Abstract: In general, techniques are described that are directed to a device that includes a power storage device, an electrical load, and a first regulated power converter including components configured to generate, during a first time period and using electrical energy received from a power source external to the device, a first power signal to charge the power storage device. A second regulated power converter includes components configured to determine a charging current at which to charge the power storage device, determine a total amount of current flowing to the power storage device that includes current sourced by the second power converter less current sinked by the electrical load, and generate, during a second time period that is non-overlapping with the first time period, using electrical energy from the power source and based on determined the total amount of current, a second power signal to charge the power storage device.

Abstract: In general, techniques are described that are directed to a device having a first power storage device and a second power storage device connected in series. A first power converter may generate, using electrical energy sourced from the first power storage device and the second power storage device, a first power signal to power a first set of components. A second power converter may generate, using electrical energy sourced from the first power storage device and not the second power storage device, a second power signal to power a second set of components.

Abstract: In general, techniques are described that are directed to a device that includes a power storage device, an electrical load, and a first regulated power converter including components configured to generate, during a first time period and using electrical energy received from a power source external to the device, a first power signal to charge the power storage device. A second regulated power converter includes components configured to determine a charging current at which to charge the power storage device, determine a total amount of current flowing to the power storage device that includes current sourced by the second power converter less current sinked by the electrical load, and generate, during a second time period that is non-overlapping with the first time period, using electrical energy from the power source and based on determined the total amount of current, a second power signal to charge the power storage device.

Abstract: Three-phase interleaved LLC and CLLC resonant converters, with integrated magnetics, are described. In various examples, the primary sides of the phases in the converters rely upon a half-bridge configuration and include resonant networks coupled to each other in delta-connected or common Y-node configurations. The secondary sides of the phases can rely upon a full-bridge configurations and are coupled in parallel. In one example, the transformers of the phases in the converters are integrated into one magnetic core. By changing the interleaving structure between the primary and secondary windings in the transformers, resonant inductors of the phases can also be integrated into the same magnetic core. A multi-layer PCB can be used as the windings for the integrated magnetics.

Abstract: A method for fabricating a semiconductor structure is provided. The method includes forming a semiconductor chip; providing a printed circuit board; and forming an adhesive layer between a connection surface of the semiconductor chip and the printed circuit board to bond the semiconductor chip with the printed circuit board. The semiconductor chip includes a plurality of cutting tracks intersected with each other to enclose an area having corner regions. The connection surface of the semiconductor chip includes a plurality of conductive bumps and a plurality of first openings are formed in each of the corner regions.

Abstract: Shielded electrical transformers and power converters using those transformers are disclosed. In some implementations, a shielded electrical transformer includes a magnetic core, a primary winding, a first secondary winding, and a second secondary winding. The transformer includes a first shielding winding that has a same voltage potential direction as the primary winding and is connected in series with the primary winding to carry current that passes through the primary winding. The transformer also includes a second shielding winding that has a voltage potential direction opposite the primary winding and is connected from primary ground to a floating terminal. The first secondary winding, the second secondary winding, the first shielding winding, and the second shielding winding can each have an approximately equal number of turns.

Abstract: Method for fabricating A packaging structure is provided. The packaging structure includes a base substrate including a solder pad body region and a trench region adjacent to and around the solder pad body region. The packaging structure includes a passivation layer on the base substrate and exposing the solder pad body region and the trench region. The packaging structure includes a main body solder pad on the solder pad body region of the base substrate, and one or more trenches on the trench region of the base substrate and between the passivation layer and the main body solder pad. The packaging structure includes a bonding conductive wire having one end connected to the main body solder pad.

Abstract: A matrix transformer particularly suited to large voltage step-down, high current applications achieves increased good current sharing uniformity or air gap and electrical characteristics and reduced or eliminating termination losses, core losses and winding losses with a unitary magnetic core structure featuring sheets of magnetic material and a two-dimensional array of pillars on which windings, oriented in opposite directions on pillars that are adjacent in orthogonal directions, can be formed or placed comprising metallization on or embedded in a printed circuit board (PCB) structure. Magnetic flux density is reduced by at least one-half by dividing the magnetic flux in each pillar into two paths of increased width in the sheets of magnetic material. Magnetic flux density may be further decreased and flux uniformity improved by extending the sheets of magnetic material beyond a periphery defined by the pillar array.

Abstract: A computing device can include a housing, a display secured by the housing, a charging coil included in a back side of the housing, the back side of the housing being on an opposite side from the display, and at least one magnet adjacent to the charging coil.

Abstract: Three-phase interleaved LLC and CLLC resonant converters, with integrated magnetics, are described. In various examples, the primary sides of the phases in the converters rely upon a half-bridge configuration and include resonant networks coupled to each other in delta-connected or common Y-node configurations. The secondary sides of the phases can rely upon a full-bridge configurations and are coupled in parallel. In one example, the transformers of the phases in the converters are integrated into one magnetic core. By changing the interleaving structure between the primary and secondary windings in the transformers, resonant inductors of the phases can also be integrated into the same magnetic core. A multi-layer PCB can be used as the windings for the integrated magnetics.

Abstract: An adapter can include a voltage doubler rectifier, a first stage converter, and a second stage converter. The voltage doubler rectifier can have a switch and can be configured to rectify a received voltage in response to the switch being in a first position, and to rectify and effectively double the received voltage in response to the switch being in a second position. The first stage converter can be coupled to the voltage doubler rectifier and can be a first type of converter. The first type of converter can be either an isolated converter or a non-isolated converter. The second stage converter can be coupled to the first stage converter and can be a second type of converter. The second type of converter can be either the isolated converter or the non-isolated converter. The second type of converter can be different from the first type of converter.

Abstract: A method for fabricating a semiconductor structure is provided. The method includes forming a semiconductor chip; providing a printed circuit board; and forming an adhesive layer between a connection surface of the semiconductor chip and the printed circuit board to bond the semiconductor chip with the printed circuit board. The semiconductor chip includes a plurality of cutting tracks intersected with each other to enclose an area having corner regions. The connection surface of the semiconductor chip includes a plurality of conductive bumps and a plurality of first openings are formed in each of the corner regions.

Abstract: A method for fabricating a semiconductor structure includes forming a semiconductor chip. Forming the semiconductor chip includes providing a substrate, forming a connection layer on the substrate, and forming a first passivation layer on the substrate. The first passivation layer contains a plurality of first openings to expose the connection layer. Forming the semiconductor chip also includes forming a plurality of second openings and a plurality of third openings in the second passivation layer. Each second opening is formed in a first opening to expose the connection layer, and each third opening is formed outside of the plurality of first openings to expose the first passivation layer. Further, forming the semiconductor chip includes forming a conductive bump in each second opening.

Abstract: Method for fabricating A packaging structure is provided. The packaging structure includes a base substrate including a solder pad body region and a trench region adjacent to and around the solder pad body region. The packaging structure includes a passivation layer on the base substrate and exposing the solder pad body region and the trench region. The packaging structure includes a main body solder pad on the solder pad body region of the base substrate, and one or more trenches on the trench region of the base substrate and between the passivation layer and the main body solder pad. The packaging structure includes a bonding conductive wire having one end connected to the main body solder pad.

Abstract: Three-phase interleaved LLC and CLLC resonant converters, with integrated magnetics, are described. In various examples, the primary sides of the phases in the converters rely upon a half-bridge configuration and include resonant networks coupled to each other in delta-connected or common Y-node configurations. The secondary sides of the phases can rely upon a full-bridge configurations and are coupled in parallel. In one example, the transformers of the phases in the converters are integrated into one magnetic core. By changing the interleaving structure between the primary and secondary windings in the transformers, resonant inductors of the phases can also be integrated into the same magnetic core. A multi-layer PCB can be used as the windings for the integrated magnetics.

Abstract: Three-phase interleaved LLC and CLLC resonant converters, with integrated magnetics, are described. In various examples, the primary sides of the phases in the converters rely upon a half-bridge configuration and include resonant networks coupled to each other in delta-connected or common Y-node configurations. The secondary sides of the phases can rely upon a full-bridge configurations and are coupled in parallel. In one example, the transformers of the phases in the converters are integrated into one magnetic core. By changing the interleaving structure between the primary and secondary windings in the transformers, resonant inductors of the phases can also be integrated into the same magnetic core. A multi-layer PCB can be used as the windings for the integrated magnetics.

Abstract: A packaging structure and a method for fabricating the packaging structure are provided. The packaging structure includes a base substrate including a solder pad body region and a trench region adjacent to and around the solder pad body region. The packaging structure also includes a passivation layer on a surface of the base substrate and exposing the solder pad body region and the trench region. In addition, the packaging structure includes a main body solder pad on the solder pad body region of the base substrate, and one or more trenches on the trench region of the base substrate and between the passivation layer and the main body solder pad. Further, the packaging structure includes a bonding conductive wire having one end connected to the main body solder pad.

Abstract: A method for fabricating a semiconductor structure includes forming a semiconductor chip. Forming the semiconductor chip includes providing a substrate, forming a connection layer on the substrate, and forming a first passivation layer on the substrate. The first passivation layer contains a plurality of first openings to expose the connection layer. Forming the semiconductor chip also includes forming a plurality of second openings and a plurality of third openings in the second passivation layer. Each second opening is formed in a first opening to expose the connection layer, and each third opening is formed outside of the plurality of first openings to expose the first passivation layer. Further, forming the semiconductor chip includes forming a conductive bump in each second opening.

Abstract: An electronic device which can physically move according to vocal instructions includes a control device, a voice device, and a driving device. The control device responds to user instructions. The voice device is used for performing voice interaction between the electronic device and a user. The driving device drives the electronic device to move. When the voice device receives a voice instruction from the user, the control device recognizes the voice instruction. If a voice instruction includes a destination position, the control device recognizes same and transmits a moving control instruction to the driving device, the driving device drives the electronic device to move to that destination position.

Abstract: A resonant power converter is disclosed with a driving circuit generating a switching signal connecting power to a resonant tank circuit, with a voltage monitoring circuit measuring a voltage output and a load current. A micro-controller is operable with a control circuit for multiple step sampling with the switching signal at a switching frequency to settle the resonant circuit determined from the voltage output and load current. A fast load transient response at a high frequency with the resonant circuit provides the multiple step sampling to ensure enough time for micro-controller to calculate. Optimal trajectory control facilitates a burst mode of high frequency with the resonant circuit using adaptive multiple step sampling for an on-time to extend the burst operation range. A soft start-up process uses the micro-controller processing in multiple stages.