by the fan flows into the casing via the third the first holes, and the air flow is divided into two flows by the diversion portion.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: October 2, 2018
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chien-Ming Su, Chang-Yuan Wu, I-Feng Hsu, Jen-Chang Chen
  • Publication number: 20180228050
    Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.
    Type: Application
    Filed: December 27, 2017
    Publication date: August 9, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chih-Chin Chien, I-Feng Hsu, Ching-Chung Chen, Tse-Yang Lin, Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh, Chin-Hsien Chang, Chin-Yuan Chuang, Chia-Hung Lin
  • Publication number: 20180184546
    Abstract: An electronic assembly including a machine body and a docking station is provided. The machine body includes a casing, a heat transfer plate, and a heat dissipation fin set. The casing has a first hole and a second hole. The heat transfer plate and the heat dissipation fin set are disposed in the casing. The heat dissipation fin set includes heat dissipation fins, and a diversion portion of at least one of the heat dissipation fins is aligned to the first hole and the second hole. The docking station includes a body and a fan. The body has a third hole. The fan is disposed in the body. When the machine body is assembled to the docking station, an air flow generated by the fan flows into the casing via the third the first holes, and the air flow is divided into two flows by the diversion portion.
    Type: Application
    Filed: November 9, 2017
    Publication date: June 28, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chien-Ming Su, Chang-Yuan Wu, I-Feng Hsu, Jen-Chang Chen
  • Publication number: 20170111739
    Abstract: A method and a portable electronic apparatus for adaptively adjusting a playback effect of speakers are provided. The portable electronic apparatus includes a speaker enclosure volume adjusting device and a processor coupled to the speakers and the speaker enclosure volume adjusting device. In the method, the processor detects a usage demand for the portable electronic apparatus and accordingly determines an audio mode. Based on the determined audio mode, the processor selects and activates multiple speakers, and adjusts an enclosure volume of at least one of the activated speakers, so as to change an audio frequency range of the at least one speaker and an overall audio frequency range covered by the activated speakers. Finally, the processor plays an audio through the activated speakers.
    Type: Application
    Filed: June 24, 2016
    Publication date: April 20, 2017
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Po-Yueh Lan, Chang-Yuan Wu, Yi-Chang Wu, Kun-Tien Kuo, Ya-Hui Tseng, Chen-Yi Huang, Chun-Yi Ho, Hsiao-Ching Hung
  • Publication number: 20170034901
    Abstract: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.
    Type: Application
    Filed: October 14, 2016
    Publication date: February 2, 2017
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jia-Yu Hung, Chang-Yuan Wu, Ching-Ya Tu, Tse-An Chu
  • Publication number: 20160352913
    Abstract: A method and a system for adjusting a volume of a conference call are provided. The system includes at least one sub-device and a host. The host respectively connects the at least one sub-device and detects a number of the connected sub-devices. The host adjusts a volume of an original voice signal received from an external device according to the number of the connected sub-devices to generate an adjusted voice signal adapted to each sub-device and provides the same to each sub-device to play. The host also adjusts volumes of the original voice signals received by the host and each sub-device, integrates the adjusted original voice signals into an integrated voice signal adapted to the external device, and provides the same to the external device to play.
    Type: Application
    Filed: May 27, 2016
    Publication date: December 1, 2016
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Yi-Chang Wu, Po-Yueh Lan, Ming-Che Weng, Chang-Yuan Wu, Chih-Yuan Lin