Patents by Inventor Chao-Hsuan Yang

Chao-Hsuan Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ANTENNA MODULE AND ELECTRONIC DEVICE
    Publication number: 20240145919
    Abstract: An antenna module includes a first metal plate and a frame body. The frame body surrounds the first metal plate. The frame body includes a first antenna radiator, a second antenna radiator, a third antenna radiator, a first breakpoint and a second breakpoint. The first antenna radiator includes a first feeding end and excites a first frequency band. The second antenna radiator includes a second feeding end and excites a second frequency band. The third antenna radiator includes a third feeding end and excites a third frequency band. The first breakpoint is located between the first antenna radiator and the second antenna radiator. The second breakpoint is located between the second antenna radiator and the third antenna radiator. An electronic device including the above-mentioned antenna module is also provided.
    Type: Application
    Filed: September 6, 2023
    Publication date: May 2, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Shih-Keng Huang, Chao-Hsu Wu, Chih-Wei Liao, Sheng-Chin Hsu, Hao-Hsiang Yang, Tse-Hsuan Wang
  • Fin field-effect transistor and method of forming the same
    Patent number: 11942532
    Abstract: A method includes fabricating a semiconductor device, wherein the method includes depositing a coating layer on a first region and a second region under a loading condition such that a height of the coating layer in the first region is greater than a height of the coating layer in the second region. The method also includes applying processing gas to the coating layer to remove an upper portion of the coating layer such that a height of the coating layer in the first region is a same as a height of the coating layer in the second region.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chao-Hsuan Chen, Ming-Chia Tai, Yu-Hsien Lin, Shun-Hui Yang, Ryan Chia-Jen Chen
  • PROBE PIN CLEANING PAD AND CLEANING METHOD FOR PROBE PIN
    Publication number: 20240069069
    Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.
    Type: Application
    Filed: November 10, 2023
    Publication date: February 29, 2024
    Applicant: Alliance Material Co., Ltd.
    Inventors: Chun-Fa Chen, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin
  • Probe pin cleaning pad and cleaning method for probe pin
    Patent number: 11865588
    Abstract: A probe pin cleaning pad including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer. A cleaning method for a probe pin is also provided.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: January 9, 2024
    Assignee: Alliance Material Co., Ltd.
    Inventors: Chun-Fa Chen, Chi-Hua Huang, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin, Chin-Kai Lin, Chen-Ju Lee
  • PROBE PIN CLEANING PAD AND CLEANING METHOD FOR PROBE PIN
    Publication number: 20220193733
    Abstract: A probe pin cleaning pad including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer. A cleaning method for a probe pin is also provided.
    Type: Application
    Filed: March 10, 2022
    Publication date: June 23, 2022
    Applicant: Alliance Material Co., Ltd.
    Inventors: Chun-Fa Chen, Chi-Hua Huang, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin, Chin-Kai Lin, Chen-Ju Lee