Patents by Inventor Chao Peng

Chao Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230063580
    Abstract: A display panel including a substrate, a metal structure at side of substrate, and first insulating layer, the metal structure and the first insulating layer located on a non-display region, the first insulating layer has hollow region, the hollow region extends through the first insulating layer in direction perpendicular to plane of substrate, where the metal structure includes first portion and second portion that are connected to each other. the first portion overlaps a hollow region and the second portion overlaps first insulating layer. The maximum distance between a part of a surface of a side of first portion away from substrate and substrate is a first distance, the maximum distance between a surface of a side of second portion away from the substrate and the substrate is a second distance, and the first distance is greater than the second distance.
    Type: Application
    Filed: November 8, 2022
    Publication date: March 2, 2023
    Applicant: WUHAN TIANMA MICROELECTRONICS CO., LTD.
    Inventors: Chao PENG, Chujie YU, Zhongjie ZHANG
  • Publication number: 20230047768
    Abstract: A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
    Type: Application
    Filed: November 2, 2022
    Publication date: February 16, 2023
    Inventors: YING-QIU ZHENG, CHAO PENG, XIAN-QIN HU
  • Publication number: 20230044090
    Abstract: The present disclosure provides a method for generating a code by a digital photo frame. The method including receiving, from the terminal and by a controller of the digital photo frame, a request for connecting the terminal to the digital photo frame; and generating, by the controller of the digital photo frame, a code according to authorization information of the digital photo frame, wherein a server issuing the authorization information of the digital photo frame does not generate the code. The present disclosure also provides a method for transmitting photos or videos between a terminal and a digital photo frame, the method comprising: receiving a request for transmitting the photos or the videos; determining whether the digital photo frame and the terminal use a same WLAN; and instructing the terminal or the digital photo frame to transmit the photos or the videos via the WLAN.
    Type: Application
    Filed: September 7, 2022
    Publication date: February 9, 2023
    Inventor: Chao Peng
  • Publication number: 20230007782
    Abstract: A manufacturing method of a circuit board includes: providing a first double-sided copper laminate including a dielectric layer, a first copper foil layer and a copper plating layer wherein the dielectric layer, wherein the dielectric layer defines a groove, the copper plating layer includes a first copper plating portion in the groove and a second copper plating portion beside the first copper plating portion. A double-sided circuit substrate including base layer and two first wiring layers is provided, wherein each first wiring layer includes a signal line. Conductive paste blocks are disposed in the base layer and on both sides of the signal line; and a first double-sided copper laminate is stacked on each side of the double-sided circuit substrate, disposing the signal line in the groove. The conductive paste blocks are pressed electrically connect same to the second copper plating portions. The present disclosure further provides a circuit board.
    Type: Application
    Filed: May 20, 2020
    Publication date: January 5, 2023
    Inventors: CHAO PENG, KE HE, CHIH-HUNG CHEN
  • Patent number: 11523517
    Abstract: A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: December 6, 2022
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Ying-Qiu Zheng, Chao Peng, Xian-Qin Hu
  • Patent number: 11477292
    Abstract: The present disclosure provides a method for sharing photos or videos with a digital photo frame, the method comprising receiving, by a server, an operation command for connecting at least one terminal to the digital photo frame; generating and transmitting, by the server, a code to the digital photo frame in response to the received operation command; determining, by the server, whether a code entered by the at least one terminal is matched with the generated code; connecting, by the server, the at least one terminal to the digital photo frame when determining that the code entered by the at least one terminal is matched with the generated code; and instructing, by the server, the digital photo frame to receive the photos or the videos from the at least one connected terminal.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: October 18, 2022
    Inventor: Chao Peng
  • Patent number: 11441636
    Abstract: A bearing assembly configured to be disposed on casing of electronic device and including plate body, first damping component, second damping component, first fastener and second fastener. The plate body includes first mounting hole and second mounting hole. The first damping component is disposed in the first mounting hole. The first damping component includes first hole. The second damping component is disposed in the second mounting hole. The second damping component includes second hole. The first fastener is disposed in the first hole of the first damping component and configured to be fixed to the casing of the electronic device. The second fastener is disposed in the second hole of the second damping component and configured to be fixed to the casing of the electronic device. A hardness of the first damping component is greater than a hardness of the second damping component.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: September 13, 2022
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Chi-Cheng Hsiao, Ying-Chao Peng, Chun-Ying Yang
  • Publication number: 20220190898
    Abstract: A device is provided, which includes one or more antennas and a circuit. The circuit is configured to receive a packet from a transmitter device through the antennas, and obtain channel-state information from the received packet. The circuit includes one or more filters to filter out or recognize the received packet that complies with one or more preset conditions. The circuit uses the channel-state information of the received packet, which complies with the one or more preset conditions, to estimate a status of a channel between the transmitter device and the device.
    Type: Application
    Filed: December 14, 2021
    Publication date: June 16, 2022
    Inventors: Chao-Peng WANG, Tsung-Han TSAI, Shun-Yong HUANG
  • Patent number: 11360832
    Abstract: An operation method of robot operating system and a robot control method are provided in this invention. The operation method of robot operating system includes steps of: monitoring an operating state of the Linux kernel through the security kernel when the security kernel and the Linux kernel of the robot operating system are both started; and hosting the Linux kernel through the security kernel when the Linux kernel runs abnormally or crashes. The technical scheme of the present invention is able to improve stability and safety of the robot operation.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: June 14, 2022
    Assignee: HGR INTERNATIONAL INSTITUTE FOR RESEARCH & INNOVATION
    Inventors: Fei Wang, Liang Ding, Kerui Xia, Zhenzhong Yu, Yanan Zhang, Qi Hou, Chao Peng, Taogeng Zhang, Xiaolong Li
  • Publication number: 20220159850
    Abstract: A supporting assembly configured to fix chassis of electronic device to fixing bracket. Supporting assembly includes plate body, cushion, fastener and spacer. Plate body includes mounting hole and wall surface forming mounting hole, and plate body is configured to be fixed to chassis of electronic device. Cushion is disposed through mounting hole and includes opening. Fastener is disposed through opening of cushion. A side of fastener is configured to be fixed to fixing bracket, and cushion is clamped between another side of fastener and fixing bracket so as to be compressed. Spacer is disposed in mounting hole and located between wall surface of plate body and cushion. Hardness of spacer is greater than hardness of cushion.
    Type: Application
    Filed: June 14, 2021
    Publication date: May 19, 2022
    Inventors: Chi-Cheng HSIAO, Ying-Chao PENG, Chun-Ying YANG
  • Patent number: 11332089
    Abstract: A supporting assembly configured to fix a casing of an electronic device to a chassis and including a plate body, a cushioning component and a fastener. The plate body includes a mounting hole. The cushioning component is disposed through the mounting hole. The cushioning component includes a through hole. The fastener is disposed through the through hole of the cushioning component. A side of the fastener is configured to be fixed to the chassis, and the cushioning component is compressed by another side of the fastener and the chassis.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: May 17, 2022
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Chi-Cheng Hsiao, Ying-Chao Peng, Chun-Ying Yang
  • Patent number: 11297508
    Abstract: Disclosed is a specific communication emitter identification method based on an instantaneous envelope equipotential constellation trace figure, including: selecting a specific communication emitter and acquiring its radio frequency signal fragment, performing instantaneous envelope extraction to the radio frequency fragment, and representing the instantaneous envelope with a constellation trace figure using a constellation trace figure two-dimensional visualization method, wherein the constellation trace figure serves as a radio frequency fingerprint of a transmitter, and inputting the radio frequency fingerprint into a classifier to identify. The disclosure overcomes drawbacks in conventional technologies.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: April 5, 2022
    Assignees: STATE GRID WUYI COUNTY POWER SUPPLY COMPANY, STATE GRID JINHUA POWER SUPPLY COMPANY
    Inventors: Hongliang Jiang, Shenhua Wang, Zhen Lin, Shaohua He, Yangyi Zheng, Xiaofang Fang, Yulong Ying, Qi Lv, Huaqing He, Xiangwei He, Hui Wu, Ting Wang, Baoliang Cao, Jun Cao, Chao Peng
  • Patent number: 11281482
    Abstract: A host machine includes a guest machine, a device emulator, and a hypervisor communicably coupled to the guest machine and the device emulator. The guest machine executes a non-real time thread that causes a non-real time I/O emulation by the device emulator. Responsive to receipt of a real time thread by the guest machine, the hypervisor determines whether the non-real time I/O emulation is abortable or non-abortable. If abortable, the hypervisor aborts the non-real time thread and causes the guest machine to execute the real time thread. Upon completing the execution of the real time thread, the hypervisor causes the guest machine to revert to a non-real time context based on a previous system snapshot. Upon establishing the non-real time context, the hypervisor causes the guest machine to execute the previously aborted non-real time thread.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: March 22, 2022
    Assignee: Intel Corporation
    Inventors: Yunhong Jiang, Chao Peng, Yao Zu Dong
  • Patent number: 11258372
    Abstract: The present invention disclosed a bridge rectifier comprising a first switching circuit, a second switching circuit, a third switching circuit, a fourth switching circuit, a first driving circuit, a second driving circuit, a third driving circuit, and a fourth driving circuit. The first driving circuit is electrically connected to the first switching circuit, the second driving circuit is electrically connected to the second switching circuit, the third driving circuit is electrically connected to the third switching circuit, the fourth driving circuit is electrically connected to the fourth switching circuit. In the disclosure, the bridge rectifier should be implemented by the combination of switch circuits with driving circuits. Such that the power dissipation of bridge rectifier could be significantly reduced to improve the function of the overall circuit due to the low impedance of the switching circuit in a closed state.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: February 22, 2022
    Assignees: Umberg Zipser LLP, LITE-ON Technology Corporation
    Inventors: Chao Peng, Yan Li, YaYun Liu, XiaoQiang Li
  • Publication number: 20220046802
    Abstract: A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
    Type: Application
    Filed: September 30, 2020
    Publication date: February 10, 2022
    Inventors: YING-QIU ZHENG, CHAO PENG, XIAN-QIN HU
  • Patent number: 11216025
    Abstract: The disclosure provides an adjustable fixing assembly. The adjustable fixing assembly includes a base plate and a cover plate. The cover plate includes a plate portion and a protrusion portion protruding from the plate portion. The cover plate includes a first installation position and a second installation position. When the cover plate is in the first installation position, the protrusion portion extends away from the base plate, and the cover plate is spaced apart from the base plate by a first minimum distance. When the cover plate is in the second installation position, the protrusion portion extends towards the base plate, and the cover plate is spaced apart from the base plate by a second minimum distance, where the second minimum distance is smaller than the first minimum distance.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: January 4, 2022
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Shiang-Chun Tsau, Chen-Wei Huang, Chun-Ying Yang, Ying-Chao Peng, Hsiang-Yun Lu, Tai-Yi Chiang
  • Patent number: D959157
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: August 2, 2022
    Inventor: Chao Peng
  • Patent number: D972573
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: December 13, 2022
    Inventor: Chao Peng
  • Patent number: D977483
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: February 7, 2023
    Inventor: Chao Peng
  • Patent number: D977484
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: February 7, 2023
    Inventor: Chao Peng