Abstract: The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes a substrate, a copper layer, an organic composite protective layer, and a silver nanowire layer. The copper layer is disposed on the substrate. The nanowire-distribution-promotion layer is disposed between the copper layer and the silver nanowire layer.

Abstract: The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes: a substrate; a copper layer disposed on the substrate; an adhesion promotion layer disposed on the copper layer, wherein the adhesion promotion layer forms a monomolecular adsorption layer on the surface of the copper layer; and a silver nanowire layer disposed on the adhesion promotion layer, and the adhesive force between the copper layer and the silver nanowire layer is 3B or more. In the present disclosure, by disposing the adhesion promotion layer on the copper layer, in the stacked structure of the copper layer and the silver nanowire layer, the adhesive force between the copper layer and the silver nanowire layer is increased, so as to prevent a peeling phenomenon of the copper layer occurring in the subsequent yellow-light process.

Abstract: An optical transmission device is provided. A substrate includes an optical transmission channel exposed on its end surface, and a first positioning portion. A jumper includes a mounting portion abutting the end surface and a second positioning portion engaged to the first positioning portion. An optical fiber is mounted to the mounting portion, and the end surface of the optical fiber aligns with the optical transmission channel. The coupling method of the optical transmission device includes steps: forming at least one first hole on the substrate, forming an optical transmission layer with at least one optical transmission channel on the substrate, forming an alignment mark on the optical transmission layer within the first hole, forming at least one second hole on the substrate based on the alignment mark, and connecting the jumper to the second hole and make the jumper abutting against the substrate.

Abstract: A transmission device for guiding a transmission signal is provided, including: a substrate including a signal guide configured to guide the transmission signal; and a refractor arranged on the substrate and corresponding to the signal guide, the refractor provided with a progressive refractive index with which a divergence angle of the transmission signal progressively varies within the refractor.

Abstract: The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes a substrate, a copper layer, an organic composite protective layer, and a silver nanowire layer. The copper layer is disposed on the substrate. The nanowire-distribution-promotion layer is disposed between the copper layer and the silver nanowire layer.

Abstract: The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes: a substrate; a copper layer disposed on the substrate; an adhesion promotion layer disposed on the copper layer, wherein the adhesion promotion layer forms a monomolecular adsorption layer on the surface of the copper layer; and a silver nanowire layer disposed on the adhesion promotion layer, and the adhesive force between the copper layer and the silver nanowire layer is 3B or more. In the present disclosure, by disposing the adhesion promotion layer on the copper layer, in the stacked structure of the copper layer and the silver nanowire layer, the adhesive force between the copper layer and the silver nanowire layer is increased, so as to prevent a peeling phenomenon of the copper layer occurring in the subsequent yellow-light process.

Abstract: A contact structure is provided, which includes a substrate, a copper layer, an organic composite protective layer, and a nanosilver layer. The copper layer is disposed over the substrate. The organic composite protective layer is disposed over the copper layer to avoid oxidation of the copper layer, in which the organic composite protective layer forms a monomolecular adsorption layer over a surface of the copper layer. The nanosilver layer is disposed over the organic composite protective layer. A method of manufacturing a contact structure is also provided.

Abstract: An optical fiber module contains: a circuit board, a photoelectric assembly, a control assembly, a body, and a light transmission set. The body includes a first accommodation groove, a second accommodation groove accommodating the optoelectronic assembly, a first reflection portion facing the circuit board, a lens set accommodated in the second accommodation groove and aligning with the first reflection portion, a guide orifice, a converging lens extending from the guide orifice, and a second reflection portion adjacent to the converging lens, wherein the second reflection portion has a second reflecting face corresponding to the converging lens. The light transmission set includes multiple passing faces formed on a first surface thereof so as to face and correspond to the first reflection portion of the body, and the light transmission set includes multiple complete reflecting faces formed on a second surface thereof away from the multiple passing faces individually.

Abstract: An optical fiber module includes a main body and at least one optical conducting set. One surface of the main body is formed with a recess set and an accommodation groove, the main body is formed with a reflection slot and a lens slot, disposed with a lens set on a surface of the lens slot, and disposed with a third lens close to the accommodation groove; the optical conducting set is disposed in the accommodation groove and includes a base material and at least one optical conducting member, one surface of the base material is formed with an optical pervious plane close to the third lens which is substantially corresponding to the optical pervious plane, the optical conducting member are formed on two surfaces of the base materials, and can allow a light source with different wavelengths to pass and allow light sources with other wavelengths to be reflected.

Abstract: An optical communication module contains: a lens element, a fixer, and at least one optical fiber. The lens element includes a groove, a body, a top face, a light input face, at least one collimator lens, and a reflective bevel face. The at least one collimator lens is located within an orthographic projection range of a vertical viewing angle of the reflective bevel face, and the body has a light output face. The fixer is mounted beside the body and includes an accommodation recess and at least one focus face, wherein the at least one focus face corresponds to an orthographic projection range of a horizontal viewing angle of the light output face. The at least one optical fiber is inserted into the accommodation recess, and a glue is filled into the accommodation recess so that the at least one optical fiber is adhered in the lens element.

Abstract: An optical communication module contains: a lens element, a fixer, and at least one optical fiber. The lens element includes a groove, a body, a top face, a light input face, at least one collimator lens, and a reflective bevel face. The at least one collimator lens is located within an orthographic projection range of a vertical viewing angle of the reflective bevel face, and the body has a light output face. The fixer is mounted beside the body and includes an accommodation recess and at least one focus face, wherein the at least one focus face corresponds to an orthographic projection range of a horizontal viewing angle of the light output face. The at least one optical fiber is inserted into the accommodation recess, and a glue is filled into the accommodation recess so that the at least one optical fiber is adhered in the lens element.

Abstract: A method of packaging a fiber optic module comprising steps of: connecting a fiber optic connector with a mounting holder; fixing the mounting holder on a circuit board; mounting a photoelectric array element on the circuit board; and connecting a lens element with the mounting holder. The mounting holder includes a body, an accommodation trench, multiple orifices, two protrusions, and two first fixing holes. The fiber optic connector includes multiple optical fiber cables, and glue is fed into the accommodation trench. The photoelectric array element is mounted on the circuit board. The lens element includes two slots and two positioning columns, wherein the two slots respectively accommodate the two protrusions of the mounting holder, and the two positioning columns insert into the two first fixing holes of the mounting holder respectively.

Abstract: The invention relates to a polyimide containing polymaleic anhydride having the formula: wherein X represents functional groups having carbon chain with carbon numbers more than 10, benzene ring and a combination of carbon chain with carbon numbers more than 10 and benzene ring; and m, n and l are integers, and larger than or equal to 1.

Abstract: Embodiments of mechanisms for cleaning a wafer are provided. A method for cleaning a wafer includes cleaning a wafer by using a wafer scrubber and cleaning the wafer scrubber in a scrubber cleaning module. An agitated cleaning liquid is applied on the wafer scrubber to clean the wafer scrubber. The method also includes cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning liquid.

Abstract: The invention provides a method for manufacturing an organic-inorganic hybrid material film. The method mainly comprises hybridization of polymaleic anhydride-polyimide and silica by sol-gel route and by using a silane coupling agent to produce a structure of polymaleic anhydride-polyimide having silane, then casting and curing to form a material film. Also, the invention provides a polymaleic anhydride-polyimide-silica organic-inorganic hybrid material film.

Abstract: Embodiments of mechanisms for cleaning a wafer are provided. A method for cleaning a wafer includes cleaning a wafer by using a wafer scrubber and cleaning the wafer scrubber in a scrubber cleaning module. An agitated cleaning liquid is applied on the wafer scrubber to clean the wafer scrubber. The method also includes cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning liquid.

Abstract: The invention relates to a polyimide containing polymaleic anhydride having the formula: wherein X represents functional groups having carbon chain with carbon numbers more than 10, benzene ring and a combination of carbon chain with carbon numbers more than 10 and benzene ring; and m, n and l are integers, and larger than or equal to 1.

Abstract: The present invention discloses an iridium complex containing a (pentaphenyl)phenyl ligand, having the following general equation: in which G is primary ligand, R? and R? are auxiliary ligands. On the other hand, the present invention discloses a compound with a 9-[(pentaphenyl)phenyl]carbazole structure and its polymeric derivative.

Abstract: The present invention discloses an iridium complex containing a (pentaphenyl)phenyl ligand, having the following general equation: in which G is primary ligand, R? and R? are auxiliary ligands. On the other hand, the present invention discloses a compound with a 9-[(pentaphenyl)phenyl]carbazole structure and its polymeric derivative.

Abstract: The present invention discloses hole or electron injection polymers and prepolymers, hole or electron transport polymers and prepolymers, which comprises a plurality of conjugated or non-conjugated structures with electronic function and a plurality of connecting structures, wherein the connecting structure is used to connect different conjugated or non-conjugated structures with electronic function, and the connecting structure comprises any one or any combination of the following group: ether based group, ester based group, urethane based group, urea based group, carbonate based group, nitrogen atom based group, amide based group, and imide based group. Moreover, this invention also discloses a method for forming the mentioned charge injection or transport polymers and prepolymers.