Abstract: The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elements, and affixing a reinforcement having apertures to accommodate solder joints to the top surface of the circuit board to facilitate solder attachment of the connection pads to the electronic elements wherein the reinforcement constrains deformation of the circuit board to provide reliable solder joints and facilitates attachment and removal of electronic elements from the circuit board.

Abstract: A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34), not in direct contact with the board (14), and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16).

Abstract: The present invention provides a method, article of manufacture, and optical package (24) for eliminating tilt angle (40) between an optical emitter (26) mounted on a carrier (28). The method, article of manufacture, and optical package (24) include a carrier (28) having a top surface (42) with a cavity (46) formed therein, an adhesive material (38) inserted into the cavity (46), and an optical emitter (26) placed on the top surface (42) of the carrier (28) and at least partially covering the cavity (46), thereby providing at least one egress point for overflowing said adhesive material therefrom.

Abstract: The present invention provides a low cost, efficient vertical cavity surface emitting laser package (300) and manufacturing method, the package having a head assembly having at least three leads, a vertical cavity surface emitting laser die bonded to a top surface of the head assembly, for generating a beam of light, and a photodiode, die bonded to the top surface of the head assembly proximate to the vertical cavity surface emitting laser for receiving at least a portion of the beam of light, and generating feedback for adjusting an electrical input current to the vertical cavity surface emitting laser based on a received optical power of the portion of the beam of light received. The vertical cavity surface emitting laser and the photodiode are injection molded in a predetermined shape with a recessed area for placement of a partially reflective holographic optical element/reflector.

Abstract: The present invention provides a method (600) and device (200,500) for providing temperature-stable optical feedback for optical packages. The device includes an optical emitter (202,502), a first partially reflective optical element (204, 504), a second partially reflective optical element (206,506), a first optical sensing unit (208,508), a second optical sensing unit (210,510), and a feedback unit (212). The optical emitter (202,502) is responsive to an electrical input current and generates a beam of light (214). The first optical sensing unit (208,508) and the second optical sensing unit (210,510) receive diffracted portions of the beam of light (214) from the first partially reflective optical element (204, 504) and the second partially reflective optical element (206,506) respectively and generate a first feedback signal E1 and a second feedback signal E2.

Abstract: The present invention provides a method (600) and device (400) for minimizing wind-induced noise in a microphone. The device includes: a housing (412) having a recessed area shaped to accommodate a microphone transducer (410); the microphone transducer (410), situated within the recessed area such that a thin film situated over the microphone transducer is flush with/overlaying a top of the recessed area and affixed at least to the sides of the recessed area, for receiving sound; and the thin film (402) has at least one aperture (404, . . . 406) for allowing sound to impinge on the microphone transducer (410), and has a minimal thickness that maintains structural integrity.

Abstract: Board delamination during the singulation from a board panel and board sagging during front-end assembly are two biggest problems encountered in cellular manufacturing lines. The method (700) and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs and v-groove configurations eliminate tearing/delamination and substantially reduce sagging.

Abstract: A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34) and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16).