Patents by Inventor Chang-Cheng Lo
Chang-Cheng Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11860404Abstract: A manufacturing method of a reflective display includes at least the following steps. A reflective display module having a display surface is provided. An adhesive is formed on the display surface of the reflective display module. A plurality of microstructures is formed on the adhesive. A cover plate is provided over the reflective display module, the microstructures, and the adhesive. The cover plate has a first surface, a second surface, and a third surface. The second surface is located between the first surface and the reflective display module, and the third surface is connected to the first surface and the second surface. The second surface of the cover plate is adhered to the adhesive having the microstructures thereon to bond the microstructures onto the second surface of the cover plate. A light source is disposed adjacent to the third surface of the cover plate.Type: GrantFiled: March 10, 2023Date of Patent: January 2, 2024Assignee: E Ink Holdings Inc.Inventors: Chang-Cheng Lo, Yue-Feng Lin
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Publication number: 20230215995Abstract: A manufacturing method of a reflective display includes at least the following steps. A reflective display module having a display surface is provided. An adhesive is formed on the display surface of the reflective display module. A plurality of microstructures is formed on the adhesive. A cover plate is provided over the reflective display module, the microstructures, and the adhesive. The cover plate has a first surface, a second surface, and a third surface. The second surface is located between the first surface and the reflective display module, and the third surface is connected to the first surface and the second surface. The second surface of the cover plate is adhered to the adhesive having the microstructures thereon to bond the microstructures onto the second surface of the cover plate. A light source is disposed adjacent to the third surface of the cover plate.Type: ApplicationFiled: March 10, 2023Publication date: July 6, 2023Applicant: E Ink Holdings Inc.Inventors: Chang-Cheng Lo, Yue-Feng Lin
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Patent number: 11640094Abstract: A display device includes a thin film transistor (TFT) array substrate, an isolation structure, and a front panel laminate (FPL) structure. The TFT array substrate has pixel electrodes. The isolation structure is between the pixel electrodes to form a first resistance between adjacent pixel electrodes. The front panel laminate structure is located on the isolation structure and the pixel electrodes adhesive layer, and has a display medium layer therein.Type: GrantFiled: July 1, 2021Date of Patent: May 2, 2023Assignee: E Ink Holdings Inc.Inventors: Chang-Cheng Lo, Shi-Lin Li, Ji-Yuan Li, Yi-Lung Wen
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Patent number: 11373983Abstract: A novel 3D package configuration is provided by stacking a plurality of semiconductor package units or a folded flexible circuit board structure on a lead frame and electrically connected therewith based on the foldable characteristics of the flexible circuit board, and the high temperature resistance of the flexible circuit board which is suitable for insulating layer process, metal layer process, photolithography process, etching and development process, to make conventional semiconductor dies of various functions be bonded on one die and/or two side of a flexible circuit board and electrically connected therewith in advance.Type: GrantFiled: January 26, 2021Date of Patent: June 28, 2022Assignee: CCS Technology CorporationInventors: Tung-Po Sung, Chang-Cheng Lo
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Publication number: 20220199498Abstract: A novel 3D package configuration is provided by stacking a folded flexible circuit board structure on a package substrate and electrically connected therewith based on the foldable characteristics of the flexible circuit board, and the high temperature resistance of the flexible circuit board which is suitable for insulating layer process, metal layer process, photolithography process, etching and development process, to make conventional semiconductor dies of various functions be bonded on one die and/or two side of a flexible circuit board and electrically connected therewith in advance.Type: ApplicationFiled: February 23, 2022Publication date: June 23, 2022Applicant: CCS Technology CorporationInventors: Tung-Po Sung, Chang-Cheng Lo
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Publication number: 20220199579Abstract: A novel 3D package configuration is provided by stacking a plurality of semiconductor package units or a folded flexible circuit board structure on a lead frame and electrically connected therewith based on the foldable characteristics of the flexible circuit board, and the high temperature resistance of the flexible circuit board which is suitable for insulating layer process, metal layer process, photolithography process, etching and development process, to make conventional semiconductor dies of various functions be bonded on one die and/or two side of a flexible circuit board and electrically connected therewith in advance.Type: ApplicationFiled: January 26, 2021Publication date: June 23, 2022Inventors: Tung-Po Sung, Chang-Cheng Lo
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Publication number: 20220199497Abstract: A novel 3D package configuration is provided by stacking a folded flexible circuit board structure on a package substrate and electrically connected therewith based on the foldable characteristics of the flexible circuit board, and the high temperature resistance of the flexible circuit board which is suitable for insulating layer process, metal layer process, photolithography process, etching and development process, to make conventional semiconductor dies of various functions be bonded on one die and/or two side of a flexible circuit board and electrically connected therewith in advance.Type: ApplicationFiled: February 23, 2022Publication date: June 23, 2022Applicant: CCS Technology CorporationInventors: Tung-Po Sung, Chang-Cheng Lo
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Publication number: 20220199583Abstract: A novel 3D package configuration is provided by stacking a plurality of semiconductor package units or a folded flexible circuit board structure on a package substrate and electrically connected therewith based on the foldable characteristics of the flexible circuit board, and the high temperature resistance of the flexible circuit board which is suitable for insulating layer process, metal layer process, photolithography process, etching and development process, to make conventional semiconductor dies of various functions be bonded on one die and/or two side of a flexible circuit board and electrically connected therewith in advance.Type: ApplicationFiled: February 23, 2022Publication date: June 23, 2022Applicant: CCS Technology CorporationInventors: Tung-Po Sung, Chang-Cheng Lo
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Patent number: 11257695Abstract: This invention provides an apparatus for transferring at least one microdevice and a method for transferring at least one microdevice, which is characterized by utilizing the apparatus for transferring at least one microdevice having a magnetic attracting substrate with at least one magnetic attracting head or magnetic attracting position hole to attract at least one microdevice having at least one magnetic layer disposed on a temporary substrate, and transfer the at least one microdevice to the conductive bonding layer of the at least one microdevice bonding region on a target substrate thereafter.Type: GrantFiled: November 18, 2020Date of Patent: February 22, 2022Assignee: CCS TECHNOLOGY CORPORATIONInventors: Tung-Po Sung, Chang-Cheng Lo
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Publication number: 20220051916Abstract: This invention provides an apparatus for transferring at least one microdevice and a method for transferring at least one microdevice, which is characterized by utilizing the apparatus for transferring at least one microdevice having a magnetic attracting substrate with at least one magnetic attracting head or magnetic attracting position hole to attract at least one microdevice having at least one magnetic layer disposed on a temporary substrate, and transfer the at least one microdevice to the conductive bonding layer of the at least one microdevice bonding region on a target substrate thereafter.Type: ApplicationFiled: November 18, 2020Publication date: February 17, 2022Inventors: Tung-Po Sung, Chang-Cheng Lo
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Publication number: 20210325708Abstract: A display device includes a thin film transistor (TFT) array substrate, an isolation structure, and a front panel laminate (FPL) structure. The TFT array substrate has pixel electrodes. The isolation structure is between the pixel electrodes to form a first resistance between adjacent pixel electrodes. The front panel laminate structure is located on the isolation structure and the pixel electrodes adhesive layer, and has a display medium layer therein.Type: ApplicationFiled: July 1, 2021Publication date: October 21, 2021Inventors: Chang-Cheng LO, Shi-Lin LI, Ji-Yuan LI, Yi-Lung WEN
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Patent number: 11099444Abstract: A display device includes a thin film transistor (TFT) array substrate, an isolation structure, and a front panel laminate (FPL) structure. The TFT array substrate has pixel electrodes. The isolation structure is between the pixel electrodes to form a first resistance between adjacent pixel electrodes. The front panel laminate structure is located on the isolation structure and the pixel electrodes adhesive layer, and has a display medium layer therein.Type: GrantFiled: May 4, 2020Date of Patent: August 24, 2021Assignee: E Ink Holdings Inc.Inventors: Chang-Cheng Lo, Shi-Lin Li, Ji-Yuan Li, Yi-Lung Wen
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Publication number: 20210119077Abstract: A reflective display includes a reflective display module, a cover plate, a light source, a plurality of microstructures, and an adhesive. The reflective display module has a display surface. The cover plate is overlapped with the reflective display module, and the display surface is located between the cover plate and the reflective display module. The cover plate has a first surface, a second surface, and a third surface. The second surface is located between the first surface and the reflective display module. The third surface is connected to the first surface and the second surface. The light source is disposed beside the third surface. The microstructures are located between the cover plate and the reflective display module. The adhesive is located between the microstructures and the reflective display module. The reflective display module is bonded to the second surface via the adhesive.Type: ApplicationFiled: October 14, 2020Publication date: April 22, 2021Applicant: E Ink Holdings Inc.Inventors: Chang-Cheng Lo, Yue-Feng Lin
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Publication number: 20200363669Abstract: A display device includes a thin film transistor (TFT) array substrate, an isolation structure, and a front panel laminate (FPL) structure. The TFT array substrate has pixel electrodes. The isolation structure is between the pixel electrodes to form a first resistance between adjacent pixel electrodes. The front panel laminate structure is located on the isolation structure and the pixel electrodes adhesive layer, and has a display medium layer therein.Type: ApplicationFiled: May 4, 2020Publication date: November 19, 2020Inventors: Chang-Cheng LO, Shi-Lin LI, Ji-Yuan LI, Yi-Lung WEN
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Patent number: 8184219Abstract: A stacked storage capacitor structure for use in each pixel of a TFT-LCD, wherein a first storage capacitor is formed by a first metal layer, a gate insulator layer and a second metal layer. The second capacitor is formed by the second metal layer, a passivation insulator layer and an ITO layer. The first metal layer and the ITO layer are joined together through a via hole which is etched in one insulator etching step during the overall fabrication process through both the gate insulator and the passivation insulator layers. As such, the two capacitors are connected in parallel in a stacked configuration. With the stacked storage capacitor structure, the charge storage capacity is increased without significantly affecting the aperture ratio of a pixel. The ITO and the pixel electrode can be different parts of an indium tine oxide layer deposited on the passivation insulator layer.Type: GrantFiled: April 24, 2008Date of Patent: May 22, 2012Assignee: AU Optronics CorporationInventors: Fang-Chen Luo, Chang-Cheng Lo
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Patent number: 7884914Abstract: A structure for encapsulating a liquid crystal display device is disclosed. Openings are formed in a second material layer on a first substrate, exposing an underlying first material layer. The openings are substantially distributed over the perimeter of the first substrate. A sealant is placed in the openings, forming a sealant region for attachment of a second substrate to the first substrate. The sealant region is substantially perpendicular to a direction of length of the openings. In addition, the sealant contacts the first material layer and the second material layer through the openings.Type: GrantFiled: November 8, 2005Date of Patent: February 8, 2011Assignee: AU Optronics Corp.Inventors: Kun-Hong Chen, Chang-Cheng Lo, Tzu-Wei Ho
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Patent number: 7675582Abstract: A stacked storage capacitor structure for use in each pixel of a TFT-LCD, wherein a first storage capacitor is formed by a first metal layer, a gate insulator layer and a second metal layer. The second capacitor is formed by the second metal layer, a passivation insulator layer and an ITO layer. The first metal layer and the ITO layer are joined together through a via hole which is etched in one insulator etching step during the overall fabrication process through both the gate insulator and the passivation insulator layers. As such, the two capacitors are connected in parallel in a stacked configuration. With the stacked storage capacitor structure, the charge storage capacity is increased without significantly affecting the aperture ratio of a pixel. The ITO and the pixel electrode can be different parts of an indium tine oxide layer deposited on the passivation insulator layer.Type: GrantFiled: December 3, 2004Date of Patent: March 9, 2010Assignee: AU Optronics CorporationInventors: Fang-Chen Luo, Chang-Cheng Lo
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Patent number: 7612837Abstract: A protecting structure for ESD is formed on a substrate of a TFT-LCD. A display area of the TFT-LCD is formed by a pixel array comprising lots of pixel units, scan lines and data lines. The protecting structure comprises a first rake metal and an ?-Si layer. The first rake metal is formed outside the display area and each short end of the first rake metal faces the data line by a spacing. Further, all tips of the short end and the data lines are sharp in shape so as to accumulate electrostatic charges. The ?-Si layer is formed directly under the predetermined short end of first rake metal and the corresponding data line. The ?-Si layer is used to serve as a discharging path for performing through breakdown to the ?-Si layer so as to eliminate electrostatic charges.Type: GrantFiled: November 15, 2006Date of Patent: November 3, 2009Assignee: Au Optronics Corp.Inventors: Chang-Cheng Lo, Hong-Jye Hong
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Publication number: 20080239183Abstract: A stacked storage capacitor structure for use in each pixel of a TFT-LCD, wherein a first storage capacitor is formed by a first metal layer, a gate insulator layer and a second metal layer. The second capacitor is formed by the second metal layer, a passivation insulator layer and an ITO layer. The first metal layer and the ITO layer are joined together through a via hole which is etched in one insulator etching step during the overall fabrication process through both the gate insulator and the passivation insulator layers. As such, the two capacitors are connected in parallel in a stacked configuration. With the stacked storage capacitor structure, the charge storage capacity is increased without significantly affecting the aperture ratio of a pixel. The ITO and the pixel electrode can be different parts of an indium tine oxide layer deposited on the passivation insulator layer.Type: ApplicationFiled: April 24, 2008Publication date: October 2, 2008Inventors: Fang-Chen Luo, Chang-Cheng Lo
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Publication number: 20070058098Abstract: A protecting structure for ESD is formed on a substrate of a TFT-LCD. A display area of the TFT-LCD is formed by a pixel array comprising lots of pixel units, scan lines and data lines. The protecting structure comprises a first rake metal and an ?-Si layer. The first rake metal is formed outside the display area and each short end of the first rake metal faces the data line by a spacing. Further, all tips of the short end and the data lines are sharp in shape so as to accumulate electrostatic charges. The ?-Si layer is formed directly under the predetermined short end of first rake metal and the corresponding data line. The ?-Si layer is used to serve as a discharging path for performing through breakdown to the ?-Si layer so as to eliminate electrostatic charges.Type: ApplicationFiled: November 15, 2006Publication date: March 15, 2007Inventors: Chang-Cheng Lo, Hong-Jye Hong