Abstract: The present disclosure provides a multi-lingual model training method, apparatus, electronic device and readable storage medium and relates to the technical field of deep learning and natural language processing. A technical solution of the present disclosure when training the multi-lingual model is: obtaining training corpuses comprising a plurality of bilingual corpuses and a plurality of monolingual corpuses; training a multi-lingual model with a first training task by using the plurality of bilingual corpuses; training the multi-lingual model with a second training task by using the plurality of monolingual corpuses; and completing the training of the multi-lingual model in a case of determining that loss functions of the first training task and second training task converge.

Abstract: The present disclosure relates to the technical field of surveying and mapping building structures, in particular to a built-in gap measuring device and a gap measurement method. The built-in gap measuring device includes an adjustment mechanism and measuring mechanisms disposed on both sides of the adjustment mechanism. The adjustment mechanism can adjust the distance between two groups of measuring mechanisms, and the measuring mechanism includes a panel structure and a measuring column. The panel structure includes a bottom cover close to the adjustment mechanism and a top cover away from the adjustment mechanism. A plurality of rows of elastic column holes are arranged on the top cover in array, column seats in one-to-one correspondence with elastic column holes are arranged inside the panel structure in array.

Abstract: A heat sink is mounted to a PCB for thermal heat removal. The PCB is configured with plated through hole vias within a footprint of the heat sink. The plated through hole vias can include thermal via types and signal carrying via types. The signal carrying via types are landless vias on the PCB back side configured to eliminate physical and electrical contact between the plated through hole via and the heat sink. The landless via is configured by removing a conductive annular ring on the back side of the PCB, and then covering this area with an insulating material such as soldermask. The insulating material forms an insulation cap between the via side wall plating and the attached heat sink.