Patents by Inventor Chao-Chi Jain

Chao-Chi Jain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layer thermoelectric module and method for fabricating the same
    Patent number: 9048388
    Abstract: A multi-layer thermoelectric module and a fabricating method thereof are provided. The module includes two thermoelectric element sets and a metal electrode set, in which the thermoelectric element sets are corresponding to different operating temperature ranges. Each thermoelectric element set includes a thermoelectric unit, an interfacial adhesion layer, a diffusion barrier layer and a high melting-point metal layer. In the method, the thermoelectric unit, the interfacial adhesion layer, and the diffusion barrier layer are sequentially formed on the thermoelectric unit. Then, two high melting-point metal layers are formed respectively on the electrode layers of the metal electrode set.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: June 2, 2015
    Assignee: CHINA STEEL CORPORATION
    Inventors: Jing-Yi Huang, Huey-Lin Hsieh, Tung-Han Chuang, Jenn-Dong Hwang, Chao-Chi Jain
  • MULTI-LAYER THERMOELECTRIC MODULE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20140305483
    Abstract: A multi-layer thermoelectric module and a fabricating method thereof are provided. The module includes two thermoelectric element sets and a metal electrode set, in which the thermoelectric element sets are corresponding to different operating temperature ranges. Each thermoelectric element set includes a thermoelectric unit, an interfacial adhesion layer, a diffusion barrier layer and a high melting-point metal layer. In the method, the thermoelectric unit, the interfacial adhesion layer, and the diffusion barrier layer are sequentially formed on the thermoelectric unit. Then, two high melting-point metal layers are formed respectively on the electrode layers of the metal electrode set.
    Type: Application
    Filed: July 8, 2013
    Publication date: October 16, 2014
    Inventors: Jing-Yi HUANG, Huey-Lin HSIEH, Tung-Han CHUANG, Jenn-Dong HWANG, Chao-Chi JAIN
  • SOLID-LIQUID INTERDIFFUSION BONDING STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF
    Publication number: 20130152990
    Abstract: A solid-liquid interdiffusion bonding structure of a thermoelectric module and a fabricating method thereof are provided. The method includes coating a silver, nickel, or copper layer on surfaces of a thermoelectric component and an electrode plate, and then coating a tin layer. A thermocompression treatment is performed on the thermoelectric component and the electrode plate, such that the melted tin layer reacts with the silver, nickel, or copper layer to form a silver-tin intermetallic compound, a nickel-tin intermetallic compound, or a copper-tin intermetallic compound. After cooling, the thermoelectric component and the electrode plate are bonded together.
    Type: Application
    Filed: November 4, 2012
    Publication date: June 20, 2013
    Inventors: Hong-Jen Lai, Jenn-Dong Hwang, Hsu-Shen Chu, Tung-Han Chuang, Chao-Chi Jain, Che-Wei Lin