Patents by Inventor Chao-Yuan Chan

Chao-Yuan Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical element driving mechanism having movable portion for holding lens
    Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Image capturing module for reducing assembly tilt
    Patent number: 9225887
    Abstract: An image capturing module for reducing assembly tilt includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The housing frame is disposed on the carrier substrate to surround the image sensing chip and downwardly contacts the image sensing chip. The actuator structure is disposed on the housing frame and above the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a lens assembly disposed inside the lens holder and downwardly contacting the housing frame. Whereby, the image sensing chip, the housing frame and the lens assembly are sequentially stacked on top of one another for reducing the assembly tilt of the lens assembly relative to the image sensing chip.
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: December 29, 2015
    Assignee: LITE-ON TECHNOLOGY CORPORATION
    Inventors: Po-Chih Hsu, Chao-Yuan Chan
  • Stack combination of plural chip package units
    Patent number: 7696619
    Abstract: A combination includes a first chip package unit and a second chip package unit on which the first chip package unit is placed. Each of the first and second chip package units includes a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces. The bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the surface of the second chip package unit. The chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces are configured as interface terminals of the combination.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: April 13, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Steven Webster, Ying-Cheng Wu, Chao-Yuan Chan, Shih-Min Lo
  • COMBINATION OF CHIP PACKAGE UNITS
    Publication number: 20090166837
    Abstract: A combination includes a first chip package unit and a second chip package unit on which the first chip package unit is placed. Each of the first and second chip package units includes a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces. The bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the surface of the second chip package unit. The chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces are configured as interface terminals of the combination.
    Type: Application
    Filed: March 31, 2008
    Publication date: July 2, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: STEVEN WEBSTER, YING-CHENG WU, CHAO-YUAN CHAN, SHIH-MIN LO