Patents by Inventor Chao Yuan Wang

Chao Yuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11995388
    Abstract: An integrated circuit includes a first active region of a first set of transistors of a first type, a second active region of a second set of transistors of the first type, a third active region of a third set of transistors of the first type, a fourth active region of a fourth set of transistors of the first type and a fifth active region of a fifth set of transistors of a second type. The first, second, fourth and fifth active region have a first width in a second direction, and are on a first level. The third active region is on the first level, and has a second width different from the first width. The second active region is adjacent to the first boundary, and is separated from the first active region in the second direction. The fourth active region is adjacent to the second boundary.
    Type: Grant
    Filed: May 15, 2023
    Date of Patent: May 28, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Sheng Wang, Chao Yuan Cheng, Chien-Chi Tien, Yangsyu Lin
  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Patent number: 11968817
    Abstract: A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jui-Lin Chen, Chao-Yuan Chang, Ping-Wei Wang, Fu-Kai Yang, Ting Fang, I-Wen Wu, Shih-Hao Lin
  • Publication number: 20220323455
    Abstract: The application describes fused heterocycle derivative compounds, pharmaceutical compositions comprising these compounds, chemical processes for preparing these compounds and their use in the treatment of diseases associated with HBV infection.
    Type: Application
    Filed: May 27, 2020
    Publication date: October 13, 2022
    Inventors: Scott D. KUDUK, Lindsey Graham DERATT, Chao-Yuan WANG, Jan Martin BERKE
  • Publication number: 20220089568
    Abstract: Disclosed are compounds, compositions and methods for treating diseases, disorders, or medical conditions that are affected by the modulation of DHODH. Such compounds are represented by Formula (I) as follows: wherein R1a, R1b, R2, and R3, are defined herein.
    Type: Application
    Filed: January 10, 2020
    Publication date: March 24, 2022
    Inventors: Justin Cisar, Scott Kuduk, Chao-yuan Wang, Yvan Rene Ferdinand Simonnet, Colleen Elizabeth Keohane, Edgar Jacoby
  • Publication number: 20180207901
    Abstract: The present invention provides a heat spreading structure comprising a first conductive layer and a composite layer that sequentially comprises a structured adhesive layer and a second conductive layer having a coating on the first conductive layer, wherein the structured adhesive layer comprises at least one polymeric region and at least one void region. The composite layer further has a grounding opening exposing a part of the first conductive layer for grounding purposes. The present invention also provides a heat spreading tape and a method for forming the same.
    Type: Application
    Filed: July 20, 2015
    Publication date: July 26, 2018
    Inventors: Pei Tien, Chao-Yuan Wang, Ching-Yi Liu
  • Patent number: 9353245
    Abstract: The present invention is a thermally conductive clay including a carrier oil, a dispersant, a styrene polyolefin copolymer and thermally conductive particles.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: May 31, 2016
    Assignee: 3M Innovative Properties Company
    Inventors: Pei Tien, Chao-Yuan Wang, Mei-Chin Liao, Wei-Yu Chen
  • Publication number: 20160120068
    Abstract: The present invention provides a heat spreading tape including at least one heat spreading layer adapted for heat dissipation and at least one heat insulating layer adhesively attached to the heat spreading layer. Void regions are formed in the at least one heat insulating layer and are adapted for acting as heat transfer barriers in a direction perpendicular to the major surfaces of the heat spreading tape, i.e. the thickness tape.
    Type: Application
    Filed: May 12, 2014
    Publication date: April 28, 2016
    Inventors: Pei Tien, Mihee Lee, Chao-Yuan Wang, Han-Yi Chung, Ching-Yi Liu, Kuo-Chung Lin, Wei-Yu Chen
  • Publication number: 20160046791
    Abstract: The present invention is a thermally conductive clay including a carrier oil, a dispersant, a styrene polyolefin copolymer and thermally conductive particles.
    Type: Application
    Filed: August 18, 2014
    Publication date: February 18, 2016
    Inventors: Pei Tien, Chao-Yuan Wang, Mei-Chin Liao, Wei-Yu Chen
  • Publication number: 20140240928
    Abstract: A thermally conductive grease includes a carrier oil, at least one dispersant, and thermally conductive particles. The thermally conductive particles have a D50 (Vol. Average) particle size of no greater than about 11 microns and the thermally conductive particles in the thermally conductive grease contain less than 3% by volume of particles having a particle size of 0.7 microns or less, based on the total volume of thermally conductive particles in the thermally conductive grease.
    Type: Application
    Filed: September 28, 2012
    Publication date: August 28, 2014
    Inventors: Pei Tien, Chia Hui Lin, Chao-Yuan Wang, Ravi K. Sura
  • Patent number: 5487018
    Abstract: A physical information database is utilized as an interface between a datapath cell library and a number of electronic design automation tools, such as a datapath synthesis tool, a chip estimator, an HDL generation tool, and a datapath compilation tool. The physical information database includes global parameters applicable to every cell in the datapath cell library and local parameters defining attributes that are associated with individual cells in the datapath cell library. The physical information database includes a standard format allowing uniform access by the electronic design automation tools.
    Type: Grant
    Filed: August 13, 1993
    Date of Patent: January 23, 1996
    Assignee: VLSI Technology, Inc.
    Inventors: Joann Loos, Chao-Yuan Wang, Mossaddeg Mahmood
  • Patent number: D439895
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: April 3, 2001
    Assignee: Enlight Corporation
    Inventor: Chao Yuan Wang
  • Patent number: D692011
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: October 22, 2013
    Assignee: Esoterism Co. Ltd.
    Inventors: Da-chung Wu, An-Tung Su, Chih-Yao Lin, Chao-Yuan Wang