Patents by Inventor CHAO LAN
CHAO LAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240146126Abstract: Example rotors, motors, and vehicles are described. One example rotor includes a central core and a plurality of peripheral cores. Each peripheral core is spaced apart from the central core to form a first separation gap, a second separation gap, and a third separation gap that communicate with each other. The first separation gap and the second separation gap are respectively configured to accommodate a first permanent magnet and a second permanent magnet. The first permanent magnet and the second permanent magnet are respectively spaced apart from the sleeve to form a first magnetic isolation gap and a second magnetic isolation gap. Each peripheral core is provided with an open slot for accommodating a third permanent magnet and a fourth permanent magnet.Type: ApplicationFiled: October 23, 2023Publication date: May 2, 2024Inventors: Weihua HUANG, Binan LAN, Chao CAO
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Patent number: 11973079Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure. The method includes forming a stack of semiconductor layers comprising a plurality of first semiconductor layers and a plurality of second semiconductor layers over a semiconductor substrate. A first stack of masking layers is formed over the stack of semiconductor layers with a first width and a second stack of masking layers is formed laterally offset from the stack of semiconductor layers with a second width less than the first width. A patterning process is performed on the semiconductor substrate and the stack of semiconductor layers, thereby defining a first fin structure laterally adjacent to a second fin structure. The first fin structure has the first width and the second fin structure has the second width. The stack of semiconductor layers directly overlies the first fin structure and has the first width.Type: GrantFiled: May 19, 2022Date of Patent: April 30, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Chao Chou, Chih-Hao Wang, Shi Ning Ju, Kuo-Cheng Chiang, Wen-Ting Lan
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Patent number: 11915470Abstract: A target detection method based on fusion of vision, lidar and millimeter wave radar comprises: obtaining original data detected by a camera, a millimeter wave radar, and a lidar, and synchronizing the millimeter wave radar, the lidar, and the camera in time and space; performing a calculation on the original data detected by the millimeter wave radar according to a radar protocol; generating a region of interest by using a position, a speed, and a radar reflection area obtained from the calculation; extracting feature maps of a point cloud bird's-eye view and the original data detected by the camera; projecting the region of interest onto the feature maps of the point cloud bird's-eye view and the original data detected by the camera; fusing the feature maps of the point cloud bird's-eye view and the original data detected by the camera, and processing a fused image through a fully connected layer.Type: GrantFiled: May 17, 2022Date of Patent: February 27, 2024Assignee: Quanzhou Equipment Manufacturing Research InstituteInventors: Xian Wei, Jielong Guo, Chao Li, Hai Lan, Dongheng Shao, Xiaoliang Tang, Xuan Tang, Zhiyuan Feng
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Patent number: 11916125Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary semiconductor device comprises a dielectric layer formed over a conductive feature; a semiconductor stack formed over the dielectric layer, wherein the semiconductor stack including semiconductor layers stacked up and separated from each other; a first metal gate structure and a second metal gate structure formed over a channel region of the semiconductor stack, wherein the first metal gate structure and the second metal gate structure wrap each of the semiconductor layers of the semiconductor stack; and a first epitaxial feature disposed between the first metal gate structure and the second metal gate structure over a first source/drain region of the semiconductor stack, wherein the first epitaxial feature extends through the dielectric layer and contacts the conductive feature.Type: GrantFiled: July 22, 2022Date of Patent: February 27, 2024Inventors: Chih-Chao Chou, Kuo-Cheng Chiang, Shi Ning Ju, Wen-Ting Lan, Chih-Hao Wang
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Publication number: 20210019657Abstract: The present application provides a fraud detection and risk assessment method, a system, a device, and a computer readable storage medium. Said method comprises the following steps: acquiring original data of a client user; using a data processing algorithm to extract characteristic data from the original data; inputting the characteristic data into a pre-trained machine learning model matching the characteristic data, generating a model output result, and uploading same onto a server; and outputting a fraud detection and risk assessment result using a risk control decision engine in conjunction with the model output result, historical data associated with the client user, and third party data. By using the present application, the computing capability of a client device can be fully utilized, reducing the computing pressure on the server.Type: ApplicationFiled: April 25, 2018Publication date: January 21, 2021Inventors: HuanMing Wu, Chao Lan, FaYuan Li, QinYa He
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Patent number: 10694269Abstract: Systems and methods are provided for determining whether an optical cable matches a port on a switch device. The present disclosure can provide for a switch device which includes a cable identification tool. The cable identification tool can be configured to receive a port configuration table from a management device. The switch device can then obtain features of at least one cable attached to a port of the switch device. The switch device can then compare the obtained features with a table entry in the port configuration table to yield a comparison result. The table entry can correspond to the port to which the at least one cable is attached. Based on the comparison result, the switch device can generate one or more notifications. The notifications can indicate a match status of the at least one cable to the port.Type: GrantFiled: August 20, 2018Date of Patent: June 23, 2020Assignee: QUANTA COMPUTER INC.Inventors: Chao-Lan Huang, Tsu-Tai Kung, Hou-Lung Lin
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Publication number: 20200059710Abstract: Systems and methods are provided for determining whether an optical cable matches a port on a switch device. The present disclosure can provide for a switch device which includes a cable identification tool. The cable identification tool can be configured to receive a port configuration table from a management device. The switch device can then obtain features of at least one cable attached to a port of the switch device. The switch device can then compare the obtained features with a table entry in the port configuration table to yield a comparison result. The table entry can correspond to the port to which the at least one cable is attached. Based on the comparison result, the switch device can generate one or more notifications. The notifications can indicate a match status of the at least one cable to the port.Type: ApplicationFiled: August 20, 2018Publication date: February 20, 2020Inventors: Chao-Lan HUANG, Tsu-Tai KUNG, Hou-Lung LIN
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Patent number: 10230158Abstract: A method of making a housing includes providing a substrate having an opening, providing a plurality of metal sheets, providing a plurality of non-conductive members, and bonding the metal sheets together through the non-conductive members, forming a metal sheets member, placing the metal sheets member in the opening, bonding the metal sheets member with the substrate through the non-conductive members, and removing excess parts of the substrate to form the housing.Type: GrantFiled: July 25, 2017Date of Patent: March 12, 2019Assignees: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITEDInventors: Wei-Ben Chen, Min Liu, Chao-Hsun Lin, Chao Lan
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Publication number: 20170324152Abstract: A method of making a housing includes providing a substrate having an opening, providing a plurality of metal sheets, providing a plurality of non-conductive members, and bonding the metal sheets together through the non-conductive members, forming a metal sheets member, placing the metal sheets member in the opening, bonding the metal sheets member with the substrate through the non-conductive members, and removing excess parts of the substrate to form the housing.Type: ApplicationFiled: July 25, 2017Publication date: November 9, 2017Inventors: WEI-BEN CHEN, MIN LIU, CHAO-HSUN LIN, CHAO LAN
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Patent number: 9755297Abstract: A housing includes a substrate having an opening, a plurality of metal sheets and a plurality of non-conductive members, the metal sheets are bonded with each other through non-conductive members, forming a metal sheets member, the metal sheets member is located in the opening, the metal sheets member is bonded with substrate through the non-conductive members.Type: GrantFiled: April 21, 2015Date of Patent: September 5, 2017Assignees: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITEDInventors: Wei-Ben Chen, Min Liu, Chao-Hsun Lin, Chao Lan
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Publication number: 20160185067Abstract: A housing includes a substrate having an opening, a plurality of metal sheets and a plurality of non-conductive members, the metal sheets are bonded with each other through non-conductive members, forming a metal sheets member, the metal sheets member is located in the opening, the metal sheets member is bonded with substrate through the non-conductive members.Type: ApplicationFiled: April 21, 2015Publication date: June 30, 2016Inventors: WEI-BEN CHEN, MIN LIU, CHAO-HSUN LIN, CHAO LAN
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Publication number: 20070193876Abstract: A manufacturing method for sputtering an anti-refection layer onto a board at low temperature has the merits of easily being implemented and easily mass-produced. The manufacturing method is used for sputtering multiple anti-refection layers onto a board. The method can be used for mass-producing anti-reflection panels as the raw material for the photo industry. The method is superior to the manufacturing method for producing nebulization anti-reflection panels. This invention utilizes the anti-reflection characteristics of the board structure that is sputtered and stacked alternatively with high index refraction layers and low index refraction layers. A continuous manufacturing process is adopted. The present invention uses plasma to clean the surface of the boards and adopts a traditional sputtering machine. Therefore, it is convenient for installing and mass-producing high quality material.Type: ApplicationFiled: February 22, 2006Publication date: August 23, 2007Inventors: Jau-Jier Chu, Hsu-Fu Hung, I-Wen Lee, Chien-Min Weng, Chao-Lan Lee