Patents by Inventor Changhua Liu

Changhua Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240176070
    Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a photonic assembly may include a substrate having a core with a surface, wherein a material of the core includes glass; and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways; a photonic integrated circuit (PIC) electrically coupled to the conductive pathways in the dielectric material; a first optical component between the PIC and the surface of the core, wherein the first optical component is coupled to the surface of the core by optical glue or by fusion bonding; and a second optical component coupled to the core, wherein the second optical component is optically coupled to the PIC by an optical pathway through the core and the first optical component.
    Type: Application
    Filed: November 28, 2022
    Publication date: May 30, 2024
    Applicant: Intel Corporation
    Inventors: Jeremy Ecton, Brandon C. Marin, Changhua Liu, Srinivas V. Pietambaram, Hiroki Tanaka
  • Publication number: 20240171821
    Abstract: Provided are an interaction method and apparatus in a live streaming room, and a device and a storage medium. The method comprises: in response to a trigger operation for a preset duet entry on a live streaming room page, jumping from the live streaming room page to a camera capture page, wherein a host portrait cutout corresponding to the live streaming room page is displayed on the camera capture page and a capture control is provided on the camera capture page acquiring multimedia information captured by a camera, in response to a trigger operation for the capture control on the camera capture page, wherein the multimedia information comprises an image or a video; and synthesizing the multimedia information with the host portrait cutout to obtain a duet multimedia product.
    Type: Application
    Filed: March 14, 2022
    Publication date: May 23, 2024
    Inventors: Ling YANG, Manting WANG, Sijing WANG, Ji LIU, Feifei TANG, Xiaoben WANG, Man ZHANG, Zaiyou RUAN, Yuna HU, Zihao CHEN, Siqin LIU, Chen ZHONG, Suyao ZHANG, Yichao WU, Changhua HE, Zenan LI, Yibin CHEN, Jialuo ZHANG, Ping LI, Xinyue GONG, Jialong ZHAO, Fanglu ZHONG, Pingfei FU, Yingzhao SUN, Syenny NA, Qi FAN, Yehua LYU, Jiacheng LIU, Lin ZHOU, Fukang HONG, Xiangzeng MENG, Qian Li, Qi ZHAO, Hui Li
  • Publication number: 20240162191
    Abstract: Embodiments of a package substrate includes: a conductive via in a first layer, the first layer comprising a positive-type photo-imageable dielectric; a conductive trace in a second layer, the second layer comprising a negative-type photo-imageable dielectric; and an insulative material between the first layer and the second layer, the insulative material configured to absorb electromagnetic radiation in a wavelength range between 10 nanometers and 800 nanometers. The conductive via is directly attached to the conductive trace through the insulative material, the positive-type photo-imageable dielectric is soluble in a photoresist developer upon exposure to the electromagnetic radiation, and the negative-type photo-imageable dielectric is insoluble in the photoresist developer upon exposure to the electromagnetic radiation.
    Type: Application
    Filed: November 10, 2022
    Publication date: May 16, 2024
    Applicant: Intel Corporation
    Inventors: Jeremy Ecton, Changhua Liu, Brandon C. Marin, Srinivas V. Pietambaram, Mohammad Mamunur Rahman
  • Publication number: 20240152732
    Abstract: This specification provides a training method of a hybrid graph neural network model. The hybrid graph neural network model includes an encoding function and a decoding function. The method includes the following: using instances corresponding to all targets in training samples and several nearest neighbors of the instances as nodes in a graph, a graph representation vector of each instance is generated by using the encoding function based on graph data of all the instances. t rounds of training are performed on a decoding parameter; and in each round, bs targets are extracted from training samples, a predicted quantity of each target is generated by using the decoding function based on the graph representation vector of the instance corresponding to each target and non-graph data corresponding to each target, and the decoding parameter is optimized based on a loss quantity of the current round that is determined by the predicted quantities and label quantities of the bs targets in the current round.
    Type: Application
    Filed: January 12, 2022
    Publication date: May 9, 2024
    Inventors: Houyi LI, Guowei ZHANG, Xintan ZENG, Yongyong LI, Yongchao LIU, Bin HUANG, Changhua HE
  • Publication number: 20240153168
    Abstract: Provided are an interaction method and apparatus in a live streaming room, a device, and a storage medium. The method comprises: in response to a trigger operation for a preset drawing entry on a live streaming room page, jumping to a graphic drawing page from the live streaming room page, a drawing trajectory set for a preset object being displayed on the graphical drawing page; when a drawing stroke on the graphic drawing page is received, matching the drawing stroke with the drawing trajectory; and if it is determined that the drawing stroke is successfully matched with the drawing trajectory, displaying prompt information about successful participation in a preset activity, the preset activity and the preset drawing entry having a correspondence.
    Type: Application
    Filed: March 14, 2022
    Publication date: May 9, 2024
    Inventors: Ling YANG, Manting WANG, Sijing WANG, Ji LIU, Feifei TANG, Xiaoben WANG, Man ZHANG, Zaiyou RUAN, Yuna HU, Zihao CHEN, Siqin LIU, Chen ZHONG, Suyao ZHANG, Yichao WU, Changhua HE, Zenan LI, Yibin CHEN, Jialuo ZHANG, Ping LI, Xinyue GONG, Jialong ZHAO, Fanglu ZHONG, Lin ZHOU, Fukang HONG, Xiangzeng MENG, Qian LI
  • Publication number: 20240133851
    Abstract: A fingerprint spectrum construction method for Xihuang capsules and a fingerprint spectrum includes: S1: taking contents of a Xihuang capsule, adding a methanol-chloroform-phosphoric acid solution, and carrying out ultrasonic extraction to obtain a Xihuang capsule test solution; S2: dissolving cholic acid, hyodeoxycholic acid, deoxycholic acid, bilirubin, muscone, and myrrhone in ethanol to obtain a mixed standard solution 1; dissolving quassin, 11-carbonyl-?-boswellic acid, 11-carbonyl-?-acetyl-boswellic acid, acetyl-11?-methoxy-?-boswellic acid, and sandaracopimaric acid in methanol to obtain a mixed standard solution 2; S3: respectively carrying out chromatography on the Xihuang capsule test solution and the mixed standard solutions 1 and 2, and recording corresponding chromatograms; and S4: constructing a fingerprint spectrum of the Xihuang capsule according to the chromatogram of the Xihuang capsule test solution and the chromatograms of the mixed standard solutions 1 and 2.
    Type: Application
    Filed: January 14, 2024
    Publication date: April 25, 2024
    Inventors: Chengyuan LIANG, Changhua KE, Yanzi WANG, Yuting LIU, Xiuding YANG, Ying ZHOU, Jiaxuan LI
  • Publication number: 20240132928
    Abstract: The present invention provides a Ganoderma lucidum ?-glucan extract, a preparation method and detection method therefor. The preparation method includes: S1: crushing fruiting bodies of Ganoderma lucidum, mixing the crushed fruiting bodies with a solvent, adding trypsin for enzymatic hydrolysis for 0.5-2 h, and separating to obtain a Ganoderma lucidum fruiting body filter residue; S2: mixing the Ganoderma lucidum fruiting body filter residue with an alkali solution, carrying out ultrasonic extraction with heating, adjusting the pH value of the obtained filtrate to be neutral, and concentrating to obtain a crude Ganoderma lucidum polysaccharide; S3: carrying out alcohol precipitation on the crude Ganoderma lucidum polysaccharide, separating the obtained precipitate, and freeze-drying to obtain a crude Ganoderma lucidum ?-glucan extract; and S4: purifying the crude Ganoderma lucidum ?-glucan extract by glucose gel column chromatography to obtain a Ganoderma lucidum ?-glucan extract.
    Type: Application
    Filed: October 17, 2023
    Publication date: April 25, 2024
    Inventors: Chengyuan LIANG, Boxin ZHANG, Changhua KE, Shan YANG, Jingjing ZHOU, Jinrong HU, Yuting LIU
  • Publication number: 20240112972
    Abstract: Disclosed herein are microelectronics package architectures utilizing photo-integrated glass interposers and photonic integrated glass layers and methods of manufacturing the same. The microelectronics packages may include an organic substrate, a photonic integrated glass layer, and a glass interpose. The organic substrate may define through substrate vias. The photonic integrated glass layer may be attached to the organic substrate. The photonic integrated glass layer may include photo detectors. The glass interposer may be attached to the organic substrate. The glass interposer may define through glass vias in optical communication with the photo detectors.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: Hiroki Tanaka, Robert Alan May, Kristof Darmawikarta, Bai Nie, Brandon C. Marin, Jeremy D. Ecton, Srinivas Venkata Ramanuja Pietambaram, Changhua Liu
  • Publication number: 20240113158
    Abstract: Disclosed herein are microelectronics package architectures utilizing in-situ high surface area capacitor in substrate packages and methods of manufacturing the same. The substrates may include an anode material, a cathode material, and a conductive material. The anode material may have an anode surface that may define a plurality of anode peaks and anode valleys. The cathode material may have a cathode surface that may define a plurality of cathode peaks and cathode valleys complementary to the plurality of anode peaks and anode valleys. The conductive material may be located at the anode peaks.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: Jeremy D. Ecton, Brandon C. Marin, Haobo Chen, Changhua Liu, Srinivas Venkata Ramanuja Pietambaram
  • Publication number: 20240111090
    Abstract: A device comprises a substrate and an IC die, which may be a photonic IC. The substrate comprises a first surface, a second surface opposite the first surface, an optical waveguide integral with the substrate, and a hole extending from the first surface to the second surface. The hole comprises a first sidewall. The optical waveguide is between the first surface and the second surface, parallel to the first surface, and comprises a first end which extends to the first sidewall. The IC die is within the hole and comprises a second sidewall and an optical port at the second sidewall. The second sidewall is proximate to the first sidewall and the first end of the optical waveguide is proximate to and aligned with the optical port. The substrate may include a recess to receive another device comprising a socket.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Applicant: Intel Corporation
    Inventors: Robert A. May, Tarek Ibrahim, Shriya Seshadri, Kristof Darmawikarta, Hiroki Tanaka, Changhua Liu, Bai Nie, Lilia May, Srinivas Pietambaram, Zhichao Zhang, Duye Ye, Yosuke Kanaoka, Robin McRee
  • Publication number: 20240094746
    Abstract: A multi-machine cooperation method, a scheduling device, and a multi-machine cooperation system are described. The multi-machine cooperation method includes: determining, by a first autonomous robot when detecting an abnormal condition during operation, whether the abnormal condition can be independently processed; and when the abnormal condition cannot be independently processed, sending, by the first autonomous robot, an assistance request to another device in an Internet of Things in which the first autonomous robot is located. In the specification, a multi-machine cooperation operation between autonomous robots or between an autonomous robot and another device can be implemented.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Inventors: Mingming He, Shuanglong Wu, Don Zhendong Gao, Xiahong Zha, Changhua Liu
  • Patent number: 11919907
    Abstract: Disclosed is a JAK1 and/or JAK2 inhibitor of the following structural formula: or a pharmaceutically acceptable salt thereof. This invention also provides pharmaceutical compositions comprising a compound of Formula (I), optionally including additional therapeutic agents, and use in methods of treatment for hair loss disorders.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: March 5, 2024
    Assignee: Sun Pharmaceutical Industries, Inc.
    Inventors: I. Robert Silverman, Changhua Liu
  • Patent number: 11837534
    Abstract: Apparatuses, systems and methods associated with package substrate design with variable height conductive elements within a single layer are disclosed herein. In embodiments, a substrate may include a first layer, wherein a trench is located in the first layer, and a second layer located on a surface of the first layer. The substrate may further include a first conductive element located in a first portion of the second layer adjacent to the trench, wherein the first conductive element extends to fill the trench, and a second conductive element located in a second portion of the second layer, wherein the second conductive element is located on the surface of the first layer. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: December 5, 2023
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Kristof Darmawikarta, Haobo Chen, Changhua Liu, Sri Ranga Sai Boyapati, Bai Nie
  • Publication number: 20230236517
    Abstract: Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.
    Type: Application
    Filed: April 3, 2023
    Publication date: July 27, 2023
    Inventors: Changhua LIU, Jianyong MO, Liang ZHANG
  • Patent number: 11644757
    Abstract: Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: May 9, 2023
    Assignee: Intel Corporation
    Inventors: Changhua Liu, Jianyong Mo, Liang Zhang
  • Publication number: 20230104330
    Abstract: Position controlled waveguides and methods of manufacturing the same are disclosed. An example apparatus includes a substrate with a channel that extends into a first surface of the substrate to a second surface of the substrate, wherein the second surface is recessed relative to the first surface; buffer material having a first index of refraction on the second surface of the substrate; and a waveguide on the buffer material, the waveguide having a second index of refraction that is higher than the first index of refraction.
    Type: Application
    Filed: September 23, 2021
    Publication date: April 6, 2023
    Inventors: Jeremy Ecton, Leonel Arana, Whitney Bryks, Haobo Chen, Benjamin Duong, Changhua Liu, Brandon Marin, Srinivas Pietambaram
  • Publication number: 20230095281
    Abstract: Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates are disclosed. An apparatus includes a substrate and a semiconductor die mounted to the substrate. The apparatus further includes bumps to electrically couple the die to the substrate. Ones of the bumps have corresponding bases. The bases have a shape that is non-circular.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Inventors: Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han, Changhua Liu, Leonel Arana, Rahul Manepalli, Dingying Xu, Amram Eitan
  • Publication number: 20230090133
    Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic integrated circuit and an in situ formed waveguide. In selected examples, the electronic device includes a photonic integrated circuit coupled to an electronic integrated circuit, in a glass layer, where a waveguide is formed in the glass layer.
    Type: Application
    Filed: September 21, 2021
    Publication date: March 23, 2023
    Inventors: Bai Nie, Pooya Tadayon, Leonel R. Arana, Yonggang Li, Changhua Liu, Kristof Darmawikarta, Srinivas Venkata Ramanuja Pietambaram, Tarek A. Ibrahim, Hari Mahalingam, Benjamin Duong
  • Publication number: 20230091050
    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques directed to optical interconnects and optical waveguides within a glass layer of a semiconductor package, where dies that are physically and optically coupled with the glass layer are optically coupled with each other via the optical waveguides. One or more reflectors may be used to direct the optical pathway through the glass layer. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 20, 2021
    Publication date: March 23, 2023
    Inventors: Zhichao ZHANG, Pooya TADAYON, Tarek A. IBRAHIM, Srinivas V. PIETAMBARAM, Changhua LIU, Kemal AYGÜN
  • Publication number: 20230087124
    Abstract: Various embodiments disclosed relate to photonic assemblies. The present disclosure includes methods for packaging a photonic assembly, including attaching a bridge die to a glass substrate, attaching an electronic integrated circuit die to the glass substrate and the bridge die, attaching a photonic integrated circuit die to the glass substrate and the bridge die, bonding a coupling adapter to the glass substrate and in situ forming a waveguide in the coupling adapted, the waveguide aligning with the photonic integrated circuit die.
    Type: Application
    Filed: September 23, 2021
    Publication date: March 23, 2023
    Inventors: Bai Nie, Pooya Tadayon, Leonel R. Arana, Yonggang Li, Changhua Liu, Kristof Darmawikarta, Srinivas Venkata Ramanuja Pietambaram, Tarek A. Ibrahim, Hari Mahalingam, Benjamin Duong