Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: An electronic apparatus, which accommodates a chip card, includes a casing, a limit element and a carrier. The limit element is connected to the casing and has a protruding part. The carrier is slidingly disposed on the casing and has at least a contact area disposed on a side of the carrier. The limit element is located at a first position as the protruding part contacts the contact area, and the limit element is located at a second position as the protruding part is away from the contact area. The protruding part moves between the first position and the second position.

Abstract: An electronic apparatus, which accommodates a chip card, includes a casing, a limit element and a carrier. The limit element is connected to the casing and has a protruding part. The carrier is slidingly disposed on the casing and has at least a contact area disposed on a side of the carrier. The limit element is located at a first position as the protruding part contacts the contact area, and the limit element is located at a second position as the protruding part is away from the contact area. The protruding part moves between the first position and the second position.